| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/13/2006 | WO2006024261A3 Connection element for a semiconductor component, a semiconductor component with several connection elements and method for the production thereof |
| 04/13/2006 | WO2005117031A3 Method and apparatus for administering passivator to a conductor |
| 04/13/2006 | WO2005115072A3 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 04/13/2006 | WO2005101490A3 Component that is situated on a cooling fin |
| 04/13/2006 | WO2005041256A3 An integrated circuit micro-cooler using self-assembled nano structures |
| 04/13/2006 | WO2005027197A3 Coupler resource module |
| 04/13/2006 | WO2005020297A3 Technique for evaluating a fabrication of a semiconductor component and wafer |
| 04/13/2006 | US20060079609 Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products |
| 04/13/2006 | US20060079060 Semiconductor device having elevated source/drain and method of fabricating the same |
| 04/13/2006 | US20060079041 Manufacturing method for a semiconductor device |
| 04/13/2006 | US20060079029 Flexible circuit board processing method |
| 04/13/2006 | US20060079027 Semiconductor device and its manufacturing method |
| 04/13/2006 | US20060079023 Semiconductor device and manufacturing method for the same |
| 04/13/2006 | US20060079022 Frame attaching process |
| 04/13/2006 | US20060079014 Method of manufacturing an LED |
| 04/13/2006 | US20060079011 Methods for marking a bare semiconductor die |
| 04/13/2006 | US20060078808 Method for measuring overlay and overlay mark used therefor |
| 04/13/2006 | US20060078715 Bonding structure of device packaging |
| 04/13/2006 | US20060078679 Vapor deposition using metal halide; removal by-products; using scavenger |
| 04/13/2006 | US20060077749 Memory card structure and manufacturing method thereof |
| 04/13/2006 | US20060076852 Electroacoustic component and method for the production thereof |
| 04/13/2006 | US20060076695 Semiconductor package with flash-absorbing mechanism and fabrication method thereof |
| 04/13/2006 | US20060076694 Semiconductor device package with concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency |
| 04/13/2006 | US20060076693 Self-releasing spring structures and methods |
| 04/13/2006 | US20060076692 Semiconductor package using flip-chip mounting technique |
| 04/13/2006 | US20060076691 Chip bond layout for chip carrier for flip chip applications |
| 04/13/2006 | US20060076690 Stacked Die Module |
| 04/13/2006 | US20060076689 Damascene processes for forming conductive structures |
| 04/13/2006 | US20060076688 Semiconductor device having improved contact hole structure and method for fabricating the same |
| 04/13/2006 | US20060076687 Post passivation interconnection schemes on top of the IC chips |
| 04/13/2006 | US20060076686 Method for manufacturing an electronic module, and an electronic module |
| 04/13/2006 | US20060076685 Patterned copper structures wherein the copper is in contact with a liner material; formed by selectively capping the copper employing selective etching and/or selective electroplating |
| 04/13/2006 | US20060076684 Post passivation interconnection schemes on top of the IC chips |
| 04/13/2006 | US20060076683 Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board |
| 04/13/2006 | US20060076682 Advanced copper damascene structure |
| 04/13/2006 | US20060076681 Semiconductor package substrate for flip chip packaging |
| 04/13/2006 | US20060076679 Non-circular via holes for bumping pads and related structures |
| 04/13/2006 | US20060076678 Thick metal layer integrated process flow to improve power delivery and mechanical buffering |
| 04/13/2006 | US20060076677 Resist sidewall spacer for C4 BLM undercut control |
| 04/13/2006 | US20060076676 Multi-chip integrated circuit module for high-frequency operation |
| 04/13/2006 | US20060076675 Semiconductor device having projection on surface thereof, and method of identifying semiconductor package |
| 04/13/2006 | US20060076674 Semiconductor device |
| 04/13/2006 | US20060076673 Power amplifier module |
| 04/13/2006 | US20060076672 Magnetic attachment method for LED light engines |
| 04/13/2006 | US20060076671 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module |
| 04/13/2006 | US20060076670 Micro-electro-mechanical system (MEMS) package having metal sealing member |
| 04/13/2006 | US20060076669 Deflectable probe and thermometer |
| 04/13/2006 | US20060076668 Multi-layer printed circuit board |
| 04/13/2006 | US20060076667 Semiconductor component with plastic housing, and process for producing the same |
| 04/13/2006 | US20060076666 Micro-electro-mechanical system (MEMS) package having hydrophobic layer |
| 04/13/2006 | US20060076664 3D interconnect with protruding contacts |
| 04/13/2006 | US20060076663 Deterministic generation of an integrated circuit identification number |
| 04/13/2006 | US20060076662 Memory card structure and manufacturing method thereof |
| 04/13/2006 | US20060076661 Attachment of integrated circuit structures and other substrates to substrates with vias |
| 04/13/2006 | US20060076660 Power transistor |
| 04/13/2006 | US20060076659 Chip package structure, package substrate and manufacturing method thereof |
| 04/13/2006 | US20060076658 Semiconductor package structure with microstrip antennan |
| 04/13/2006 | US20060076657 Die attach paddle for mounting integrated circuit die |
| 04/13/2006 | US20060076656 Electro-optical device and electronic apparatus |
| 04/13/2006 | US20060076655 Integrated circuit package employing a flexible substrate |
| 04/13/2006 | US20060076654 Lead frame and physical amount sensor |
| 04/13/2006 | US20060076653 Passivation layer assembly on a substrate and display substrate having the same |
| 04/13/2006 | US20060076652 Method of forming a field effect transistor comprising a stressed channel region |
| 04/13/2006 | US20060076651 Electronic device and method for fabricating the same |
| 04/13/2006 | US20060076650 Multilayered structure, multilayered structure array and method of manufacturing the same |
| 04/13/2006 | US20060076649 Substrate for stressed systems and method of making same |
| 04/13/2006 | US20060076637 Method and system for packaging a display |
| 04/13/2006 | US20060076626 Semiconductor integrated circuit device, contactless electronic device, and handheld terminal |
| 04/13/2006 | US20060076620 Semiconductor device |
| 04/13/2006 | US20060076573 Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver |
| 04/13/2006 | US20060076558 Semiconductor device and manufacturing method thereof |
| 04/13/2006 | US20060076422 Conductive pattern and method of making |
| 04/13/2006 | US20060076244 Barrier enhancement process for copper interconnects |
| 04/13/2006 | US20060076159 Contour structures to highlight inspection regions |
| 04/13/2006 | US20060076122 Heat collector |
| 04/13/2006 | US20060076121 Heat sink |
| 04/13/2006 | DE4345455B4 Contactless chip card, linked to scanner - has a structured laminated assembly which avoids tension peaks especially on bending |
| 04/13/2006 | DE19958144B4 Programmierbare Zwischenverbindungszelle zum wahlweisen Verbinden von Schaltkreisknoten in einem integrierten Schaltkreis und Anordnung programmierbarer Zwischenverbindungszellen Programmable interconnect cell for selectively connecting circuit nodes in an integrated circuit and array of programmable interconnect cells |
| 04/13/2006 | DE19955537B4 Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein A process for producing a support element for an IC module |
| 04/13/2006 | DE19749539B4 Halbleiterbaustein mit Leiterrahmen und Justierhilfen Semiconductor device with ladder frame and alignment aids |
| 04/13/2006 | DE19719181B4 Programmierbare Sicherungsschaltung und Verwendung derselben Programmable fuse circuit and using the same |
| 04/13/2006 | DE19615005B4 Gehäuse zur Aufnahme elektronischer Bauelemente und zugehöriges Herstellungsverfahren Housing for accommodating electronic components and associated production method |
| 04/13/2006 | DE112004000583T5 Leistungsschaltung mit einem thermoionischen Kühlsystem Power circuit with a thermionic cooling system |
| 04/13/2006 | DE102004049663B3 Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung derselben Plastic housing and the semiconductor device with such plastic housing, as well as methods for making same |
| 04/13/2006 | DE102004049654B3 Halbleiterbauteil mit Kunststoffgehäuse und Verfahren zur Herstellung desselben Of the same semiconductor device with plastic housing and methods for preparing |
| 04/13/2006 | DE102004048745A1 Bit conducting structure of DRAM comprises a number of parallel bit conductors in a storage element, which a arranged on different levels |
| 04/13/2006 | DE102004048608A1 Erhöhung der Haftkraft einer Klebeverbindung in Gehäusen Increase the adhesive strength of an adhesive bond in enclosures |
| 04/13/2006 | DE102004048201A1 Schicht zwischen Grenzflächen unterschiedlicher Komponenten in Halbleiterbauteilen, sowie Verfahren zu deren Herstellung Layer between interfaces of different components in semiconductor devices, as well as processes for their preparation |
| 04/13/2006 | DE102004047660A1 Bauteil mit integrierter Kapazitätsstruktur Component with integrated capacitance structure |
| 04/13/2006 | DE102004047659A1 Verfahren zur Herstellung eines Flansches für ein Halbleiterbauelement sowie nach diesem Verfahren hergestellter Flansch Process for the preparation of a flange for a semiconductor device prepared by this method as well as flange |
| 04/13/2006 | DE102004047510A1 Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten Semiconductor device having embedded in plastic housing compound semiconductor device components |
| 04/13/2006 | DE102004047324A1 Leuchtdiodenanordnung LED arrangement |
| 04/13/2006 | DE102004046806A1 Leistungshalbleitermodul The power semiconductor module |
| 04/13/2006 | DE102004046699A1 Contact surfaces e.g. cooling unit, connecting device, has contact surfaces connected by solidifying liquid e.g. melted solder, such that section of one of two surface edges exhibits structuring in area of edges |
| 04/13/2006 | DE102004046475A1 Electrical device, e.g. an inverter, has connecting feet with at least one crease; electrical device can be an inverter; connecting feet are arranged on both sides and/or in plane, especially plane parallel to circuit board |
| 04/13/2006 | DE10065896B4 Elektronisches Bauteil mit Abschirmung und Verfahren zu seiner Herstellung Electronic component with screen and method for its preparation |
| 04/13/2006 | DE10052484B4 Zappingschaltung und Zappingverfahren Zapping Zapping circuit and method |
| 04/13/2006 | DE10048203B4 Verbundwerkstoff und Verfahren zu seiner Herstellung Composite material and process for its preparation |
| 04/13/2006 | DE10004474B4 Kühlvorrichtung Cooler |
| 04/13/2006 | CA2581077A1 Epoxy resin composition for optical semiconductor encapsulation |