H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2006
03/28/2006	US7019343 SnO2 ISFET device, manufacturing method, and methods and apparatus for use thereof
03/28/2006	US7019338 Subscriber interface protection circuit
03/28/2006	US7019337 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor
03/28/2006	US7019293 Position detecting system and method
03/28/2006	US7019223 Solder resist opening to define a combination pin one indicator and fiducial
03/28/2006	US7018935 Method of forming metal line of semiconductor device
03/28/2006	US7018921 Method of forming metal line in semiconductor device
03/28/2006	US7018920 Composite sacrificial material
03/28/2006	US7018919 Method of manufacturing a semiconductor integrated circuit device including a hole formed in an insulating film and a first conductive film formed over a bottom region and sidewalls of the hole
03/28/2006	US7018917 Multilayer metallization
03/28/2006	US7018916 Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber
03/28/2006	US7018896 UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processing
03/28/2006	US7018878 Metal structures for integrated circuits and methods for making the same
03/28/2006	US7018871 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
03/28/2006	US7018870 Laser diode and heatsink quick connect/disconnect assembly
03/28/2006	US7018869 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
03/28/2006	US7018866 Circuit component built-in module with embedded semiconductor chip and method of manufacturing
03/28/2006	US7018856 Calibration standards for dopants/impurities in silicon and preparation method
03/28/2006	US7018844 Non-contact data carrier and method of fabricating the same
03/28/2006	US7018718 Adhesive film for underfill and semiconductor device using the same
03/28/2006	US7018701 Thermally conductive sheet and method for manufacturing the same
03/28/2006	US7018678 Electronic device manufacture
03/28/2006	US7018575 Method for assembly of complementary-shaped receptacle site and device microstructures
03/28/2006	US7018494 Method of producing a composite sheet and method of producing a laminate by using the composite sheet
03/28/2006	US7018218 Device for controlling a vehicle
03/28/2006	US7018175 Airflow guiding structure for a heat dissipation fan
03/28/2006	US7018020 Structure with through hole, production method thereof, and liquid discharge head
03/28/2006	US7017821 Individual configuration
03/28/2006	US7017662 High temperature environment tool system and method
03/28/2006	US7017655 Forced fluid heat sink
03/28/2006	US7017654 Apparatus and method of forming channels in a heat-exchanging device
03/28/2006	US7017653 Heat sink clip mechanism
03/28/2006	US7017651 Method and apparatus for temperature gradient control in an electronic system
03/28/2006	US7017638 Forming folded-stack packaged device using vertical progression folding tool
03/28/2006	US7017258 Mounting system for high-mass heatsinks
03/28/2006	CA2347568C Circuit board and method of manufacturing a circuit board
03/23/2006	WO2006031886A2 Power semiconductor package
03/23/2006	WO2006031235A1 Method for preapplying underfill to a microelectronic packaging and microelectronic packages formed thereby
03/23/2006	WO2006030676A1 Aluminum-silicon carbide composite
03/23/2006	WO2006030611A1 Function element mounting module and manufacturing method thereof
03/23/2006	WO2006029970A1 Audio processing device with encapsulated electronic component.
03/23/2006	WO2006007144A9 Scribe street structure in semiconductor wafer
03/23/2006	WO2006000993A3 High frequency transistor layout for low source drain capacitance
03/23/2006	WO2005119800A3 Thermoelectric nano-wire devices
03/23/2006	WO2005117106A3 Heat sink assembly
03/23/2006	WO2005086237A3 Ldmos transistor and method of making the same
03/23/2006	US20060064191 Semiconductor device and semiconductor production management system
03/23/2006	US20060063377 Methods for creating electrophoretically insulated vias in semiconductive substrates
03/23/2006	US20060063374 Post passivation interconnection schemes on top of the IC chips
03/23/2006	US20060063366 Circuit-connecting material and circuit terminal connected structure and connecting method
03/23/2006	US20060063365 Aluminum cap for reducing scratch and wire-bond bridging of bond pads
03/23/2006	US20060063363 Semiconductor structures
03/23/2006	US20060063325 Embedded capacitor structure in circuit board and method for fabricating the same
03/23/2006	US20060063305 Process of fabricating flip-chip packages
03/23/2006	US20060063304 Structure and method of high performance two layer ball grid array substrate
03/23/2006	US20060063303 Packaging method, packaging structure and package substrate for electronic parts
03/23/2006	US20060063292 Method for producing a packaged integrated circuit
03/23/2006	US20060063283 Stacked die module and techniques for forming a stacked die module
03/23/2006	US20060063074 Thin-film battery having ultra-thin electrolyte
03/23/2006	US20060063021 Fuel with high carbon content, high sulphur content, and low ash content such as petroleum coke, grades of anthracite, coal and natural gas; pressurised fluidised bed combustor and carbonator; environmentally friendly
03/23/2006	US20060062979 Circuit board and a power module employing the same
03/23/2006	US20060061974 Solder foil semiconductor device and electronic device
03/23/2006	US20060061966 Method and apparatus for dissipating heat from an electronic device
03/23/2006	US20060061965 Semiconductor device
03/23/2006	US20060061936 Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device
03/23/2006	US20060061019 suppressing deformation at firing; laminating ceramic green layers containing ceramic powder, and first and second shrink-suppressing layers formed on one main surface and the other main surface of the multilayer mother substrate and containing a sintering-difficulty powder, forming grooves, firing
03/23/2006	US20060060988 System and method for high performance heat sink for multiple chip devices
03/23/2006	US20060060987 High performance amine based no-flow underfill materials for flip chip applications
03/23/2006	US20060060986 Semiconductor memory device and power line arrangement method thereof
03/23/2006	US20060060984 Semiconductor device packaged into chip size and manufacturing method thereof
03/23/2006	US20060060983 Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
03/23/2006	US20060060982 Power semiconductor module and method of manufacturing the same
03/23/2006	US20060060981 Production methods for a leadframe and electronic devices
03/23/2006	US20060060980 Ic package having ground ic chip and method of manufacturing same
03/23/2006	US20060060979 Radiant energy heating for die attach
03/23/2006	US20060060977 Semiconductor device
03/23/2006	US20060060976 Integrated circuit comprising copper lines and process for forming copper lines
03/23/2006	US20060060975 Heat activated adhesive between polymeric films selected from polyesters, polyethylene terephthalate, polyvinyl fluoride, polyethylene, polyimide, and/or polyethylene naphthalate
03/23/2006	US20060060974 Polishing composition and process for producing wiring structure using it
03/23/2006	US20060060973 Post passivation interconnection schemes on top of the IC chips
03/23/2006	US20060060972 Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same
03/23/2006	US20060060971 Method and structure for reducing contact resistance in dual damascene structure for the manufacture of semiconductor devices
03/23/2006	US20060060970 Interconnection structure of integrated circuit chip
03/23/2006	US20060060969 Electronic circuit including circuit-connecting material
03/23/2006	US20060060968 Projected contact structures for engaging bumped semiconductor devices and methods of making the same
03/23/2006	US20060060967 Novel pad structure to prompt excellent bondability for low-k intermetal dielectric layers
03/23/2006	US20060060966 Selectively-etched nanochannel electophoretic and electrochemical devices
03/23/2006	US20060060965 Semiconductor device having a switch circuit
03/23/2006	US20060060964 Method and apparatus for high temperature operation of electronics
03/23/2006	US20060060963 Heat dissipation for chip-on-chip IC packages
03/23/2006	US20060060962 Electronic package having a folded package substrate
03/23/2006	US20060060961 Chip structure
03/23/2006	US20060060959 Semiconductor device
03/23/2006	US20060060958 Semiconductor package, and fabrication method and carrier thereof
03/23/2006	US20060060957 Module assembly and method for stacked BGA packages
03/23/2006	US20060060956 Materials, structures and methods for microelectronic packaging
03/23/2006	US20060060955 Stacked die infrared transceiver bus
03/23/2006	US20060060954 Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
03/23/2006	US20060060953 Semiconductor device package
03/23/2006	US20060060952 Heat spreader for non-uniform power dissipation

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