| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/26/2006 | EP1649493A2 Nested voltage island architecture |
| 04/26/2006 | EP1649412A1 Chip card, chip card module and method for the production of a chip card module |
| 04/26/2006 | EP1599904A4 Lateral lubistor structure and method |
| 04/26/2006 | EP1570280B1 Self-marking device for an integrated circuit, and associated housed integrated circuit |
| 04/26/2006 | EP1554753B1 Method for producing a stepped edge profile out of a layered construction |
| 04/26/2006 | EP0951808B1 A combined electrical and optical edge contact for compact connection of a part to another part, a use thereof and a method of manufacturing such an interconnection |
| 04/26/2006 | CN2775988Y Packaged integrated circuit high power LED driver |
| 04/26/2006 | CN2775842Y 半导体电路 Semiconductor circuit |
| 04/26/2006 | CN2775841Y Metal conductive wire structure |
| 04/26/2006 | CN2775840Y Chip packaging structure without side leading leg |
| 04/26/2006 | CN2775839Y Cold plate device |
| 04/26/2006 | CN2775838Y Integrated liquid cooling heat radiator |
| 04/26/2006 | CN2775837Y Aluminum-copper combined integrated circuit heat radiator using heat pipe technology |
| 04/26/2006 | CN2775836Y Multidirection radiator |
| 04/26/2006 | CN2775835Y Heat pipe radiator |
| 04/26/2006 | CN2775833Y Top cover machien of shaping table free calibration |
| 04/26/2006 | CN2775588Y Wind cooling radiator for fluid heat pipe |
| 04/26/2006 | CN1765162A Ceramic multilayer substrate |
| 04/26/2006 | CN1765032A Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method |
| 04/26/2006 | CN1765020A Ball grid array with bumps |
| 04/26/2006 | CN1765019A ARC layer for semiconductor device |
| 04/26/2006 | CN1765018A Heat radiator |
| 04/26/2006 | CN1765017A Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier |
| 04/26/2006 | CN1765016A Laminated electronic part and its manufacturing method |
| 04/26/2006 | CN1765010A Semiconductor device and method of manufacturing thereof |
| 04/26/2006 | CN1764363A Heat radiating apparatus |
| 04/26/2006 | CN1764351A Bank structure, method of forming bank structure, device, electro-optical device and electronic apparatus |
| 04/26/2006 | CN1764335A Method of manufacturing organic electroluminescent device and organic electroluminescent device |
| 04/26/2006 | CN1763966A Solid-state imaging device and method of manufacturing the same |
| 04/26/2006 | CN1763947A Lsi package provided with interface module, and transmission line header employed in the package |
| 04/26/2006 | CN1763945A Static discharge protection circuit and method for providing semiconductor circuit |
| 04/26/2006 | CN1763944A Semiconductor device and manufacturing method thereof |
| 04/26/2006 | CN1763943A Wiring board and wiring board manufacturing method |
| 04/26/2006 | CN1763942A Semiconductor device and a method of assembling a semiconductor device |
| 04/26/2006 | CN1763941A Semiconductor device having aluminum electrode and metallic electrode |
| 04/26/2006 | CN1763940A Contact unit for high power semiconductor module an round disk |
| 04/26/2006 | CN1763939A Semiconductor package structure and producing method thereof |
| 04/26/2006 | CN1763938A Package bonding structure of element |
| 04/26/2006 | CN1763937A Wafer-level photoelectric semiconductor assembling structure and its manufacturing method |
| 04/26/2006 | CN1763936A Electronic component heat sink and its combination |
| 04/26/2006 | CN1763935A Printing circuit board and production method and electronic parts |
| 04/26/2006 | CN1763934A Active block base, lead frame using the same and its manufacturing method |
| 04/26/2006 | CN1763933A Printing circuit board and circuit unit introduced to same |
| 04/26/2006 | CN1763925A Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same |
| 04/26/2006 | CN1763924A Electronic circuit packaging process |
| 04/26/2006 | CN1763886A Closed loop cycle type heat sink and screen module using the same |
| 04/26/2006 | CN1254162C Method for forming circuit folded structure and multilayer printed circuit board and built-in type circuit structure |
| 04/26/2006 | CN1254160C Ceramic electronic component and method of producing the same |
| 04/26/2006 | CN1253964C 高频模块 High-frequency module |
| 04/26/2006 | CN1253939C Jointing washer structure on semiconductor substrate |
| 04/26/2006 | CN1253938C Method for producing the chip card module |
| 04/26/2006 | CN1253937C Structure of hung electronic device |
| 04/26/2006 | CN1253936C Interconnections including multi-layer metal film stack for improving corrosion and heat resistances |
| 04/26/2006 | CN1253932C Semiconductor device manufacturing method |
| 04/25/2006 | US7036105 Integrated circuits with at least one layer that has more than one preferred interconnect direction, and method for manufacturing such IC's |
| 04/25/2006 | US7035301 Packaging for semiconductor laser device and method for producing the same |
| 04/25/2006 | US7035160 Circuit |
| 04/25/2006 | US7035113 Multi-chip electronic package having laminate carrier and method of making same |
| 04/25/2006 | US7035107 High serviceability heatsink retainer method and apparatus |
| 04/25/2006 | US7035106 Heat dissipation system for semiconductor device |
| 04/25/2006 | US7035104 Apparatus for heat transfer and critical heat flux enhancement |
| 04/25/2006 | US7035083 Interdigitated capacitor and method for fabrication thereof |
| 04/25/2006 | US7035081 Semiconductor device |
| 04/25/2006 | US7034653 Semiconductor resistor |
| 04/25/2006 | US7034633 Coupling device using buried capacitors in multilayered substrate |
| 04/25/2006 | US7034559 Integrated test circuit in an integrated circuit |
| 04/25/2006 | US7034406 Semiconductor device with alignment mark |
| 04/25/2006 | US7034405 Blend of magnetic and silica powder in polymer; electromagnetic wave shield; enhancing dielectrics |
| 04/25/2006 | US7034404 Waterproofing; storage stability; blend of epoxy resin and phenolic resin, lacency curing agent and inorganic filler |
| 04/25/2006 | US7034403 Durable electronic assembly with conductive adhesive |
| 04/25/2006 | US7034402 Device with segmented ball limiting metallurgy |
| 04/25/2006 | US7034401 Packaging substrates for integrated circuits and soldering methods |
| 04/25/2006 | US7034400 Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors |
| 04/25/2006 | US7034399 Forming a porous dielectric layer |
| 04/25/2006 | US7034398 Semiconductor device having contact plug and buried conductive film therein |
| 04/25/2006 | US7034397 Oxygen bridge structures and methods to form oxygen bridge structures |
| 04/25/2006 | US7034396 Structure of semiconductor element and its manufacturing process |
| 04/25/2006 | US7034395 Power semiconductor module with cooling element and pressing apparatus |
| 04/25/2006 | US7034394 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
| 04/25/2006 | US7034393 Semiconductor assembly with conductive rim and method of producing the same |
| 04/25/2006 | US7034392 Duplexer |
| 04/25/2006 | US7034391 Flip chip interconnection pad layout |
| 04/25/2006 | US7034390 Semiconductor package having multi-signal bus bars |
| 04/25/2006 | US7034389 Flip chip package, circuit board thereof and packaging method thereof |
| 04/25/2006 | US7034388 Stack type flip-chip package |
| 04/25/2006 | US7034387 Semiconductor multipackage module including processor and memory package assemblies |
| 04/25/2006 | US7034385 Topless semiconductor package |
| 04/25/2006 | US7034384 Integrated circuit adapted for ECO and FIB debug |
| 04/25/2006 | US7034383 Electronic component and panel and method for producing the same |
| 04/25/2006 | US7034382 Leadframe-based chip scale package |
| 04/25/2006 | US7034381 Semiconductor device |
| 04/25/2006 | US7034380 Low-dielectric constant structure with a multilayer stack of thin films with pores |
| 04/25/2006 | US7034378 Fuse structure used in an integrated circuit device |
| 04/25/2006 | US7034371 Biochip for the capacitive stimulation and/or detection of biological tissue and a method for its production |
| 04/25/2006 | US7034366 Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device |
| 04/25/2006 | US7034364 Reduced finger end MOSFET breakdown voltage (BV) for electrostatic discharge (ESD) protection |
| 04/25/2006 | US7034363 Bi-directional EOS/ESD protection device |
| 04/25/2006 | US7034344 Integrated semiconductor power device for multiple battery systems |
| 04/25/2006 | US7034231 Method for the manufacture of printed circuit boards with plated resistors |
| 04/25/2006 | US7033944 Dual damascene process |