| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/27/2006 | WO2006044061A2 Die attach paddle for mounting integrated circuit die |
| 04/27/2006 | WO2006044027A2 Magnetic attachment method for led light engines |
| 04/27/2006 | WO2006043974A2 Nanoengineered thermal meterials based on carbon nanotube array composites |
| 04/27/2006 | WO2006043641A1 Thermoplastic resin composition, molded body thereof and method for producing same |
| 04/27/2006 | WO2006043617A1 Semiconductor wafer and semiconductor device |
| 04/27/2006 | WO2006043554A1 Plasma sputtering film deposition method and equipment |
| 04/27/2006 | WO2006043551A1 Plasma sputtering film deposition method and equipment |
| 04/27/2006 | WO2006043474A1 Composite multilayer substrate and its manufacturing method |
| 04/27/2006 | WO2006043388A1 Module with built-in semiconductor and method for manufacturing the module |
| 04/27/2006 | WO2006043235A1 Substrate with electric contacts and method of manufacturing the same |
| 04/27/2006 | WO2006043185A1 Secure sensor chip |
| 04/27/2006 | WO2006042766A1 Component module for high-temperature applications and method for producing a component module of this type |
| 04/27/2006 | WO2006042498A1 Method for the creation of a layer system and layer system |
| 04/27/2006 | WO2006029091A3 Thermally controlled fluidic self-assembly method and support |
| 04/27/2006 | WO2006000180A3 Bonding film, semiconductor component comprising a bonding film, and method for the production thereof |
| 04/27/2006 | WO2005124860A3 Memory module cooling |
| 04/27/2006 | WO2005122256A3 Voltage booster transistor |
| 04/27/2006 | WO2005114726A3 Stacked module systems and methods |
| 04/27/2006 | WO2005101498A3 HIGH REFLECTIVITY P-CONTACT FOR InGaN LEDs |
| 04/27/2006 | WO2005100899A3 Multiple evaporator heat pipe assisted heat sink |
| 04/27/2006 | US20060089007 In situ deposition of a low K dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application |
| 04/27/2006 | US20060088995 Metal barrier cap fabrication by polymer lift-off |
| 04/27/2006 | US20060088992 Bumping process and structure thereof |
| 04/27/2006 | US20060088956 Method for fabricating semiconductor package with short-prevented lead frame |
| 04/27/2006 | US20060087883 Anti-tamper module |
| 04/27/2006 | US20060087818 Heat sink fastening assembly |
| 04/27/2006 | US20060087817 Heat sink assembly |
| 04/27/2006 | US20060087045 Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
| 04/27/2006 | US20060087044 Electronic component, and system carrier and panel for producing an electronic component |
| 04/27/2006 | US20060087043 Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same |
| 04/27/2006 | US20060087042 Semiconductor device and manufacturing method of the same |
| 04/27/2006 | US20060087041 Semiconductor device |
| 04/27/2006 | US20060087040 Semiconductor device and method of manufacturing the same |
| 04/27/2006 | US20060087039 Ubm structure for improving reliability and performance |
| 04/27/2006 | US20060087038 Packaged device and method of forming same |
| 04/27/2006 | US20060087037 Substrate structure with embedded chip of semiconductor package and method for fabricating the same |
| 04/27/2006 | US20060087036 Chip-size package structure and method of the same |
| 04/27/2006 | US20060087034 Bumping process and structure thereof |
| 04/27/2006 | US20060087033 Molded high density electronic packaging structure for high performance applications |
| 04/27/2006 | US20060087032 Compliant interconnects for semiconductors and micromachines |
| 04/27/2006 | US20060087030 Array capacitor with resistive structure |
| 04/27/2006 | US20060087029 Semiconductor device and method of producing the same |
| 04/27/2006 | US20060087028 Method and system for a pad structure for use with a semiconductor package |
| 04/27/2006 | US20060087027 Semiconductor device capsule |
| 04/27/2006 | US20060087026 Audio amplifier assembly |
| 04/27/2006 | US20060087025 Method of manufacturing a substrate with concave portions, a substrate with concave portions, a microlens substrate, a transmission screen, and a rear projection |
| 04/27/2006 | US20060087024 Method and system for an improved power distribution network for use with a semiconductor device |
| 04/27/2006 | US20060087023 Functional coating of an scfm preform |
| 04/27/2006 | US20060087022 Image sensor assembly and method for fabricating the same |
| 04/27/2006 | US20060087021 Multilayer semiconductor device |
| 04/27/2006 | US20060087020 Semiconductor device and method for producing the same |
| 04/27/2006 | US20060087019 Multi-layer integrated semiconductor structure having an electrical shielding portion |
| 04/27/2006 | US20060087018 Multi-chip image sensor module |
| 04/27/2006 | US20060087017 Image sensor package |
| 04/27/2006 | US20060087016 IC (integrated circuit) card |
| 04/27/2006 | US20060087015 Thermally enhanced molded package for semiconductors |
| 04/27/2006 | US20060087014 Bolster plate assembly for processor module assembly |
| 04/27/2006 | US20060087013 Stacked multiple integrated circuit die package assembly |
| 04/27/2006 | US20060087012 System to control effective series resistance of power delivery circuit |
| 04/27/2006 | US20060087011 Wired circuit board |
| 04/27/2006 | US20060087010 IC substrate and manufacturing method thereof and semiconductor element package thereby |
| 04/27/2006 | US20060087009 Cavity-down multiple-chip package |
| 04/27/2006 | US20060087008 Wafer dividing apparatus |
| 04/27/2006 | US20060087007 Wafer treating apparatus and method |
| 04/27/2006 | US20060086984 Method Of Assessing Potential For Charging Damage In Integrated Circuit Designs And Structures For Preventing Charging Damage |
| 04/27/2006 | US20060086983 Electrostatic protective element of semiconductor integrated circuit |
| 04/27/2006 | US20060086937 Tft array substrate, liquid crystal display device, manufacturing methods of tft array substrate and liquid crystal display device, and electronic device |
| 04/27/2006 | US20060086910 Alignment systems and methods for lithographic systems |
| 04/27/2006 | US20060086899 Structure of image sensor package |
| 04/27/2006 | US20060086890 Package structure of image sensor device |
| 04/27/2006 | US20060086804 Communication device and package thereof |
| 04/27/2006 | US20060086702 Energy-efficient, laser-based method and system for processing target material |
| 04/27/2006 | US20060086531 Electronic part manufacturing method and electronic part |
| 04/27/2006 | US20060086483 Heat pipe structure and method for fabricating the same |
| 04/27/2006 | DE69734419T2 Material für Halbleiter-Trägersubstrat und seine Herstellung Material for semiconductor carrier substrate and its preparation |
| 04/27/2006 | DE19703223B4 Verfahren zur Herstellung einer Elektrode einer Halbleitereinrichtung A process for producing an electrode of a semiconductor device |
| 04/27/2006 | DE10394263T5 Verfahren zur Herstellung von Mehrebenenkontakten durch Dimensionierung von Kontaktgrössen in integrierten Schaltungen A process for producing multi-level contacts by dimensioning of contact sizes in integrated circuits |
| 04/27/2006 | DE10394239T5 Integriertes Schaltungsgehäuse Integrated circuit package |
| 04/27/2006 | DE10344454B4 Klebstoffauftragevorrichtung für flexible bandartige Trägersubstrate Adhesive applicator for flexible ribbon-like substrates |
| 04/27/2006 | DE10321257B4 Optische oder optoelektronische Anordnung mit mindestens einem auf einem Metallträger angeordneten optoelektronischen Bauelement Optical or optoelectronic arrangement with at least one arranged on a metal carrier optoelectronic component |
| 04/27/2006 | DE10255621B4 Optisches Sender-Empfängermodul, Verfahren zur Herstellung desselben und das Modul verwendende elektronische Vorrichtung An optical transceiver module, method for producing the same, and the module used electronic device |
| 04/27/2006 | DE102005047038A1 Spannungsversorgungsrauschunterdrückungsschaltung und - verfahren Power supply noise reduction circuit and - procedures |
| 04/27/2006 | DE102005010350A1 LED-Herstellungsverfahren LED manufacturing process |
| 04/27/2006 | DE102004058413A1 Chip-size package manufacture involves patterning dielectric layer to form openings exposing conductive lines |
| 04/27/2006 | DE102004052096A1 Semiconductor control element made of monolithic integrated serial connection of field-effect controlled transistors whereby a gate connection is lead through one transistor and control voltage source is joined between it and drain contact |
| 04/27/2006 | DE10143932B4 Shunt-Widerstandanordnung Shunt resistor arrangement |
| 04/27/2006 | DE10132169B4 Halbleitermodul Semiconductor module |
| 04/27/2006 | DE10039927B4 Oberflächenmontierbares Gehäuse für ein elektronisches Bauelement Surface-mountable housing for an electronic component |
| 04/26/2006 | EP1650805A2 Semiconductor integrated circuit modules, manufacturing methods and usage thereof |
| 04/26/2006 | EP1650804A2 Semiconductor integrated circuit modules, manufacturing methods and usage thereof |
| 04/26/2006 | EP1650802A2 Semiconductor monitoring device and manufacturing method thereof |
| 04/26/2006 | EP1650801A2 Method and apparatus to facilitate capacitive communication between chips |
| 04/26/2006 | EP1650800A2 Power semiconductor module with pressure contact device |
| 04/26/2006 | EP1650799A2 Heat radiating apparatus |
| 04/26/2006 | EP1650798A2 A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
| 04/26/2006 | EP1650797A2 Wiring apparatus , protecting cap for device package using the same, and a method for manufacturing them |
| 04/26/2006 | EP1649736A2 Cooling device for an electronic component, especially for a microprocessor |
| 04/26/2006 | EP1649512A2 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| 04/26/2006 | EP1649508A2 Methods of forming conductive structures including titanium-tungsten base layers and related structures |
| 04/26/2006 | EP1649507A2 Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump |