| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/20/2006 | US20060081791 Alignment systems and methods for lithographic systems |
| 04/20/2006 | US20060081790 Alignment systems and methods for lithographic systems |
| 04/20/2006 | US20060081497 Tamper-resistant packaging and approach |
| 04/20/2006 | DE4333373B4 Elektronisches Gerät Electronic Instrument |
| 04/20/2006 | DE202006000922U1 Structured semiconductor chip, for use with electronic component, has passivation layer made of silicon carbide comprising high breaking point/tensile strength, where layer is provided on silicon oxide layer |
| 04/20/2006 | DE19611407B4 Halbleiterbaustein und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 04/20/2006 | DE112004000864T5 Licht abstrahlende Dioden - Baugruppe und Licht abstrahlendes Diodensystem mit mindestens zwei Wärmesenken Light-emitting diodes - assembly and light-emitting diode system with at least two heat sinks |
| 04/20/2006 | DE10301480B4 Verfahren zur Herstellung von Halbleiter-Bauelement-Pins Process for the preparation of semiconductor device pins |
| 04/20/2006 | DE10221706B4 TO-Gehäuse für Hochfrequenzanwendungen TO package for high frequency applications |
| 04/20/2006 | DE102005049575A1 Halbleitervorrichtung mit Aluminiumelektrode und Metallelektrode A semiconductor device comprising aluminum electrode and metal electrode |
| 04/20/2006 | DE102005048678A1 Verfahren zum Bearbeiten einer flexiblen Schaltungsplatte A method for processing a flexible circuit board |
| 04/20/2006 | DE102005043649A1 Lichtemissionsbauteil mit Stromkreis-Schutzschaltung Light emitting device with circuit protection circuit |
| 04/20/2006 | DE102004062994A1 Semiconductor component with semiconductor chip and flip-chip contacts, including flat pattern on reverse side of chip to allow precise orientation of chip with wiring substrate surfaces |
| 04/20/2006 | DE102004050792A1 Bauelemente-Modul für Hochtemperaturanwendungen und Verfahren zum Herstellen eines derartigen Bauelemente-Moduls Components module for high temperature applications and methods for producing such components module |
| 04/20/2006 | DE102004050767A1 Integrierte Schaltung in Smart-Power-Technologie Integrated circuit in smart power technology |
| 04/20/2006 | DE102004050588A1 Kontakteinrichtung für Leistungshalbleitermodule und Scheibenzellen Contact device for power semiconductor modules and disc cells |
| 04/20/2006 | DE102004050177A1 Wiring system for electronic component containing material interface on surface of wafer supporting wiring system, consists of conductive tracks, in which at least one track continuously surmounts interface(s) between different materials |
| 04/20/2006 | DE102004049453A1 Elektrischer Schaltkreis mit einer Nanostruktur und Verfahren zum Herstellen einer Kontaktierung einer Nanostruktur Electrical circuit with a nanostructure and methods for manufacturing a contact of a nanostructure |
| 04/20/2006 | DE102004048908A1 Antriebsstrang für ein Fahrzeug mit elektrischer Maschine Driveline for a vehicle with electric machine |
| 04/20/2006 | DE102004047059A1 Leiterrahmen für ein elektronisches Bauelement und Verfahren zu dessen Herstellung Lead frame for an electronic device and method for its production |
| 04/20/2006 | DE102004046227B3 Verfahren zur Herstellung eines Halbleiterbauteils mit Durchkontakten durch eine Kunststoffgehäusemasse und entsprechendes Halbleiterbauteil A method for manufacturing a semiconductor device having vias through a plastic housing composition and corresponding semiconductor component |
| 04/20/2006 | DE102004044882B3 Halbleitermodul mit gestapelten Halbleiterbauteilen und elektrischen Verbindungselementen zwischen den gestapelten Halbleiterbauteilen A semiconductor module with stacked semiconductor devices and electrical connecting elements between the stacked semiconductor devices |
| 04/20/2006 | DE10106564B4 Bondierungsanschlussflächenanordnung Bondierungsanschlussflächenanordnung |
| 04/20/2006 | DE10102750B4 Schaltungsanordnung Circuitry |
| 04/20/2006 | DE10056281B4 Elektronisches Bauteil mit einem Halbleiterchip Electronic component having a semiconductor chip |
| 04/20/2006 | DE10039185B4 Halbleitervorrichtung mit Potential-Fuse, sowie Verfahren zu ihrer Herstellung A semiconductor device with potential-fuse, as well as processes for their preparation |
| 04/19/2006 | EP1648029A2 Contact device for power semiconductor moduls and disc-shaped semiconductor cells |
| 04/19/2006 | EP1648028A1 Composite electronic component |
| 04/19/2006 | EP1647334A1 Apparatus for two dimensional assembly of particles |
| 04/19/2006 | EP1647173A2 Packaging of semiconductor devices for increased reliability |
| 04/19/2006 | EP1647171A2 Thermal diffusion apparatus |
| 04/19/2006 | EP1647076A2 Cooling method and apparatus |
| 04/19/2006 | EP1647056A1 Encapsulation structure for display devices |
| 04/19/2006 | EP1647052A1 Underfill and mold compounds including siloxane-based aromatic diamines |
| 04/19/2006 | EP1647051A2 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
| 04/19/2006 | EP1454108A4 Heat dissipating component using high conducting inserts |
| 04/19/2006 | CN2773905Y Active evaporating radiator of power semiconductor or module |
| 04/19/2006 | CN2773904Y Radiator of hot-pipe |
| 04/19/2006 | CN2773903Y Radiator |
| 04/19/2006 | CN2773902Y Symmetric radiating module structure with heat collecting tube |
| 04/19/2006 | CN2773901Y Multiway radiator of temperature-homogenizing plate |
| 04/19/2006 | CN2773900Y Embedded power semiconductor packer |
| 04/19/2006 | CN1762054A Bit-cell and method for programming |
| 04/19/2006 | CN1762053A Semiconductor wafer with non-rectangular shaped dice |
| 04/19/2006 | CN1762013A Esd dissipative structural components |
| 04/19/2006 | CN1761714A Molding compositions containing quaternary organophosphonium salts |
| 04/19/2006 | CN1761692A Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
| 04/19/2006 | CN1761545A Electrochemical displacement-deposition method for making composite metal powders |
| 04/19/2006 | CN1761065A Optic device |
| 04/19/2006 | CN1761057A Esd protection circuit |
| 04/19/2006 | CN1761056A Interconnection structure and forming method thereof |
| 04/19/2006 | CN1761055A Structure of conductive pad in use for encapsulating chips |
| 04/19/2006 | CN1761054A Thermal managed interconnect system for a circuit board |
| 04/19/2006 | CN1761053A Structure for encapsulating semiconductor |
| 04/19/2006 | CN1761052A 半导体装置 Semiconductor device |
| 04/19/2006 | CN1761051A Integrated circuit encapsulation body and fabricating method thereof |
| 04/19/2006 | CN1761042A Method and equipment for fabricating structure of compound crystal |
| 04/19/2006 | CN1253063C Electronic module with cooling substrate with fluid dissociation electrodes and related method |
| 04/19/2006 | CN1252919C Ultra thin piezoelectric resonator |
| 04/19/2006 | CN1252873C Zero insertion force electrical connector and conductive terminals |
| 04/19/2006 | CN1252830C Semiconductor device and manufacturing method thereof |
| 04/19/2006 | CN1252825C Semiconductor device and its mfg. method |
| 04/19/2006 | CN1252821C 低压有源半导体体器件 Low-active semiconductor body device |
| 04/19/2006 | CN1252815C 静电放电保护元件 Electrostatic discharge protection device |
| 04/19/2006 | CN1252814C I/O port with high voltage tolerance and electrostatic discharge protection circuit |
| 04/19/2006 | CN1252811C Method for forming co-axial interconnect lines in CMOS process |
| 04/19/2006 | CN1252810C Fabrication of semiconductor device with gaps for ultra-low capacitance interconnections |
| 04/19/2006 | CN1252806C Preparation method of gastight packaged cover plate for integrated circuit |
| 04/19/2006 | CN1252753C Lead stripping method, microelectronic element connecting method and element bearing body mfg. system |
| 04/19/2006 | CN1252745C Inductor element |
| 04/19/2006 | CN1252562C Chipset cooling device of video graphic adapter card |
| 04/19/2006 | CN1252561C Cooling apparatus equipped with radiator |
| 04/19/2006 | CN1252560C Radiator-fan holding device and heat radiating device by said holding device |
| 04/19/2006 | CN1252210C Connection material and connection structure body |
| 04/19/2006 | CN1252206C Binder and adhesive film |
| 04/19/2006 | CN1252140C Organohydridosiloxane resins with high organic content |
| 04/19/2006 | CN1252132C Spin-on-dielectric compositions with coating enhancer |
| 04/19/2006 | CN1251960C Method for mfg. microelectromechanical structure and its integrated circuit |
| 04/18/2006 | US7032196 Semiconductor wiring substrate, semiconductor device, method for testing semiconductor device, and method for mounting semiconductor device |
| 04/18/2006 | US7031905 Audio signal processing apparatus |
| 04/18/2006 | US7031652 Wireless local loop antenna |
| 04/18/2006 | US7031509 Method and apparatus for correcting inclination of IC on semiconductor wafer |
| 04/18/2006 | US7031500 Semiconductor apparatus for fingerprint recognition |
| 04/18/2006 | US7031170 Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device |
| 04/18/2006 | US7031166 Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate |
| 04/18/2006 | US7031165 Electronic control unit |
| 04/18/2006 | US7031164 Electronic circuit device including heat-generating element mounted on circuit board |
| 04/18/2006 | US7031163 Mechanical cooling fin for interconnects |
| 04/18/2006 | US7031162 Method and structure for cooling a dual chip module with one high power chip |
| 04/18/2006 | US7031160 Magnetically enhanced convection heat sink |
| 04/18/2006 | US7031159 Parallel heat exchanger for a component in a mobile system |
| 04/18/2006 | US7031155 Electronic thermal management |
| 04/18/2006 | US7030918 Solid-state image pickup device |
| 04/18/2006 | US7030725 Semiconductor device with electrically coupled spiral inductors |
| 04/18/2006 | US7030715 High-frequency semiconductor device |
| 04/18/2006 | US7030712 Radio frequency (RF) circuit board topology |
| 04/18/2006 | US7030651 Programmable structured arrays |
| 04/18/2006 | US7030639 Semiconductor apparatus including a switch element and resistance element connected in series |
| 04/18/2006 | US7030508 Substrate for semiconductor package and wire bonding method using thereof |
| 04/18/2006 | US7030507 Test pattern of semiconductor device |