| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/12/2006 | EP1646085A2 Deterministic generation of an indentification number for an integrated circuit |
| 04/12/2006 | EP1645847A1 Temperature compensated micro-electromechanical device and method of temperature compensation in a micro-electromechanical device |
| 04/12/2006 | EP1645318A2 Gas-collecting unit, test head, and ic device testing apparatus |
| 04/12/2006 | EP1645174A2 Tower heat sink with sintered grooved wick |
| 04/12/2006 | EP1644978A1 Semiconductor device including optimized driver layout for integrated circuit with staggered bond pads |
| 04/12/2006 | EP1644977A2 Method for forming a high-voltage / high-power die package |
| 04/12/2006 | EP1644976A2 Stackable integrated circuit package and method therefor |
| 04/12/2006 | EP1644975A1 Method and arrangement in inverter |
| 04/12/2006 | EP1644974A2 Pecvd silicon-rich oxide layer for reduced uv charging in an eeprom |
| 04/12/2006 | EP1644963A2 Semi-fusible link system for a multi-layer integrated circuit and method of making same |
| 04/12/2006 | EP1644874A1 Flexible semiconductor device and identification label |
| 04/12/2006 | EP1427971B1 Modular capillary pumped loop cooling system |
| 04/12/2006 | EP1408863A4 Hermetic feedthrough for an implantable device |
| 04/12/2006 | EP1064674B1 A method of manufacturing an electronic device comprising two layers of organic-containing material |
| 04/12/2006 | EP1029360A4 Vertical interconnect process for silicon segments with dielectric isolation |
| 04/12/2006 | CN2772190Y Heat conduction structure for increasing radiation and heat conduction effect |
| 04/12/2006 | CN2772033Y Semiconductor assembly |
| 04/12/2006 | CN2772029Y Fusing body for semiconductor device protection |
| 04/12/2006 | CN2772028Y Programmable resistor element in integrated circuit element |
| 04/12/2006 | CN2772027Y Multi-layer semiconductor device |
| 04/12/2006 | CN2772026Y Liquid-cooled radiating device |
| 04/12/2006 | CN2772025Y Miniature liquid cooling device |
| 04/12/2006 | CN2772024Y Heat conduit type radiator |
| 04/12/2006 | CN2772023Y Radiating device |
| 04/12/2006 | CN2772022Y Radiating fin structure for assembled radiator |
| 04/12/2006 | CN2772021Y Base ejecting structure for base board of radiating device |
| 04/12/2006 | CN2771923Y Computer mainframe internal radiating structure |
| 04/12/2006 | CN2771791Y Multi-divectional combination structure having heat-conductive-tube radiating device base board |
| 04/12/2006 | CN2771790Y Improved combination structure for radiating fin with heat pipe |
| 04/12/2006 | CN1759643A Cooling structure for electronic equipment |
| 04/12/2006 | CN1759639A Method and device for protection of a component or module |
| 04/12/2006 | CN1759492A Solid element device and method for manufacture thereof |
| 04/12/2006 | CN1759486A Photodiode array, method for manufacturing same, and radiation detector |
| 04/12/2006 | CN1759485A Photodiode array, method for manufacturing same, and radiation detector |
| 04/12/2006 | CN1759484A Photodiode array, method for manufacturing same, and radiation detector |
| 04/12/2006 | CN1759481A Transistor integrated circuit device and manufacturing method thereof |
| 04/12/2006 | CN1759480A Dual metal stud bumping for flip chip applications |
| 04/12/2006 | CN1759477A Method for manufacturing electronic component-mounted board |
| 04/12/2006 | CN1759284A Cooling device of hybrid-type |
| 04/12/2006 | CN1759131A Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
| 04/12/2006 | CN1759078A Heat sink having a high thermal conductivity |
| 04/12/2006 | CN1758841A Fan structure |
| 04/12/2006 | CN1758436A High power LED array module |
| 04/12/2006 | CN1758435A Physical quantity sensor and manufacturing method therefor |
| 04/12/2006 | CN1758434A Fin-type antifuse |
| 04/12/2006 | CN1758433A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/12/2006 | CN1758432A Conductive oxide electrode material and its preparation method |
| 04/12/2006 | CN1758431A Wafer package with integrated heat dissipating base on chip and heat sink method oa chip |
| 04/12/2006 | CN1758430A Semiconductor device and manufacturing method thereof |
| 04/12/2006 | CN1758180A Heat radiation cooling device for CPU chip |
| 04/12/2006 | CN1251560C Parts built in module and its making method |
| 04/12/2006 | CN1251484C Optical device manufacturing method |
| 04/12/2006 | CN1251363C Lead-frame configuration for chips |
| 04/12/2006 | CN1251358C Semiconductor device having signal contacts and high current power contacts |
| 04/12/2006 | CN1251349C 微波电路 Microwave Circuits |
| 04/12/2006 | CN1251328C Memory macro and semiconductor integrated circuit |
| 04/12/2006 | CN1251325C Chip packaging substrate |
| 04/12/2006 | CN1251319C Microelectronic component insert making method |
| 04/12/2006 | CN1251260C Laminated ceramic electronic device |
| 04/12/2006 | CN1251239C Semiconductor storage device adapting to multiple packing forms |
| 04/12/2006 | CN1251048C Cooling device of cooling exothermic element and electronic equipment having said cooling device |
| 04/12/2006 | CN1251011C In-plane switching mode liquid crystal display device |
| 04/12/2006 | CN1250776C Local electroplating system |
| 04/12/2006 | CN1250599C Epoxy resin compositions and semiconductor devices |
| 04/12/2006 | CN1250479C Alumina sintered body and its producing method |
| 04/11/2006 | US7028282 Integrated circuit with layout matched high speed lines |
| 04/11/2006 | US7027304 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
| 04/11/2006 | US7027303 Electronic power module |
| 04/11/2006 | US7027302 Coolant cooled type semiconductor device |
| 04/11/2006 | US7027289 Extended thin film capacitor (TFC) |
| 04/11/2006 | US7027276 High voltage ESD protection circuit with low voltage transistors |
| 04/11/2006 | US7027155 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
| 04/11/2006 | US7026754 Matrix substrate having wiring lines formed in different wiring layers |
| 04/11/2006 | US7026721 Method of improving copper pad adhesion |
| 04/11/2006 | US7026720 Flip-chip mounted integrated circuit card element |
| 04/11/2006 | US7026719 Semiconductor package with a heat spreader |
| 04/11/2006 | US7026718 Stacked multi-component integrated circuit microprocessor |
| 04/11/2006 | US7026717 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 04/11/2006 | US7026716 Self-assembled sub-nanolayers as interfacial adhesion enhancers and diffusion barriers |
| 04/11/2006 | US7026715 Semiconductor device having wiring layer formed in wiring groove |
| 04/11/2006 | US7026714 Copper interconnect systems which use conductive, metal-based cap layers |
| 04/11/2006 | US7026713 Transistor device having a delafossite material |
| 04/11/2006 | US7026712 Peltier module with durable power supply lines and exothermic module with built-in cooler |
| 04/11/2006 | US7026711 Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA) |
| 04/11/2006 | US7026710 Molded package for micromechanical devices and method of fabrication |
| 04/11/2006 | US7026709 Stacked chip-packaging structure |
| 04/11/2006 | US7026708 Low profile chip scale stacking system and method |
| 04/11/2006 | US7026707 Windowed package having embedded frame |
| 04/11/2006 | US7026706 Method and packaging structure for optimizing warpage of flip chip organic packages |
| 04/11/2006 | US7026704 Semiconductor device for reducing plasma charging damage |
| 04/11/2006 | US7026699 Semiconductor device and method for fabricating the same |
| 04/11/2006 | US7026691 Minimizing transistor size in integrated circuits |
| 04/11/2006 | US7026664 DC-DC converter implemented in a land grid array package |
| 04/11/2006 | US7026661 Light emitting device and manufacturing method thereof |
| 04/11/2006 | US7026647 Device and method for detecting alignment of active areas and memory cell structures in DRAM devices |
| 04/11/2006 | US7026646 Isolation circuit |
| 04/11/2006 | US7026617 Thermal infrared detector and infrared image sensor using the same |
| 04/11/2006 | US7026548 improved packages for electronic devices; directed to image sensor chips; inexpensive and simple to construct while exhibiting durability and improved sealing properties |
| 04/11/2006 | US7026376 Fluxing agent for underfill materials |
| 04/11/2006 | US7026244 Low resistance and reliable copper interconnects by variable doping |