Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2006
03/29/2006EP1639640A1 Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink
03/29/2006EP1639634A1 Electronic device, assembly and methods of manufacturing an electronic device
03/29/2006EP1639628A2 Heat transfer device and method of making same
03/29/2006EP1639301A1 Cooling device of thin plate type for preventing dry-out
03/29/2006EP1153419B1 Multiple chip module with integrated rf capabilities
03/29/2006EP1070677B1 Microcap wafer-level package
03/29/2006EP0844663B1 Method for manufacturing a circuit member for a semiconductor device
03/29/2006CN2768206Y Solar battery assembly wiring box
03/29/2006CN2768204Y Heat radiation structure of water cooler
03/29/2006CN2768203Y Alterable rigid heat conducting base plate for setting anamorphic suppression structure
03/29/2006CN2768202Y Fastener and heat sink using the same
03/29/2006CN2768201Y Power semiconductor device housing
03/29/2006CN2768074Y Heat exchanger structure
03/29/2006CN1754410A Industrial Ethernet switch
03/29/2006CN1754285A Dielectric sheet
03/29/2006CN1754260A Battery-mounted integrated circuit device
03/29/2006CN1754258A Integrated electronic component having specifically produced nanotubes in vertical structures
03/29/2006CN1754255A Self-supporting contacting structures that are directly produced on components without housings
03/29/2006CN1754254A Semiconductor device and radiation detector employing it
03/29/2006CN1754010A Surface-treated al sheet excellent in solderability, heat sink using the same, and method for producing surface-treated al sheet excellent in solderability
03/29/2006CN1753966A Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
03/29/2006CN1753608A Heat-transfer devices
03/29/2006CN1753181A Prossure fixing mechanism of series thyristor valve set
03/29/2006CN1753178A Packaging structure of contact type sensor and its manufacturing method
03/29/2006CN1753177A Power semiconductor module and method of manufacturing the same
03/29/2006CN1753176A Inversion packaging structure, semiconductor chip having convex block and its manufacturing method
03/29/2006CN1753175A Semiconductor packaging structure and its manufacturing method
03/29/2006CN1753174A External pin less packaging structure
03/29/2006CN1753173A Water delivery and distribution pipeline system of standing reactive compensator thyristor velve set
03/29/2006CN1753172A Manufacturing method of heat radiation device
03/29/2006CN1753171A Thermally conductive sheet and method for producing the same
03/29/2006CN1753170A Optical semiconductor device, optical communication device, and electronic equipment
03/29/2006CN1753169A Electronic device and method for fabricating the same
03/29/2006CN1753166A Semiconductor device and mfg. method thereof and electric appliance
03/29/2006CN1753159A Integrated wiring and inverse packaged chip structure and process
03/29/2006CN1753158A Shaping method of back gum layer of face down chip
03/29/2006CN1753157A Ic package and method of manufacturing same
03/29/2006CN1248561C Fan circuit board and fan structure using said fan circuit board
03/29/2006CN1248558C High-frequency device
03/29/2006CN1248552C Printed circuit board with improved pad structure
03/29/2006CN1248317C Semiconductor device and manufacture thereof
03/29/2006CN1248310C Electrostatic discharge protective circuit having high trigger current
03/29/2006CN1248309C 半导体装置 Semiconductor device
03/29/2006CN1248308C Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device
03/29/2006CN1248307C Semiconductor device producing method
03/29/2006CN1248306C DRAM fabricated on a silicon-on-insulator (SOI) substrate having bi-level digit lines
03/29/2006CN1248287C Method for producing semiconductor equipment
03/29/2006CN1248244C Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat disspation work
03/29/2006CN1248036C Semiconductor component and display screen module therewith
03/29/2006CN1248030C Film forming method and apparatus, method and apparatus for producing base plate and electronic equipment
03/29/2006CN1247700C Heat conducting siloxane composite and heat dissipating structure with the composite
03/29/2006CN1247651C Resin composition for optical-semiconductor encapsulation
03/28/2006US7020859 Process skew results for integrated circuits
03/28/2006US7020577 measuring layer density via buoyancy to determine dielectric constant; statistical process control
03/28/2006US7020322 Component-mounting method and component-mounting apparatus
03/28/2006US7020174 Laser diode module for optical communication
03/28/2006US7019981 Making contact with semiconductor chips in chip cards
03/28/2006US7019979 Heat dissipating device having improved fastening structure
03/28/2006US7019978 Heat dissipating device incorporating clip
03/28/2006US7019977 Method of attaching non-adhesive thermal interface materials
03/28/2006US7019975 Power module and power module with heat sink
03/28/2006US7019973 Circuit cooling apparatus
03/28/2006US7019972 Apparatus for conditioning power and managing thermal energy in an electronic device
03/28/2006US7019971 Thermal management systems for micro-components
03/28/2006US7019970 Cooling device capable of reducing thickness of electronic apparatus
03/28/2006US7019968 Cooling apparatus having an electronic fan for cooling an electronic apparatus
03/28/2006US7019598 Integrated VCO having an improved tuning range over process and temperature variations
03/28/2006US7019593 Variable-gain cascode amplifier using voltage-controlled and variable inductive load
03/28/2006US7019410 Die attach material for TBGA or flexible circuitry
03/28/2006US7019409 Circuit device
03/28/2006US7019408 Stackable ball grid array
03/28/2006US7019407 Flip chip package structure
03/28/2006US7019406 Thermally enhanced semiconductor package
03/28/2006US7019405 Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufacturing method
03/28/2006US7019404 Multilayered circuit substrate, semiconductor device and method of producing same
03/28/2006US7019403 Adhesive film and tacking pads for printed wiring assemblies
03/28/2006US7019402 Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor
03/28/2006US7019401 Multi-layer substrate structure for reducing layout area
03/28/2006US7019400 Semiconductor device having multilayer interconnection structure and method for manufacturing the device
03/28/2006US7019399 Copper diffusion barriers made of diamond-like nanocomposits doped with metals
03/28/2006US7019398 Semiconductor device
03/28/2006US7019397 Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device
03/28/2006US7019396 Electronic chip component and method for manufacturing electronic chip component
03/28/2006US7019395 Double-sided cooling type semiconductor module
03/28/2006US7019394 Circuit package and method of plating the same
03/28/2006US7019393 Electric circuit substrate
03/28/2006US7019392 Storage apparatus, card type storage apparatus, and electronic apparatus
03/28/2006US7019391 NANO IC packaging
03/28/2006US7019390 Silicon nitride insulating substrate for power semiconductor module
03/28/2006US7019389 Lead frame and semiconductor package with the same
03/28/2006US7019388 Semiconductor device
03/28/2006US7019387 Lead-frame connector and circuit module assembly
03/28/2006US7019386 Siloxane epoxy polymers for low-k dielectric applications
03/28/2006US7019385 Semiconductor device and method of fabricating same
03/28/2006US7019382 Arrangement for ESD protection of an integrated circuit
03/28/2006US7019368 Low-capacitance input/output and electrostatic discharge circuit for protecting an integrated circuit from electrostatic discharge
03/28/2006US7019367 Integrated circuit
03/28/2006US7019366 Electrostatic discharge performance of a silicon structure and efficient use of area with electrostatic discharge protective device under the pad approach and adjustment of via configuration thereto to control drain junction resistance
03/28/2006US7019362 Power MOSFET with reduced dgate resistance
03/28/2006US7019346 Capacitor having an anodic metal oxide substrate