| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/25/2006 | US7033935 Semiconductor device and method for manufacturing the same |
| 04/25/2006 | US7033934 Method of production of semiconductor package |
| 04/25/2006 | US7033930 Interconnect structures in a semiconductor device and processes of formation |
| 04/25/2006 | US7033929 Dual damascene interconnect structure with improved electro migration lifetimes |
| 04/25/2006 | US7033927 Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer |
| 04/25/2006 | US7033926 Strip conductor arrangement and method for producing a strip conductor arrangement |
| 04/25/2006 | US7033924 Versatile system for diffusion limiting void formation |
| 04/25/2006 | US7033923 Method of forming segmented ball limiting metallurgy |
| 04/25/2006 | US7033920 Method for fabricating a silicon carbide interconnect for semiconductor components |
| 04/25/2006 | US7033917 Packaging substrate without plating bar and a method of forming the same |
| 04/25/2006 | US7033912 Silicon carbide on diamond substrates and related devices and methods |
| 04/25/2006 | US7033911 Adhesive of folded package |
| 04/25/2006 | US7033906 Airdome enclosure for components |
| 04/25/2006 | US7033901 Buried power buss utilized as a ground strap for high current, high power semiconductor devices and a method for providing the same |
| 04/25/2006 | US7033884 Methods of forming capacitor constructions |
| 04/25/2006 | US7033867 Shallow trench antifuse and methods of making and using same |
| 04/25/2006 | US7033866 Method for making dual gauge leadframe |
| 04/25/2006 | US7033865 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 04/25/2006 | US7033863 Semiconductor device and manufacturing method for the same |
| 04/25/2006 | US7033862 Method of embedding semiconductor element in carrier and embedded structure thereof |
| 04/25/2006 | US7033860 Process for manufacturing semiconductor device |
| 04/25/2006 | US7033857 Method of manufacturing a semiconductor device |
| 04/25/2006 | US7033846 Method for manufacturing semiconductor devices by monitoring nitrogen bearing species in gate oxide layer |
| 04/25/2006 | US7033664 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
| 04/25/2006 | US7032392 Method and apparatus for cooling an integrated circuit package using a cooling fluid |
| 04/25/2006 | US7032311 Stabilized wire bonded electrical connections and method of making same |
| 04/25/2006 | US7032305 Method for mounting integrated circuits on a printed circuit card |
| 04/20/2006 | WO2006042029A2 Structure and method of making interconnect element having metal traces embedded in surface of dielectric |
| 04/20/2006 | WO2006041580A1 3d interconnect with protruding contacts |
| 04/20/2006 | WO2006041068A1 Packaging method of electronic component |
| 04/20/2006 | WO2006041013A1 Semiconductor device |
| 04/20/2006 | WO2006040987A1 Method of producing physical quantity sensor |
| 04/20/2006 | WO2006040986A1 Light-receiving device |
| 04/20/2006 | WO2004068558A3 Package for integrated circuit die |
| 04/20/2006 | US20060084401 Integrated structure of inductances with shared values on a semiconductor substrate |
| 04/20/2006 | US20060084297 Anisotropic conductive sheet, its manufacturing method, and its application |
| 04/20/2006 | US20060084285 Circuit carrier and production thereof |
| 04/20/2006 | US20060084258 Semiconductor device and method of manufacturing the same |
| 04/20/2006 | US20060084250 Methods of making microelectronic packages with conductive elastomeric posts |
| 04/20/2006 | US20060084240 Apparatus and method for packaging circuits |
| 04/20/2006 | US20060084197 Wafer-level diamond spreader |
| 04/20/2006 | US20060083930 Dielectric material and dielectric sintered body, and wiring board using the same |
| 04/20/2006 | US20060083459 Optic device |
| 04/20/2006 | US20060082983 Leadframe-based module DC bus design to reduce module inductance |
| 04/20/2006 | US20060082974 Heat dissipation system for multiple integrated circuits mounted on a printed circuit board |
| 04/20/2006 | US20060082968 Fool-proof device on heatsink thermal module for the notebook computer |
| 04/20/2006 | US20060082718 Display device |
| 04/20/2006 | US20060082390 Process for obtaining a thin, insulating, soft magnetic film of high magnetization |
| 04/20/2006 | US20060082021 Leadframe and method for reducing mold compound adhesion problems |
| 04/20/2006 | US20060082004 Methods of forming memory circuitry |
| 04/20/2006 | US20060082003 Method of dicing a semiconductor device into plural chips |
| 04/20/2006 | US20060082002 Sheet for circuit substrates and sheet of a circuit substrate for displays |
| 04/20/2006 | US20060082001 Printed wiring board and information processing device incorporating the board |
| 04/20/2006 | US20060082000 Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits |
| 04/20/2006 | US20060081999 Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
| 04/20/2006 | US20060081998 Methods of forming in package integrated capacitors and structures formed thereby |
| 04/20/2006 | US20060081997 Liquid crystal display |
| 04/20/2006 | US20060081996 Semiconductor device having aluminum electrode and metallic electrode |
| 04/20/2006 | US20060081995 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device |
| 04/20/2006 | US20060081994 Assembly |
| 04/20/2006 | US20060081993 High luminance coated glass |
| 04/20/2006 | US20060081992 Semiconductor device with a fluorinated silicate glass film as an interlayer metal dielectric film, and manufacturing method thereof |
| 04/20/2006 | US20060081991 Computer automated design system, a computer automated design method, and a semiconductor integrated circuit |
| 04/20/2006 | US20060081989 Structure of polymer-matrix conductive film and method for fabricating the same |
| 04/20/2006 | US20060081988 Shapes-based migration of aluminum designs to copper damascene |
| 04/20/2006 | US20060081987 Semiconductor device and method for fabricating the same |
| 04/20/2006 | US20060081986 Modified via bottom structure for reliability enhancement |
| 04/20/2006 | US20060081985 III-nitride power semiconductor device with a current sense electrode |
| 04/20/2006 | US20060081984 Power grid layout techniques on integrated circuits |
| 04/20/2006 | US20060081983 Wafer level microelectronic packaging with double isolation |
| 04/20/2006 | US20060081982 Chip Scale Package with Micro Antenna and Method for Manufacturing the same |
| 04/20/2006 | US20060081981 Method of forming a bond pad on an I/C chip and resulting structure |
| 04/20/2006 | US20060081980 Integrated circuit package employing a heat-spreader member |
| 04/20/2006 | US20060081979 Thermal properties for microelectronic devices |
| 04/20/2006 | US20060081978 Heat dissipating package structure and method for fabricating the same |
| 04/20/2006 | US20060081977 Ceramic multilayer substrate |
| 04/20/2006 | US20060081976 Fabrication of semiconductor dies with micro-pins and structures produced therewith |
| 04/20/2006 | US20060081975 Substrate supporting frame |
| 04/20/2006 | US20060081974 Electronic part mounting apparatus and method |
| 04/20/2006 | US20060081973 Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure |
| 04/20/2006 | US20060081972 Fine pitch grid array type semiconductor device |
| 04/20/2006 | US20060081971 Signal transfer methods for integrated circuits |
| 04/20/2006 | US20060081970 Memory card module with an inlay design |
| 04/20/2006 | US20060081969 Package structure module of bump posited type lead frame |
| 04/20/2006 | US20060081968 Semiconductor package |
| 04/20/2006 | US20060081967 Multichip leadframe package |
| 04/20/2006 | US20060081966 Chip-scale packages |
| 04/20/2006 | US20060081965 Plasma treatment of an etch stop layer |
| 04/20/2006 | US20060081960 Integrated capacitor on packaging substrate |
| 04/20/2006 | US20060081959 Poly-silicon stringer fuse |
| 04/20/2006 | US20060081935 ESD protection devices with SCR structures for semiconductor integrated circuits |
| 04/20/2006 | US20060081934 Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same |
| 04/20/2006 | US20060081933 Electrostatic discharge protection device with complementary dual drain implant |
| 04/20/2006 | US20060081927 Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation |
| 04/20/2006 | US20060081912 Electronic memory component with protection against light attack |
| 04/20/2006 | US20060081870 Method of forming a lamination film pattern and improved lamination film pattern |
| 04/20/2006 | US20060081857 Light emitting device having circuit protection unit |
| 04/20/2006 | US20060081842 Monitor pattern of semiconductor device and method of manufacturing semiconductor device |
| 04/20/2006 | US20060081833 Package structure of light-emitting device |
| 04/20/2006 | US20060081792 Alignment systems and methods for lithographic systems |