| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/06/2006 | US20060071316 Three-dimensional stack manufacture for integrated circuit devices and method of manufacture |
| 04/06/2006 | US20060071315 Method of forming a stacked semiconductor package |
| 04/06/2006 | US20060071314 Cavity-down stacked multi-chip package |
| 04/06/2006 | US20060071313 Memory card and method of fabricating the same |
| 04/06/2006 | US20060071312 Semiconducting device that includes wirebonds |
| 04/06/2006 | US20060071311 Surface-mounted microwave package and corresponding mounting with a multilayer circuit |
| 04/06/2006 | US20060071310 Semiconductor lead frame, semiconductor package having the same, and method of plating the same |
| 04/06/2006 | US20060071309 Semiconductor device |
| 04/06/2006 | US20060071308 Apparatus of antenna with heat slug and its fabricating process |
| 04/06/2006 | US20060071307 Lead frame and semiconductor package therefor |
| 04/06/2006 | US20060071306 Active device bases, leadframes utilizing the same, and leadframe fabrication methods |
| 04/06/2006 | US20060071305 Electrical package structure including chip with polymer thereon |
| 04/06/2006 | US20060071304 Structure and layout of a fet prime cell |
| 04/06/2006 | US20060071303 Film substrate of a semiconductor package and a manufacturing method |
| 04/06/2006 | US20060071302 Fluid injection devices and fabrication methods thereof |
| 04/06/2006 | US20060071301 Silicon rich dielectric antireflective coating |
| 04/06/2006 | US20060071300 Dielectric material having carborane derivatives |
| 04/06/2006 | US20060071296 RF passive circuit and RF amplifier with via-holes |
| 04/06/2006 | US20060071289 Lead frame and light receiving module comprising it |
| 04/06/2006 | US20060071277 Apparatus and method for breakdown protection of a source follower circuit |
| 04/06/2006 | US20060071276 Field effect trench transistor |
| 04/06/2006 | US20060071240 Integrated circuit with at least one bump |
| 04/06/2006 | US20060071227 System and method for active array temperature sensing and cooling |
| 04/06/2006 | US20060071208 Inspection methods and structures for visualizing and/or detecting specific chip structures |
| 04/06/2006 | US20060071152 Semiconductor device and method for producing same |
| 04/06/2006 | US20060071084 Process for manufacture of novel, inexpensive radio frequency identification devices |
| 04/06/2006 | US20060070978 Method for manufacturing a bump-attached wiring circuit board |
| 04/06/2006 | US20060070441 Micro-electro-mechanical structure having electrically insulated regions and manufacturing process thereof |
| 04/06/2006 | DE202005017450U1 Cooling module for e.g. central processing unit, has cooling fan provided with housing that comprises air inlet and outlet sides, and hook provided at inner side of casing to hook to edge of inlet or outlet side |
| 04/06/2006 | DE19964099B4 Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme A process for producing three-dimensionally arranged leading and connecting structures for volume and energy flows |
| 04/06/2006 | DE19708282B4 Eine ein siedendes und kondensierendes Kühlmittel verwendende Kühlvorrichtung A cooling device a boiling and condensing refrigerant used |
| 04/06/2006 | DE19505947B4 Halbleitervorrichtung mit verbesserter Barrierenmetallschicht in einer Elektrode oder Verdrahtungsschicht A semiconductor device with improved barrier metal layer in an electrode or wiring layer |
| 04/06/2006 | DE102004050476B3 Making wiring circuit panel, employs structured masking layers to define through-contact locations, with selective use of protective layers when depositing conductor structures |
| 04/06/2006 | DE102004048238A1 Planar field-effect transistor e.g. P-type metal oxide semiconductor field-effect transistor, for e.g. chip planar, has gate region bending/brokenly proceeding in active region in a manner that drain and source regions are of variable sizes |
| 04/06/2006 | DE102004047800A1 Temporary protection of glass substrates comprises applying polymer protective layer at glass substrate and removing polymer protective layer by plasma etching procedure after fulfilling protective function of glass substrate |
| 04/06/2006 | DE102004047682A1 LED-Array LED array |
| 04/06/2006 | DE102004047631A1 Verfahren zum Ausbilden eines Feldeffekttransistors mit einem verspannten Kanalgebiet A method of forming a field effect transistor with a strained channel region |
| 04/06/2006 | DE102004047522B3 Halbleiterchip mit einer Metallbeschichtungsstruktur und Verfahren zur Herstellung desselben The same semiconductor chip with a metal coating structure and methods for preparing |
| 04/06/2006 | DE102004047357A1 Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung Electrical arrangement and method for manufacturing an electrical assembly |
| 04/06/2006 | DE102004047306A1 Power semiconductor component, has power and control assemblies, which are contacted by bonding wires of different thickness, where bonding wires serving as contact surface are thicker than contacted bonding wires |
| 04/06/2006 | DE102004046807A1 Plastic component for power semiconductor module, has plastic unit connected with connection straps, pin tiers, curved connection units and bushing, by adhesion or form-closure to form positioning unit, which is partly recoated with plastic |
| 04/06/2006 | DE102004045948A1 Oberflächenmontierbares Bauelement Surface mount device |
| 04/06/2006 | DE102004045854A1 Semiconductor sensor, has hollow housing made up of plastic, and semiconductor sensor chip arranged on chip carrier in housing, where thermal characteristics of chip carrier correspond to semiconductor material of sensor chip |
| 04/06/2006 | DE102004044982A1 Drucksensorvorrichtung und Verfahren zum Herstellen derselben Pressure sensing device and methods for manufacturing the same |
| 04/06/2006 | DE102004043663A1 Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip und Verfahren zur Herstellung eines Halbleitersensorbauteils mit Hohlraumgehäuse und Sensorchip A semiconductor sensor device comprising housing cavity and the sensor chip and method for producing a semiconductor sensor device with housing cavity and the sensor chip |
| 04/06/2006 | DE102004021633B4 Verfahren zum Verbinden eines Halbleiterchips mit einem Chipträger und Anordnung mit einem Halbleiterchip und einem Chipträger A method of connecting a semiconductor chip with a chip carrier assembly and having a semiconductor chip and a chip carrier |
| 04/06/2006 | DE10138659B4 Verfahren zur Herstellung einer Anordnung aus einem Halbleiterchip und einer damit verbundenen Leiterbahnstruktur A process for preparing an assembly of a semiconductor chip and an associated conductor track structure |
| 04/06/2006 | DE10104267B4 Elektronisches Bauteil mit mindestens einer Isolationslage Electronic component with at least one layer of insulation |
| 04/06/2006 | CA2581938A1 Integrated circuit and method for manufacturing |
| 04/05/2006 | EP1643823A1 Fluid cooling device to cool at least one heat producing component |
| 04/05/2006 | EP1643641A2 High-frequency heating device, semiconductor manufacturing device, and light source device |
| 04/05/2006 | EP1643625A1 Inverter module |
| 04/05/2006 | EP1643552A1 Module including circuit elements |
| 04/05/2006 | EP1643551A2 Die down ball grid array packages and method for making same |
| 04/05/2006 | EP1643550A2 A planar circuit housing |
| 04/05/2006 | EP1643420A1 Ic card and ic card manufacturing method |
| 04/05/2006 | EP1642485A1 Electronic device provided with a magnetic screening |
| 04/05/2006 | EP1642364A1 Normally closed zero insertion force connector |
| 04/05/2006 | EP1642346A1 Light-emitting diode thermal management system |
| 04/05/2006 | EP1642337A2 Offset dependent resistor for measuring misalignment of stitched masks |
| 04/05/2006 | EP1642336A1 Method for interconnecting active and passive components, and a resulting thin heterogeneous component |
| 04/05/2006 | EP1642335A1 Integrated coolant circuit arrangement, operating method and production method |
| 04/05/2006 | EP1642334A1 Electronic power module comprising a rubber seal and corresponding production method |
| 04/05/2006 | EP1642333A2 Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking |
| 04/05/2006 | EP1642330A1 Planar magnetic tunnel junction substrate having recessed alignment marks |
| 04/05/2006 | EP1642326A2 Method for efficiently producing removable peripheral cards |
| 04/05/2006 | EP1642324A2 Methods and apparatus for defining power grid structures having diagonal stripes |
| 04/05/2006 | EP1642077A2 Brazed wick for a heat transfer device and method of making same |
| 04/05/2006 | EP1397835B1 Method of controlling the crystal orientation of a composite structure |
| 04/05/2006 | EP1392093B1 Method for manufacturing ceramic multilayered board |
| 04/05/2006 | EP1218688B1 Method and apparatus for three dimensional inspection of electronic components |
| 04/05/2006 | EP1162867B1 Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 04/05/2006 | EP0896734B1 All-metal, giant magnetoresistive, solid-state component |
| 04/05/2006 | CN2770287Y Radiating device combination |
| 04/05/2006 | CN2770096Y Semiconductor substrate structure |
| 04/05/2006 | CN2770095Y Packed chip capable of reducing electromagnetic interference |
| 04/05/2006 | CN2770094Y Electric crystal structure capable of isolating electrical interference |
| 04/05/2006 | CN2770093Y Radiating device |
| 04/05/2006 | CN2770092Y Radiator for CPU water cooler |
| 04/05/2006 | CN2770091Y 散热器 Heat sink |
| 04/05/2006 | CN2770090Y Radiating apparatus |
| 04/05/2006 | CN2770089Y Memory chip carrier |
| 04/05/2006 | CN2769785Y Special radiator for semiconductor refrigerating assembly |
| 04/05/2006 | CN1757119A Group III nitride based flip-chip integrated circuit and method for fabricating |
| 04/05/2006 | CN1757112A Micro fuse |
| 04/05/2006 | CN1757111A Printed wiring board, method for manufacturing same, lead frame package and optical module |
| 04/05/2006 | CN1757110A Semiconductor device, semiconductor body and method of manufacturing thereof |
| 04/05/2006 | CN1757109A Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 04/05/2006 | CN1757108A Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body |
| 04/05/2006 | CN1757107A Split fin heat sink |
| 04/05/2006 | CN1757103A Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 04/05/2006 | CN1756716A Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body |
| 04/05/2006 | CN1756454A Static discharge protecting circuit with filtering device |
| 04/05/2006 | CN1755952A Dissimilar LED luminous sheet or casing |
| 04/05/2006 | CN1755930A Electrostatic protection circuit |
| 04/05/2006 | CN1755929A Method for forming semiconductor package and its structure |
| 04/05/2006 | CN1755928A Semiconductor devices and connection structure for semiconductor devices |
| 04/05/2006 | CN1755927A Semiconductor device and method of manufacturing semiconductor device |
| 04/05/2006 | CN1755926A Device and method for reducing dishing of critical on-chip interconnect lines |
| 04/05/2006 | CN1755925A Substrate structure combined with wafer of semiconductor package structure for electrical connection |