| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/11/2006 | US7026241 Superconductor device and method of manufacturing the same |
| 04/11/2006 | US7026240 Method of fabricating a semiconductor device having a photo-sensitive polyimide layer and a device fabricated in accordance with the method |
| 04/11/2006 | US7026239 Method for making an anisotropic conductive polymer film on a semiconductor wafer |
| 04/11/2006 | US7026234 Parasitic capacitance-preventing dummy solder bump structure and method of making the same |
| 04/11/2006 | US7026233 Method for reducing defects in post passivation interconnect process |
| 04/11/2006 | US7026223 Hermetic electric component package |
| 04/11/2006 | US7026212 Method for making high density nonvolatile memory |
| 04/11/2006 | US7026208 Methods of forming integrated circuit devices including cylindrical capacitors having supporters between lower electrodes |
| 04/11/2006 | US7026198 Focused ion beam treatment method and semiconductor device suitable for its implementation |
| 04/11/2006 | US7026192 Terminal land frame and method for manufacturing the same |
| 04/11/2006 | US7026191 Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same |
| 04/11/2006 | US7026188 Electronic device and method for manufacturing the same |
| 04/11/2006 | US7026176 Mold making method for wafer scale caps |
| 04/11/2006 | US7026175 High throughput measurement of via defects in interconnects |
| 04/11/2006 | US7026052 Porous low k(<2.0) thin film derived from homo-transport-polymerization |
| 04/11/2006 | US7025906 For accelerating heat conductance; tin, bismuth, indium, and lead alloys formed via heat treatment; adhesion |
| 04/11/2006 | US7025905 Black composite particles for semiconductor sealing material, and semiconductor sealing material using the same |
| 04/11/2006 | US7025845 Surface mounted device type package using coaxial cable |
| 04/11/2006 | US7025600 Semiconductor device having external contact terminals and method for using the same |
| 04/11/2006 | US7025129 Adhesive to attach a cooling device to a thermal interface |
| 04/11/2006 | US7025124 Supporting structure for planar heat pipe |
| 04/11/2006 | US7024764 Method of making an electronic package |
| 04/09/2006 | CA2481605A1 Auto-retractable pen with an adjustable cushion effect |
| 04/06/2006 | WO2006037074A2 Method for micropackaging of electrical or electromechanical devices and micropackage |
| 04/06/2006 | WO2006037056A2 Stacked die module |
| 04/06/2006 | WO2006036992A2 System and method for active array temperature sensing and cooling |
| 04/06/2006 | WO2006036751A2 Integrated circuit and method for manufacturing |
| 04/06/2006 | WO2006036601A2 Process control monitors for the fabrication interferometric modulators |
| 04/06/2006 | WO2006036548A2 Method of forming a semiconductor package and structure thereof |
| 04/06/2006 | WO2006036505A1 Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices |
| 04/06/2006 | WO2006036447A2 A compact scr device and method for integrated circuits |
| 04/06/2006 | WO2006036358A2 Power led package |
| 04/06/2006 | WO2006036315A2 Method and apparatus for high temperature operation of electronics |
| 04/06/2006 | WO2006036250A1 Packaged microchip with premolded-type package |
| 04/06/2006 | WO2006036000A1 Semiconductor device and fabrication process thereof |
| 04/06/2006 | WO2006035963A1 Method of grinding multilayer body and method of manufacturing solid state image pickup device |
| 04/06/2006 | WO2006035955A1 Curable diamantane compound |
| 04/06/2006 | WO2006035882A1 Glass for semiconductor sealing, sheath tube for semiconductor sealing and semiconductor electronic part |
| 04/06/2006 | WO2006035860A1 Semiconductor device |
| 04/06/2006 | WO2006035689A1 Semiconductor device |
| 04/06/2006 | WO2006035591A1 Method for forming copper wiring |
| 04/06/2006 | WO2006035541A1 Semiconductor device |
| 04/06/2006 | WO2006035134A1 Composite material for producing high-thermally conductive ribs for heat exchangers |
| 04/06/2006 | WO2006035017A1 Electronic device with a multi-layered ceramic substrate and a heat-removal body |
| 04/06/2006 | WO2006034697A1 Method for producing a flange for a semiconductor component, and flange produced according to said method |
| 04/06/2006 | WO2006034696A2 Layer between boundary surfaces of differing components in semiconductor modules and method for production thereof |
| 04/06/2006 | WO2006034682A1 Semiconductor component comprising semiconductor component parts that are potted in a plastic housing mass |
| 04/06/2006 | WO2006034680A1 Semiconductor chip comprising a metal coating structure and associated production method |
| 04/06/2006 | WO2006034664A1 Conductor frame for an electronic component and method for the production thereof |
| 04/06/2006 | WO2006013508A3 Wafer with improved conductive loops in the dicing lines |
| 04/06/2006 | WO2005123988B1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
| 04/06/2006 | WO2005096320A3 Thermally conductive compositions and methods of making thereof |
| 04/06/2006 | WO2005067657A3 Method of packaging an optical sensor |
| 04/06/2006 | WO2005062998A8 Metal interconnect system and method for direct die attachment |
| 04/06/2006 | WO2005003668A3 Microchannel heat exchangers and methods of manufacturing the same |
| 04/06/2006 | WO2004114122A3 Secure number generator and content distribution network employing the same |
| 04/06/2006 | US20060074150 molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; |
| 04/06/2006 | US20060073693 Redistribution layer of wafer and the fabricating method thereof |
| 04/06/2006 | US20060073639 Electronic parts packaging structure and method of manufacturing the same |
| 04/06/2006 | US20060073638 Semiconductor electrical connection structure and method of fabricating the same |
| 04/06/2006 | US20060073636 Fabrication of stacked die and structures formed thereby |
| 04/06/2006 | US20060073416 Mechanically robust interconnect for low-k dielectric material using post treatment |
| 04/06/2006 | US20060073397 Masking arrangement and method for producing integrated circuit arrangements |
| 04/06/2006 | US20060073332 Reduced thickness, small thermal interface resistance, good flexibility, and heat conduction |
| 04/06/2006 | US20060072295 Method for producing microsystems |
| 04/06/2006 | US20060071351 Mold compound interlocking feature to improve semiconductor package strength |
| 04/06/2006 | US20060071350 Structure and method for fabricating a bond pad structure |
| 04/06/2006 | US20060071349 Semiconductor device and semiconductor device unit |
| 04/06/2006 | US20060071348 Increasing the adhesion of an adhesive connection in housings |
| 04/06/2006 | US20060071347 Semiconductor device and fabrication method thereof |
| 04/06/2006 | US20060071346 Semiconductor device and manufacturing method thereof |
| 04/06/2006 | US20060071345 Copper interposer for reducing warping of integrated circuit packages and method of making IC packages |
| 04/06/2006 | US20060071344 Wiring connection structure and method for forming the same |
| 04/06/2006 | US20060071343 Semiconductor device and method of manufacturing semiconductor device |
| 04/06/2006 | US20060071342 Semiconductor device manufacturing method of the same |
| 04/06/2006 | US20060071341 Array capacitor apparatuses to filter input/output signal |
| 04/06/2006 | US20060071340 Methods to deposit metal alloy barrier layers |
| 04/06/2006 | US20060071339 Semiconductor device, wafer and method of designing and manufacturing the same |
| 04/06/2006 | US20060071338 Homogeneous Copper Interconnects for BEOL |
| 04/06/2006 | US20060071337 Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices |
| 04/06/2006 | US20060071336 Copper interconnect |
| 04/06/2006 | US20060071335 Semiconductor device using multi-layer unleaded metal plating, and method of manufacturing the same |
| 04/06/2006 | US20060071334 Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device |
| 04/06/2006 | US20060071333 Packaging substrate and semiconductor device |
| 04/06/2006 | US20060071332 Face-to-face bonded I/O circuit die and functional logic circuit die system |
| 04/06/2006 | US20060071331 Semiconductor device carrier unit and semiconductor socket provided therewith |
| 04/06/2006 | US20060071330 Semiconductor package |
| 04/06/2006 | US20060071329 Power led package |
| 04/06/2006 | US20060071328 Semiconductor substrate structure |
| 04/06/2006 | US20060071327 Construction to improve thermal performance and reduce die backside warpage |
| 04/06/2006 | US20060071326 Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
| 04/06/2006 | US20060071325 Semiconductor device and electronic apparatus |
| 04/06/2006 | US20060071324 Microelectronic package having chamber sealed by material including one or more intermetallic compounds |
| 04/06/2006 | US20060071323 Method for processing a thin film substrate |
| 04/06/2006 | US20060071322 Automatic trace determination method and apparatus for automatically determining optimal trace positions on substrate using computation |
| 04/06/2006 | US20060071321 Resin molded semiconductor device and mold |
| 04/06/2006 | US20060071320 Semiconductor device |
| 04/06/2006 | US20060071319 Semiconductor integrated circuit |
| 04/06/2006 | US20060071318 Methods for manufacturing semiconductor device, semiconductor device and metal mold |
| 04/06/2006 | US20060071317 Multi-chip package and method for manufacturing the same |