| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/04/2006 | US7021368 Heat dissipating device with uniform heat points |
| 04/04/2006 | US7021367 Liquid cooling jacket |
| 04/04/2006 | US7021365 Component to heat sink spring clip method and apparatus |
| 04/04/2006 | US7020961 Method for manufacturing a bump-attached wiring circuit board |
| 04/04/2006 | US7020958 Methods forming an integrated circuit package with a split cavity wall |
| 03/30/2006 | WO2006033465A1 Semiconductor device and method for manufacturing the same, and treatment liquid |
| 03/30/2006 | WO2006033073A1 Analogue measurement of alignment between layers of a semiconductor device |
| 03/30/2006 | WO2006032823A2 Generating an integrated circuit identifier |
| 03/30/2006 | WO2006032726A1 Method for assembling an opto-electric module and a structure of an opto-electric module |
| 03/30/2006 | WO2006032250A1 Semi-conductor component provided with through contacts which pass through plastic housing material and method for the production thereof |
| 03/30/2006 | WO2006016367A3 Semiconductor cooling system and process for manufacturing the same |
| 03/30/2006 | WO2005094244A3 System, method and apparatus for self-cleaning dry etch |
| 03/30/2006 | WO2005048298A3 Sandwiched thermal solution |
| 03/30/2006 | WO2005034177A3 Lead frame with flag support structure |
| 03/30/2006 | US20060068574 Post passivation interconnection schemes on top of the IC Chips |
| 03/30/2006 | US20060068570 Structure with through hole, production method thereof, and liquid discharge head |
| 03/30/2006 | US20060068533 Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic system |
| 03/30/2006 | US20060068523 Integrated circuit package |
| 03/30/2006 | US20060068522 Semiconductor device with improved heat dissipation, and a method of making semiconductor device |
| 03/30/2006 | US20060068080 Combinatorial discovery of nanomaterials |
| 03/30/2006 | US20060067051 Lateral airflow fan-sink for electronic devices |
| 03/30/2006 | US20060067034 Integrated ultracapacitor as energy source |
| 03/30/2006 | US20060066434 Thermal switch, methods of use and manufacturing methods for same |
| 03/30/2006 | US20060066416 Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package |
| 03/30/2006 | US20060066327 Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process |
| 03/30/2006 | US20060065985 Substrate edge scribe |
| 03/30/2006 | US20060065984 Package stress management |
| 03/30/2006 | US20060065983 Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits |
| 03/30/2006 | US20060065982 Semiconductor device |
| 03/30/2006 | US20060065981 Semiconductor device and method for producing same |
| 03/30/2006 | US20060065980 Semiconductor device |
| 03/30/2006 | US20060065979 Semiconductor device and manufacturing method thereof |
| 03/30/2006 | US20060065978 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same |
| 03/30/2006 | US20060065977 Reliable printed wiring board assembly employing packages with solder joints and related assembly technique |
| 03/30/2006 | US20060065976 Method for manufacturing wafer level chip scale package structure |
| 03/30/2006 | US20060065975 Input/output routing on an electronic device |
| 03/30/2006 | US20060065974 Reactive gettering in phase change solders to inhibit oxidation at contact surfaces |
| 03/30/2006 | US20060065973 Gap-change sensing through capacitive techniques |
| 03/30/2006 | US20060065972 Die down ball grid array packages and method for making same |
| 03/30/2006 | US20060065971 Electronic circuit packages |
| 03/30/2006 | US20060065970 Radiating fin and method for manufacturing the same |
| 03/30/2006 | US20060065969 Reinforced bond pad for a semiconductor device |
| 03/30/2006 | US20060065968 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 03/30/2006 | US20060065967 Apparatus for singulating and bonding semiconductor chips, and method for the same |
| 03/30/2006 | US20060065966 Semiconductor package with crossing conductor assembly and method of manufacture |
| 03/30/2006 | US20060065965 Multi-terminal device and printed wiring board |
| 03/30/2006 | US20060065964 Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor |
| 03/30/2006 | US20060065963 Electronic device |
| 03/30/2006 | US20060065962 Control circuitry in stacked silicon |
| 03/30/2006 | US20060065961 Integrated lid formed on mems device |
| 03/30/2006 | US20060065960 Display device and manufacturing method thereof |
| 03/30/2006 | US20060065959 Chip package |
| 03/30/2006 | US20060065958 Three dimensional package and packaging method for integrated circuits |
| 03/30/2006 | US20060065957 Light emitting diode device |
| 03/30/2006 | US20060065956 COF flexible printed wiring board and method of producing the wiring board |
| 03/30/2006 | US20060065955 Method for forming wiring pattern, wiring pattern, and electronic apparatus |
| 03/30/2006 | US20060065953 Semiconductor die with protective layer and related method of processing a semiconductor wafer |
| 03/30/2006 | US20060065941 Encapsulation component for integrated micro electromechanical systems and fabrication process of the component |
| 03/30/2006 | US20060065933 ESD protection circuit with floating diffusion regions |
| 03/30/2006 | US20060065931 ESD protection for high voltage applications |
| 03/30/2006 | US20060065918 Semiconductor device and method of fabricating the same |
| 03/30/2006 | US20060065746 Semiconductor memory device |
| 03/30/2006 | US20060065625 Periodic patterns and technique to control misalignment between two layers |
| 03/30/2006 | US20060065385 Heat transport apparatus and heat transport apparatus manufacturing method |
| 03/30/2006 | US20060064999 Determining the thermal influence of components within a system and usage of a matrix for power and thermal management |
| 03/30/2006 | DE202005020280U1 Heat sink fastener for use with central processing unit, has hub, two positioning units including respective clamps with clamping ends and fastening ends, and two bars provided between clamps of respective positioning units |
| 03/30/2006 | DE19956565B4 Verfahren zum Herstellen einer Wärmesenke für elektrische Bauelemente A method for manufacturing a heat sink for electrical components |
| 03/30/2006 | DE19704351B4 Leiterrahmen und Montagevorbereitungsverfahren für einen Leiterrahmen Ladder frame and mounting method for preparing a lead frame |
| 03/30/2006 | DE19704149B4 Verfahren zum Herstellen einer Metallverdrahtung an einem Halbleiterbauteil sowie nach diesem Verfahren hergestellte Metallverdrahtung A method of manufacturing a metal wiring of a semiconductor component produced by this process as well as metal wiring |
| 03/30/2006 | DE19619921B4 Verfahren zum Herstellen einer Halbleitervorrichtung mit Funktionselement und Schutzkappe A method of manufacturing a semiconductor device having a functional element and cap |
| 03/30/2006 | DE19539340B4 Elektronische Eingangs- oder Ausgangspuffer-Schaltung mit MOS-Transistor mit mehreren schleifenförmigen Zellen Electronic input or output buffer circuit with MOS transistor with multiple loop-shaped cells |
| 03/30/2006 | DE10345471B4 Justiermarke zur Grobjustage und Feinjustage eines Halbleiterwafers in einem Belichtungsgerät Alignment marks for coarse adjustment and fine tuning of a semiconductor wafer in an exposure apparatus |
| 03/30/2006 | DE102005045697A1 Semiconductor memory has pad power lines arranged below lower pads in direction crossing pad structures to interconnect pad structures transmitting same level of electrical power |
| 03/30/2006 | DE102005045661A1 Mikroelektronischer Bauelementchip und Herstellungsverfahren, Packung und LCD-Vorrichtung Microelectronic component chip and manufacturing process, pack and LCD device |
| 03/30/2006 | DE102005040342A1 Halbleitervorrichtung Semiconductor device |
| 03/30/2006 | DE102005037488A1 Cooling system for electronic systems used with such as motors has different sectors to provide correct temperature |
| 03/30/2006 | DE102005027267A1 Protective cap for light-emitting diodes and laser diodes is made from a polysulfone, polyethersulfone or polyphenylsulfone |
| 03/30/2006 | DE102005027266A1 Casing or encapsulation for electrical or electronic components, especially a light-emitting diode or laser diode comprises a plastic housing made from a polysulfone, polyethersulfone or polyphenylsulfone |
| 03/30/2006 | DE102005010926A1 Deckel für optoelektronische Wafermaßstabsgehäuse Cover for optoelectronic wafer-scale housing |
| 03/30/2006 | DE102004047182A1 Elektronisches Gerät mit einem mehrschichtigen Keramiksubstrat An electronic device with a multi-layer ceramic substrate |
| 03/30/2006 | DE102004045467A1 Feldeffekt-Trenchtransistor Field effect trench transistor |
| 03/30/2006 | DE102004044603A1 Surface mountable semiconductor component comprises plastic housing with solder contacts, and covering material |
| 03/30/2006 | DE102004044141A1 Halbleiteranordnung zur Spannungsbegrenzung A semiconductor device for limiting the voltage |
| 03/30/2006 | DE102004041961B3 Integrierte Halbleiterschaltung mit integrierter Kapazität zwischen Kontaktanscluss und Substrat und Verfahren zu ihrer Herstellung A semiconductor integrated circuit with an integrated capacitance between Kontaktanscluss and substrate and methods for their preparation |
| 03/30/2006 | DE10035564B4 Mikromechanisches Gehäuse Micromechanical housing |
| 03/30/2006 | DE10028014B4 Elektronisches Bauelement des Chiptyps The electronic component of the chip-type |
| 03/29/2006 | EP1641042A2 Integrated Bicmos semiconductor circuit |
| 03/29/2006 | EP1641041A2 Capacitive structure under a bump |
| 03/29/2006 | EP1641040A2 Thermally conductive sheet and method for producing the same |
| 03/29/2006 | EP1641039A1 Semiconductor device manufacturing method |
| 03/29/2006 | EP1641036A1 Joining method and joining device |
| 03/29/2006 | EP1641018A1 Magnetron cooling fin |
| 03/29/2006 | EP1640326A2 Method and system for providing mems device package with secondary seal |
| 03/29/2006 | EP1640048A1 Method of crystallizing organic oligomer, epoxy resin composition containing organic oligomer obtained by the method and epoxy resin cured material |
| 03/29/2006 | EP1639663A2 Polyimide based electrolyte and improved batteries therefrom |
| 03/29/2006 | EP1639645A1 Microelectronic package method and apparatus |
| 03/29/2006 | EP1639644A2 Integrated circuit package having stacked integrated circuits and method therefor |
| 03/29/2006 | EP1639643A1 Optimized multi-application assembly |
| 03/29/2006 | EP1639642A2 Economical high-frequency package |
| 03/29/2006 | EP1639641A1 Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe |