| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/18/2006 | US7030506 Mask and method for using the mask in lithographic processing |
| 04/18/2006 | US7030505 Heat spreading; encapsulated in molding materials |
| 04/18/2006 | US7030504 Sectional molding system |
| 04/18/2006 | US7030503 Semiconductor device |
| 04/18/2006 | US7030502 BGA package with same power ballout assignment for wire bonding packaging and flip chip packaging |
| 04/18/2006 | US7030501 Semiconductor device and switching element |
| 04/18/2006 | US7030500 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 04/18/2006 | US7030499 Semiconductor constructions |
| 04/18/2006 | US7030498 Semiconductor device with copper wirings having improved negative bias temperature instability (NBTI) |
| 04/18/2006 | US7030497 Localized slots for stress relieve in copper |
| 04/18/2006 | US7030496 Semiconductor device having aluminum and metal electrodes and method for manufacturing the same |
| 04/18/2006 | US7030495 Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby |
| 04/18/2006 | US7030494 Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof |
| 04/18/2006 | US7030493 neighboring film (selected from rhodium, ruthenium, iridium or osmium) prevents voids due to electromigration of the platinum or copper |
| 04/18/2006 | US7030492 By increasing the thickness of the under bump metallurgic layer (containing multiple metal layers and at least one liner layer) which is close to the transmission line, the chip with such UBM layer becomes more reliable |
| 04/18/2006 | US7030491 Power semiconductor module with deflection-resistant base plate |
| 04/18/2006 | US7030490 Structure of multi-tier wire bonding for high frequency integrated circuit |
| 04/18/2006 | US7030489 Multi-chip module having bonding wires and method of fabricating the same |
| 04/18/2006 | US7030488 Packaged combination memory for electronic devices |
| 04/18/2006 | US7030487 Chip scale packaging with improved heat dissipation capability |
| 04/18/2006 | US7030486 High density integrated circuit package architecture |
| 04/18/2006 | US7030485 Thermal interface structure with integrated liquid cooling and methods |
| 04/18/2006 | US7030484 Lidless chip package effectively having co-planar frame and semiconductor die surfaces |
| 04/18/2006 | US7030483 Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application |
| 04/18/2006 | US7030482 Method and apparatus for protecting a die ESD events |
| 04/18/2006 | US7030481 High density chip carrier with integrated passive devices |
| 04/18/2006 | US7030480 Multilayer board and a semiconductor device |
| 04/18/2006 | US7030479 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 04/18/2006 | US7030478 Semiconductor device |
| 04/18/2006 | US7030477 Optical semiconductor device |
| 04/18/2006 | US7030476 Rectifier diode device |
| 04/18/2006 | US7030475 Method and apparatus for forming a thin film |
| 04/18/2006 | US7030474 Plastic integrated circuit package and method and leadframe for making the package |
| 04/18/2006 | US7030473 Substrate-based IC package |
| 04/18/2006 | US7030472 Integrated circuit device having flexible leadframe |
| 04/18/2006 | US7030471 Semiconductor package containing an integrated-circuit chip supported by electrical connection leads |
| 04/18/2006 | US7030469 Method of forming a semiconductor package and structure thereof |
| 04/18/2006 | US7030468 Low k and ultra low k SiCOH dielectric films and methods to form the same |
| 04/18/2006 | US7030461 Device for electrostatic discharge protection |
| 04/18/2006 | US7030460 Selectable capacitance apparatus and methods |
| 04/18/2006 | US7030459 Three-dimensional memory structure and manufacturing method thereof |
| 04/18/2006 | US7030458 Gate dielectric antifuse circuits and methods for operating same |
| 04/18/2006 | US7030455 Integrated electromagnetic shielding device |
| 04/18/2006 | US7030449 Semiconductor integrated circuit device having capacitor element |
| 04/18/2006 | US7030447 Low voltage transient voltage suppressor |
| 04/18/2006 | US7030445 Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 04/18/2006 | US7030429 Hetero-junction bipolar transistor and the method for producing the same |
| 04/18/2006 | US7030418 Chip carrier does not deteriorate the frequency characteristics of optical semiconductor operating at a high speed |
| 04/18/2006 | US7030411 Electronic unit integrated into a flexible polymer body |
| 04/18/2006 | US7030317 Electronic assembly with stacked integrated circuit die |
| 04/18/2006 | US7030316 Insert molding electronic devices |
| 04/18/2006 | US7030258 Water-capturing agent and organic EL device |
| 04/18/2006 | US7030033 Method for manufacturing circuit devices |
| 04/18/2006 | US7030030 Method of manufacturing a semiconductor integrated circuit device having a plurality of wiring layers and mask-pattern generation method |
| 04/18/2006 | US7030022 Method of manufacturing semiconductor device having metal interconnections of different thickness |
| 04/18/2006 | US7030012 Method for manufacturing tungsten/polysilicon word line structure in vertical DRAM |
| 04/18/2006 | US7030010 Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures |
| 04/18/2006 | US7030009 Method for forming metal interconnect in a carbon containing silicon oxide film |
| 04/18/2006 | US7030005 Method of manufacturing semiconductor device |
| 04/18/2006 | US7030004 Method for forming bond pad openings |
| 04/18/2006 | US7030001 Method for forming a gate electrode having a metal |
| 04/18/2006 | US7029981 Radiation hardened bipolar junction transistor |
| 04/18/2006 | US7029957 Method of manufacturing semiconductor device having thin film SOI structure |
| 04/18/2006 | US7029955 Optically and electrically programmable silicided polysilicon fuse device |
| 04/18/2006 | US7029954 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 04/18/2006 | US7029953 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 04/18/2006 | US7029952 Method for making a semiconductor package and semiconductor package with integrated circuit chips |
| 04/18/2006 | US7029951 Cooling system for a semiconductor device and method of fabricating same |
| 04/18/2006 | US7029950 Thin-film semiconductor device and method of manufacturing the same |
| 04/18/2006 | US7029949 Method for fabricating encapsulated semiconductor components having conductive vias |
| 04/18/2006 | US7029948 Semiconductor wafer overcoated with dielectrics; multuilater; spherical electrode; encapsulation |
| 04/18/2006 | US7029947 Flip chip in leaded molded package with two dies |
| 04/18/2006 | US7029946 Method for manufacturing semiconductor device and semiconductor device |
| 04/18/2006 | US7029937 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 04/18/2006 | US7029931 Stacked die module and techniques for forming a stacked die module |
| 04/18/2006 | US7029927 Method of repairing an integrated electronic circuit using a formed electrical isolation |
| 04/18/2006 | US7029723 Forming chemical vapor depositable low dielectric constant layers |
| 04/18/2006 | US7029605 Borazine skeletal molecules in an inorganic or organic material molecule |
| 04/18/2006 | US7029289 Interconnection device and system |
| 04/18/2006 | US7029288 Electrical contact and connector and method of manufacture |
| 04/18/2006 | US7029256 Leadframe and method for removing cleaning compound flash from mold vents |
| 04/18/2006 | US7029186 Solid-state imaging apparatus and manufacturing method thereof |
| 04/18/2006 | US7028879 System for depositing connection sites on micro C-4 semiconductor die |
| 04/18/2006 | US7028761 Integrated liquid cooling system for electrical components |
| 04/18/2006 | US7028760 Integrated circuit heat pipe heat spreader with through mounting holes |
| 04/18/2006 | US7028759 Heat transfer device and method of making same |
| 04/18/2006 | US7028758 Heat dissipating device with heat pipe |
| 04/18/2006 | US7028755 Heat dissipation device with interlocking fin plates |
| 04/18/2006 | US7028754 High surface area heat sink |
| 04/18/2006 | US7028753 Apparatus to enhance cooling of electronic device |
| 04/18/2006 | CA2383310C Device and method for absorbing and radiating heat in very small space by alternately pushing two fluids |
| 04/13/2006 | WO2006039633A2 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
| 04/13/2006 | WO2006039294A1 Thermally conductive composite and uses for microelectronic packaging |
| 04/13/2006 | WO2006039254A2 Face to face bonded i/o circuit die and functional logic circuit die system |
| 04/13/2006 | WO2006039236A2 Gap-change sensing through capacitive techniques |
| 04/13/2006 | WO2006039176A1 Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same |
| 04/13/2006 | WO2006038927A1 Cooling tube in electronic devices |
| 04/13/2006 | WO2006038644A1 High withstand voltage semiconductor device covered with resin and process for producing the same |
| 04/13/2006 | WO2006038530A1 Epoxy resin composition for optical semiconductor encapsulation |
| 04/13/2006 | WO2006038395A1 Electronic apparatus using anodic bonded structure |