Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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03/29/2006 | EP1639640A1 Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink |
03/29/2006 | EP1639634A1 Electronic device, assembly and methods of manufacturing an electronic device |
03/29/2006 | EP1639628A2 Heat transfer device and method of making same |
03/29/2006 | EP1639301A1 Cooling device of thin plate type for preventing dry-out |
03/29/2006 | EP1153419B1 Multiple chip module with integrated rf capabilities |
03/29/2006 | EP1070677B1 Microcap wafer-level package |
03/29/2006 | EP0844663B1 Method for manufacturing a circuit member for a semiconductor device |
03/29/2006 | CN2768206Y Solar battery assembly wiring box |
03/29/2006 | CN2768204Y Heat radiation structure of water cooler |
03/29/2006 | CN2768203Y Alterable rigid heat conducting base plate for setting anamorphic suppression structure |
03/29/2006 | CN2768202Y Fastener and heat sink using the same |
03/29/2006 | CN2768201Y Power semiconductor device housing |
03/29/2006 | CN2768074Y Heat exchanger structure |
03/29/2006 | CN1754410A Industrial Ethernet switch |
03/29/2006 | CN1754285A Dielectric sheet |
03/29/2006 | CN1754260A Battery-mounted integrated circuit device |
03/29/2006 | CN1754258A Integrated electronic component having specifically produced nanotubes in vertical structures |
03/29/2006 | CN1754255A Self-supporting contacting structures that are directly produced on components without housings |
03/29/2006 | CN1754254A Semiconductor device and radiation detector employing it |
03/29/2006 | CN1754010A Surface-treated al sheet excellent in solderability, heat sink using the same, and method for producing surface-treated al sheet excellent in solderability |
03/29/2006 | CN1753966A Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device |
03/29/2006 | CN1753608A Heat-transfer devices |
03/29/2006 | CN1753181A Prossure fixing mechanism of series thyristor valve set |
03/29/2006 | CN1753178A Packaging structure of contact type sensor and its manufacturing method |
03/29/2006 | CN1753177A Power semiconductor module and method of manufacturing the same |
03/29/2006 | CN1753176A Inversion packaging structure, semiconductor chip having convex block and its manufacturing method |
03/29/2006 | CN1753175A Semiconductor packaging structure and its manufacturing method |
03/29/2006 | CN1753174A External pin less packaging structure |
03/29/2006 | CN1753173A Water delivery and distribution pipeline system of standing reactive compensator thyristor velve set |
03/29/2006 | CN1753172A Manufacturing method of heat radiation device |
03/29/2006 | CN1753171A Thermally conductive sheet and method for producing the same |
03/29/2006 | CN1753170A Optical semiconductor device, optical communication device, and electronic equipment |
03/29/2006 | CN1753169A Electronic device and method for fabricating the same |
03/29/2006 | CN1753166A Semiconductor device and mfg. method thereof and electric appliance |
03/29/2006 | CN1753159A Integrated wiring and inverse packaged chip structure and process |
03/29/2006 | CN1753158A Shaping method of back gum layer of face down chip |
03/29/2006 | CN1753157A Ic package and method of manufacturing same |
03/29/2006 | CN1248561C Fan circuit board and fan structure using said fan circuit board |
03/29/2006 | CN1248558C High-frequency device |
03/29/2006 | CN1248552C Printed circuit board with improved pad structure |
03/29/2006 | CN1248317C Semiconductor device and manufacture thereof |
03/29/2006 | CN1248310C Electrostatic discharge protective circuit having high trigger current |
03/29/2006 | CN1248309C 半导体装置 Semiconductor device |
03/29/2006 | CN1248308C Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device |
03/29/2006 | CN1248307C Semiconductor device producing method |
03/29/2006 | CN1248306C DRAM fabricated on a silicon-on-insulator (SOI) substrate having bi-level digit lines |
03/29/2006 | CN1248287C Method for producing semiconductor equipment |
03/29/2006 | CN1248244C Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat disspation work |
03/29/2006 | CN1248036C Semiconductor component and display screen module therewith |
03/29/2006 | CN1248030C Film forming method and apparatus, method and apparatus for producing base plate and electronic equipment |
03/29/2006 | CN1247700C Heat conducting siloxane composite and heat dissipating structure with the composite |
03/29/2006 | CN1247651C Resin composition for optical-semiconductor encapsulation |
03/28/2006 | US7020859 Process skew results for integrated circuits |
03/28/2006 | US7020577 measuring layer density via buoyancy to determine dielectric constant; statistical process control |
03/28/2006 | US7020322 Component-mounting method and component-mounting apparatus |
03/28/2006 | US7020174 Laser diode module for optical communication |
03/28/2006 | US7019981 Making contact with semiconductor chips in chip cards |
03/28/2006 | US7019979 Heat dissipating device having improved fastening structure |
03/28/2006 | US7019978 Heat dissipating device incorporating clip |
03/28/2006 | US7019977 Method of attaching non-adhesive thermal interface materials |
03/28/2006 | US7019975 Power module and power module with heat sink |
03/28/2006 | US7019973 Circuit cooling apparatus |
03/28/2006 | US7019972 Apparatus for conditioning power and managing thermal energy in an electronic device |
03/28/2006 | US7019971 Thermal management systems for micro-components |
03/28/2006 | US7019970 Cooling device capable of reducing thickness of electronic apparatus |
03/28/2006 | US7019968 Cooling apparatus having an electronic fan for cooling an electronic apparatus |
03/28/2006 | US7019598 Integrated VCO having an improved tuning range over process and temperature variations |
03/28/2006 | US7019593 Variable-gain cascode amplifier using voltage-controlled and variable inductive load |
03/28/2006 | US7019410 Die attach material for TBGA or flexible circuitry |
03/28/2006 | US7019409 Circuit device |
03/28/2006 | US7019408 Stackable ball grid array |
03/28/2006 | US7019407 Flip chip package structure |
03/28/2006 | US7019406 Thermally enhanced semiconductor package |
03/28/2006 | US7019405 Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufacturing method |
03/28/2006 | US7019404 Multilayered circuit substrate, semiconductor device and method of producing same |
03/28/2006 | US7019403 Adhesive film and tacking pads for printed wiring assemblies |
03/28/2006 | US7019402 Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor |
03/28/2006 | US7019401 Multi-layer substrate structure for reducing layout area |
03/28/2006 | US7019400 Semiconductor device having multilayer interconnection structure and method for manufacturing the device |
03/28/2006 | US7019399 Copper diffusion barriers made of diamond-like nanocomposits doped with metals |
03/28/2006 | US7019398 Semiconductor device |
03/28/2006 | US7019397 Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device |
03/28/2006 | US7019396 Electronic chip component and method for manufacturing electronic chip component |
03/28/2006 | US7019395 Double-sided cooling type semiconductor module |
03/28/2006 | US7019394 Circuit package and method of plating the same |
03/28/2006 | US7019393 Electric circuit substrate |
03/28/2006 | US7019392 Storage apparatus, card type storage apparatus, and electronic apparatus |
03/28/2006 | US7019391 NANO IC packaging |
03/28/2006 | US7019390 Silicon nitride insulating substrate for power semiconductor module |
03/28/2006 | US7019389 Lead frame and semiconductor package with the same |
03/28/2006 | US7019388 Semiconductor device |
03/28/2006 | US7019387 Lead-frame connector and circuit module assembly |
03/28/2006 | US7019386 Siloxane epoxy polymers for low-k dielectric applications |
03/28/2006 | US7019385 Semiconductor device and method of fabricating same |
03/28/2006 | US7019382 Arrangement for ESD protection of an integrated circuit |
03/28/2006 | US7019368 Low-capacitance input/output and electrostatic discharge circuit for protecting an integrated circuit from electrostatic discharge |
03/28/2006 | US7019367 Integrated circuit |
03/28/2006 | US7019366 Electrostatic discharge performance of a silicon structure and efficient use of area with electrostatic discharge protective device under the pad approach and adjustment of via configuration thereto to control drain junction resistance |
03/28/2006 | US7019362 Power MOSFET with reduced dgate resistance |
03/28/2006 | US7019346 Capacitor having an anodic metal oxide substrate |