| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/05/2006 | CN1755924A Package and packaging method thereof |
| 04/05/2006 | CN1755923A Radiating fin and method for manufacturing the same |
| 04/05/2006 | CN1755922A Heat radiation module |
| 04/05/2006 | CN1755921A Flip chip packaging method and packaging structure |
| 04/05/2006 | CN1755920A Heat radiator dedicated for semiconductor refrigerating assembly |
| 04/05/2006 | CN1755919A Circuit device and manufacturing method thereof |
| 04/05/2006 | CN1755918A Semiconductor element |
| 04/05/2006 | CN1755917A Semiconductor monitoring device and manufacturing method thereof |
| 04/05/2006 | CN1755916A Semiconductor device and manufacturing method of the same |
| 04/05/2006 | CN1755907A Manufacturing method of a semiconductor device |
| 04/05/2006 | CN1250062C Manufacturing method of modular board |
| 04/05/2006 | CN1250057C 信号传输结构 Signal transmission structure |
| 04/05/2006 | CN1249921C Small electronic element |
| 04/05/2006 | CN1249901C Heat radiation increased and over current load avoided small sized power supply |
| 04/05/2006 | CN1249814C Strong dielectric capacitor and mfg. method and semiconductor storage device |
| 04/05/2006 | CN1249812C Semiconductor device and method for manufacturing semiconductor device |
| 04/05/2006 | CN1249811C Heat-dissipating gain-type conductor holder |
| 04/05/2006 | CN1249810C Side-blow heat radiator |
| 04/05/2006 | CN1249809C Binding thin film for semiconductor, lead wire frame using same and semiconductor device |
| 04/05/2006 | CN1249804C Microstructure production method and microstructure arrangement |
| 04/05/2006 | CN1249798C Method for manufacturing mixed integrated circuit device |
| 04/05/2006 | CN1249506C 电子电路 Electronic circuit |
| 04/05/2006 | CN1249399C Surface installation chip package |
| 04/05/2006 | CN1249214C Substrates for immobilizing and amplifying DNA, DNA-immobilized chips having DNA immobilized on the substrates, and method for amplifying DNA |
| 04/05/2006 | CN1249168C Semiconductor sealing resin composition, semiconductor device using same, and process for preparing semiconductor device |
| 04/05/2006 | CN1249118C Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition |
| 04/04/2006 | US7024642 Extraction method of defect density and size distributions |
| 04/04/2006 | US7024637 Functionality based package design for integrated circuit blocks |
| 04/04/2006 | US7023707 Information handling system |
| 04/04/2006 | US7023706 Semiconductor device and manufacturing the same |
| 04/04/2006 | US7023702 Apparatus including circuit board and heat sink and method of making the apparatus |
| 04/04/2006 | US7023701 Device for cooling memory modules |
| 04/04/2006 | US7023700 Heat sink riveted to memory module with upper slots and open bottom edge for air flow |
| 04/04/2006 | US7023698 Fan stand structure for central processing unit |
| 04/04/2006 | US7023694 Computer |
| 04/04/2006 | US7023685 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor |
| 04/04/2006 | US7023678 ESD protection designs with parallel LC tank for giga-hertz RF integrated circuits |
| 04/04/2006 | US7023677 ESD protection designs with parallel LC tank for Giga-Hertz RF integrated circuits |
| 04/04/2006 | US7023347 Method and system for forming a die frame and for transferring dies therewith |
| 04/04/2006 | US7023316 Semiconductor device with electrically coupled spiral inductors |
| 04/04/2006 | US7023315 High performance RF inductors and transformers using bonding technique |
| 04/04/2006 | US7023178 Voltage measuring apparatus |
| 04/04/2006 | US7023099 Wafer cleaning method and resulting wafer |
| 04/04/2006 | US7023098 containing an epoxy resin, a phenolic resin, an inorganic filler and a curing accelerator as main components, and further containing a silane coupling agent in 0.01 wt; for encapsulating a semiconductor chip; improved flowability |
| 04/04/2006 | US7023097 FBGA arrangement |
| 04/04/2006 | US7023096 Multi-chip package having spacer that is inserted between chips and manufacturing method thereof |
| 04/04/2006 | US7023095 Carrier |
| 04/04/2006 | US7023094 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
| 04/04/2006 | US7023093 Very low effective dielectric constant interconnect Structures and methods for fabricating the same |
| 04/04/2006 | US7023092 Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds |
| 04/04/2006 | US7023091 Semiconductor integrated circuit device |
| 04/04/2006 | US7023090 Bonding pad and via structure design |
| 04/04/2006 | US7023089 Low temperature packaging apparatus and method |
| 04/04/2006 | US7023088 Semiconductor package, semiconductor device and electronic device |
| 04/04/2006 | US7023087 Integrated circuit carrier and method of manufacturing and integrated circuit |
| 04/04/2006 | US7023086 Semiconductor component arrangement with a reduced oscillation tendency |
| 04/04/2006 | US7023085 Semiconductor package structure with reduced parasite capacitance and method of fabricating the same |
| 04/04/2006 | US7023084 Plastic packaging with high heat dissipation and method for the same |
| 04/04/2006 | US7023083 Multi-layer device and method for producing the same |
| 04/04/2006 | US7023082 Semiconductor package and manufacturing method thereof |
| 04/04/2006 | US7023081 Land pattern configuration |
| 04/04/2006 | US7023080 Semiconductor integrated circuit with dummy patterns |
| 04/04/2006 | US7023079 Stacked semiconductor chip package |
| 04/04/2006 | US7023078 Packages for communication devices |
| 04/04/2006 | US7023077 Carrier with metal bumps for semiconductor die packages |
| 04/04/2006 | US7023076 Multiple chip semiconductor packages |
| 04/04/2006 | US7023075 Teardrop shaped lead frames |
| 04/04/2006 | US7023074 Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) |
| 04/04/2006 | US7023073 Noise shield type multi-layered substrate |
| 04/04/2006 | US7023070 Semiconductor device |
| 04/04/2006 | US7023063 Arrangement of microstructures |
| 04/04/2006 | US7023058 Semiconductor integrated circuit device |
| 04/04/2006 | US7023044 Stacked capacitor-type semiconductor storage device and manufacturing method thereof |
| 04/04/2006 | US7023043 Top electrode in a strongly oxidizing environment |
| 04/04/2006 | US7023028 Protection structure for protection from electrostatic discharge and integrated circuit |
| 04/04/2006 | US7023027 Diode package having an anode and a cathode formed on one surface of a diode chip |
| 04/04/2006 | US7023016 Thin film transistor array panel and manufacturing method thereof |
| 04/04/2006 | US7022913 Electronic component, method of manufacturing the electronic component, and electronic apparatus |
| 04/04/2006 | US7022609 Manufacturing method of a semiconductor substrate provided with a through hole electrode |
| 04/04/2006 | US7022606 Underlayer film for copper, and a semiconductor device including the underlayer film |
| 04/04/2006 | US7022588 Method of manufacturing an electronic component and electronic component obtained by means of said method |
| 04/04/2006 | US7022582 Microelectronic process and structure |
| 04/04/2006 | US7022566 Integrated radio frequency circuits |
| 04/04/2006 | US7022553 Compact system module with built-in thermoelectric cooling |
| 04/04/2006 | US7022552 Semiconductor device and method for fabricating semiconductor device |
| 04/04/2006 | US7022551 Quad flat flip chip packaging process and leadframe therefor |
| 04/04/2006 | US7022550 Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes |
| 04/04/2006 | US7022549 Method for connecting an integrated circuit to a substrate and corresponding arrangement |
| 04/04/2006 | US7022548 Method for making a semiconductor die package |
| 04/04/2006 | US7022547 Card manufacturing technique and resulting card |
| 04/04/2006 | US7022533 Substrate mapping |
| 04/04/2006 | US7022473 Substrates for immobilizing and amplifying DNA and DNA-immobilized chips |
| 04/04/2006 | US7022410 Combinations of resin compositions and methods of use thereof |
| 04/04/2006 | US7022399 Semiconductor device integrated multilayer wiring board |
| 04/04/2006 | US7022373 Method of forming composite insulating layer and process of producing wiring board |
| 04/04/2006 | US7022261 Forming an aqueous solution containing soluble precursors of a sulfur-containing phosphor; generating an aerosol of droplets from above solution, heating droplets to form a particulate intermediate compound capable of being post-treated to form said sulfur-containing phosphor powder |
| 04/04/2006 | US7022246 Method of fabrication of MIMCAP and resistor at same level |
| 04/04/2006 | US7021894 Apparatus for cooling of electronic components |
| 04/04/2006 | US7021518 Micromagnetic device for power processing applications and method of manufacture therefor |
| 04/04/2006 | US7021369 Hermetic closed loop fluid system |