Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/24/2014US20140110837 Routing layer for mitigating stress in a semiconductor die
04/24/2014US20140110836 Packaging Devices, Methods of Manufacture Thereof, and Packaging Methods
04/24/2014US20140110835 Bump Package and Methods of Formation Thereof
04/24/2014US20140110834 Semiconductor element cooling structure
04/24/2014US20140110833 Power module package
04/24/2014US20140110831 Multi-chip package and method of manufacturing the same
04/24/2014US20140110830 Semiconductor package
04/24/2014US20140110829 Module Comprising a Semiconductor Chip
04/24/2014US20140110828 Semiconductor Packages and Methods of Formation Thereof
04/24/2014US20140110827 Pressed-contact type semiconductor device and method for manufacturing the same
04/24/2014US20140110819 Ballasted polycrystalline fuse
04/24/2014US20140110796 Semiconductor Package with Conductive Carrier Integrated Heat Spreader
04/24/2014US20140110789 Semiconductor device and a method of manufacturing the same
04/24/2014US20140110776 Semiconductor Package Including Conductive Carrier Coupled Power Switches
04/24/2014US20140110752 Power Module and Method of Manufacturing the Power Module
04/24/2014US20140110711 Stacked chip module with integrated circuit chips having integratable built-in self-maintenance blocks
04/24/2014US20140110710 Stacked chip module with integrated circuit chips having integratable and reconfigurable built-in self-maintenance blocks
04/24/2014US20140110461 System and method for cleaning bond wire
04/24/2014US20140110089 Air duct and heat dissipation system having the same
04/24/2014DE112012002949T5 Wärmeübertragungssytem mit einem eingebautem Verdampfer und Kühler Wärmeübertragungssytem with a built-in evaporator and condenser
04/24/2014DE112012000369T5 Schaltvorrichtung mit Freilaufdiode Switching device with freewheeling diode
04/24/2014DE112006001431B4 Verfahren zum Bilden von einer Durchkontaktierung in einer integrierten Schaltung eines Halbleiterpackages A method of forming a via in an integrated circuit of a semiconductor package
04/24/2014DE10315176B4 Überspannungsschutzschaltung An overvoltage protection circuit
04/24/2014DE102013111569A1 Semiconductor package of semiconductor system, has chip that is provided with several contact pads on first major surface, and substrate that is located in first Vias tab that is provided with first antenna structure
04/24/2014DE102013111540A1 Höckergehäuse und Verfahren zu seiner Herstellung Hump ​​housing and method for its preparation
04/24/2014DE102013111452A1 Halbleitervorrichtungen und Halbleiterverarbeitungsverfahren Semiconductor devices and semiconductor processing method
04/24/2014DE102013110404A1 Chipanordnungen, ein Chip Package und ein Verfahren zum Herstellen einer Chipanordnung Chip arrays, a chip package and a method for producing a chip arrangement
04/24/2014DE102013105084A1 Bump-on-trace-verbindungsstruktur für flip-chip-gehäuse Bump-on-trace interconnect structure for flip-chip package
04/24/2014DE102013104949B3 Leistungselektronische Schalteinrichtung und Anordnung hiermit Power electronic switching device and assembly hereby
04/24/2014DE102012109995A1 Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and patterning portion that is provided with elongated recess
04/23/2014EP2722975A1 Cooled electrical assembly
04/23/2014EP2722904A2 Using stress reduction barrier sub-layers in a semiconductor die
04/23/2014EP2722886A1 Power converter package including vertically stacked driver IC
04/23/2014EP2722884A1 Semiconductor package with conductive carrier integrated heat spreader
04/23/2014EP2722883A1 Semiconductor package including conductive carrier coupled power switches
04/23/2014EP2722882A2 Semiconductor devices with impedance matching circuits, and methods of manufacture thereof
04/23/2014EP2722881A1 Power RF amplifiers
04/23/2014EP2722880A1 Amplifier circuits
04/23/2014EP2722879A1 Semiconductor unit and semiconductor device using same
04/23/2014EP2722878A1 Semiconductor device and method for manufacturing semiconductor device
04/23/2014EP2722877A1 Cooling structure for semiconductor element
04/23/2014EP2722876A2 Embedded chip packages and methods for manufacturing an embedded chip package
04/23/2014EP2722648A2 Absolute position measuring device
04/23/2014EP2721996A1 Sealing cap for an connector with an electrical connection
04/23/2014EP2721638A1 Stress-aware design for integrated circuits
04/23/2014EP2721637A1 Electronic circuit arrangement having components emitting lost heat
04/23/2014EP2721636A1 Semiconductor unit with submount for semiconductor device
04/23/2014EP2721345A2 Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode
04/23/2014EP2720610A1 Connectors for making connections between analyte sensors and other devices
04/23/2014CN203563290U Integrated phase transition heat dissipation device of fin built-in multichannel heat pipe
04/23/2014CN203562427U Static random access memory with shared contact plug
04/23/2014CN203562426U Laser-trimmed integrated chip structure
04/23/2014CN203562425U Power module
04/23/2014CN203562422U Semiconductor device
04/23/2014CN203562421U Metal wiring structure of integrated circuit
04/23/2014CN203562420U A semiconductor package piece
04/23/2014CN203562419U Triode
04/23/2014CN203562418U Temperature control cooling fin for MOS tube
04/23/2014CN203562417U A high temperature-resisting and high-elasticity compressing sheet for an automobile power amplifier
04/23/2014CN203562416U A novel heat dissipater section bar
04/23/2014CN103748976A Sensor with single electrical carrier means
04/23/2014CN103748682A Laminated module and interposer used in same
04/23/2014CN103748681A A system and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3d chip stacks
04/23/2014CN103748680A Semiconductor device
04/23/2014CN103748679A Compliance interconnection pillars having directions or geometrical shapes depending on positions on dies or provided with patterned structure between pillars and spacer of die for reducing thermal stress
04/23/2014CN103748678A Offset interposers for large-bottom packages and large-die package-on-package structures
04/23/2014CN103748677A Power converting apparatus
04/23/2014CN103748676A Mounting structure of laminated module using interposer
04/23/2014CN103748675A Laminated module and interposer used in same
04/23/2014CN103748674A Thermally conductive sheet
04/23/2014CN103748673A Laminate and method for producing component for power semiconductor modules
04/23/2014CN103748672A Substrate, method for producing same, heat-releasing substrate, and heat-releasing module
04/23/2014CN103748146A Method for producing thermally conductive sheet
04/23/2014CN103748140A Curable resin composition and process for producing cured products using same
04/23/2014CN103747654A Water cooling plate for heat dissipation of high-power electrical heating element
04/23/2014CN103747616A Method for manufacturing module with built-in component, and module with built-in component
04/23/2014CN103745985A Active matrix OLED (Organic Light-Emitting Diode) display substrate and display device
04/23/2014CN103745980A Thin film transistor array substrate as well as production method thereof and liquid crystal display device
04/23/2014CN103745979A Current sensor, inverter circuit, and semiconductor device having the same
04/23/2014CN103745975A Thyristor press-fitting structure in modular multilevel converter power module
04/23/2014CN103745974A Ring resistor structure
04/23/2014CN103745973A An ESD protective device and an ESD circuit suitable for a cell management chip
04/23/2014CN103745972A One-way conductive plate and manufacturing method thereof
04/23/2014CN103745971A Integrated circuit copper interconnection structure and preparation method thereof
04/23/2014CN103745970A Array base plate, manufacturing method of array base plate, restoring method of array base plate and display device
04/23/2014CN103745969A Optical communication interconnection through-X-via (TXV) 3D integrated package and packaging method
04/23/2014CN103745968A Packaging structure and preparation method thereof
04/23/2014CN103745967A Lead frame and packaging structure
04/23/2014CN103745966A Auxiliary graph structure for electroplating package substrate surface copper cylinders
04/23/2014CN103745965A Packaging structure
04/23/2014CN103745964A Packaging structure
04/23/2014CN103745963A Copper-based lead and semiconductor packaging structure carried with same
04/23/2014CN103745962A IGBT module suitable for electric automobile inverter, and packaging method and application method
04/23/2014CN103745961A Radiator
04/23/2014CN103745960A Miniature semiconductor heat radiation device
04/23/2014CN103745959A Three-dimension system packaging structure based on rigid-flexible combined printed circuit board
04/23/2014CN103745958A Packaging structure
04/23/2014CN103745957A AAQFN packaging part capable of enhancing heat radiation and technology for manufacture same AAQFN packaging part
04/23/2014CN103745941A Electric performance test method for gate dielectric
04/23/2014CN103744242A Thin film transistor liquid crystal display device and signal line thereof
1 ... 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 ... 2262