| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/03/2006 | CN1767168A Differentially doped copper enchasing structure and its manufacturing method |
| 05/03/2006 | CN1767162A Chip-size package structure and forming method of the same |
| 05/03/2006 | CN1767161A Radiation type packaging structure and its making method |
| 05/03/2006 | CN1255012C Power supply device |
| 05/03/2006 | CN1255011C Method for manufacturing a heat sink |
| 05/03/2006 | CN1254916C Semiconductor integrated circuit device |
| 05/03/2006 | CN1254914C Surface acoustic wave device and method of manufacturing device |
| 05/03/2006 | CN1254886C Wiring board with terminal |
| 05/03/2006 | CN1254862C Non-lead solder lug and its manufacturing method |
| 05/03/2006 | CN1254861C Manufacturing method of circuit device |
| 05/03/2006 | CN1254860C Manufacturing method of circuit device |
| 05/03/2006 | CN1254859C Manufacturing method of circuit device |
| 05/03/2006 | CN1254858C Electronic chip component comprising integrated circuit and method for producing same |
| 05/03/2006 | CN1254857C Chip sticking means and chip sticking method |
| 05/03/2006 | CN1254856C Manufacturing method of circuit device |
| 05/03/2006 | CN1254512C Material for insulating substrate, printed circuit board, laminate, copper foil with resin, copper-clad laminate, polymide film, film and prepreg for TAB |
| 05/03/2006 | CN1254507C Adhesive composition and adhesive sheet for semiconductor device |
| 05/02/2006 | US7039890 Integrated circuit layout method and program thereof permitting wire delay adjustment |
| 05/02/2006 | US7039381 On-chip differential inductor and applications thereof |
| 05/02/2006 | US7038917 Low loss, high density array interconnection |
| 05/02/2006 | US7038914 Processor module mounting assembly and a method of use |
| 05/02/2006 | US7038913 Heat dissipation assembly including heat sink and fan |
| 05/02/2006 | US7038904 Capacitor and method of producing same |
| 05/02/2006 | US7038898 ESD protection circuit that can tolerate a negative input voltage during normal (non-ESD) operation |
| 05/02/2006 | US7038777 Semiconductor wafer bearing alignment mark for use in aligning the wafer with exposure equipment, alignment system for producing alignment signals from the alignment mark, and method of determining the aligned state of a wafer from the alignment mark |
| 05/02/2006 | US7038553 Scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 05/02/2006 | US7038477 Contactor having conductive particles in a hole as a contact electrode |
| 05/02/2006 | US7038469 Method of determining localized electron tunneling in a capacitive structure |
| 05/02/2006 | US7038378 Sealing substrate, method of fabricating the same, display device, and electronic instrument |
| 05/02/2006 | US7038328 Anti-reflective compositions comprising triazine compounds |
| 05/02/2006 | US7038327 Anisotropic conductive film bonding pad |
| 05/02/2006 | US7038326 IC chip packaging for reducing bond wire length |
| 05/02/2006 | US7038325 Wiring tape for semiconductor device including a buffer layer having interconnected foams |
| 05/02/2006 | US7038323 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 05/02/2006 | US7038322 Multi-chip module |
| 05/02/2006 | US7038321 Method of attaching a flip chip device and circuit assembly formed thereby |
| 05/02/2006 | US7038320 Single damascene integration scheme for preventing copper contamination of dielectric layer |
| 05/02/2006 | US7038319 Apparatus and method to reduce signal cross-talk |
| 05/02/2006 | US7038318 Compound structure for reduced contact resistance |
| 05/02/2006 | US7038317 Semiconductor device and method of manufacturing same |
| 05/02/2006 | US7038316 Bumpless die and heat spreader lid module bonded to bumped die carrier |
| 05/02/2006 | US7038315 Semiconductor chip package |
| 05/02/2006 | US7038313 Semiconductor device and method of manufacturing the same |
| 05/02/2006 | US7038312 Die-up ball grid array package with attached stiffener ring |
| 05/02/2006 | US7038311 Thermally enhanced semiconductor package |
| 05/02/2006 | US7038310 Power module with improved heat dissipation |
| 05/02/2006 | US7038309 Chip package structure with glass substrate |
| 05/02/2006 | US7038308 Multi-path bar bond connector for an integrated circuit assembly |
| 05/02/2006 | US7038307 Semiconductor chip with FIB protection |
| 05/02/2006 | US7038306 Semiconductor integrated circuit device and method of manufacturing the same |
| 05/02/2006 | US7038305 Package for integrated circuit die |
| 05/02/2006 | US7038304 Semiconductor memory device and manufacturing method thereof |
| 05/02/2006 | US7038303 Semiconductor device and method for manufacturing the same |
| 05/02/2006 | US7038302 Glass substrate assembly, semiconductor device and method of heat-treating glass substrate |
| 05/02/2006 | US7038296 Electrical component structure |
| 05/02/2006 | US7038294 Planar spiral inductor structure with patterned microelectronic structure integral thereto |
| 05/02/2006 | US7038287 Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |
| 05/02/2006 | US7038280 Integrated circuit bond pad structures and methods of making |
| 05/02/2006 | US7038279 Process parameter event monitoring system and method for process |
| 05/02/2006 | US7038257 System and method for providing scalability in an integrated circuit |
| 05/02/2006 | US7038248 Diverse band gap energy level semiconductor device |
| 05/02/2006 | US7038233 Semiconductor optical devices and optical modules |
| 05/02/2006 | US7038224 Contact opening metrology |
| 05/02/2006 | US7038144 Electronic component and method and structure for mounting semiconductor device |
| 05/02/2006 | US7038142 Support for semiconductor; core substrate, fiber reinforced metal, dielectrics and connecting layer; lightweight, thin films; rigidity |
| 05/02/2006 | US7038128 Method of producing a module |
| 05/02/2006 | US7037851 Methods for selective integration of airgaps and devices made by such methods |
| 05/02/2006 | US7037835 Interconnections having double capping layer and method for forming the same |
| 05/02/2006 | US7037829 Compound structure for reduced contact resistance |
| 05/02/2006 | US7037828 Semiconductor device having a capping layer including cobalt and method of fabricating the same |
| 05/02/2006 | US7037826 Method for forming semiconductor device bonding pads |
| 05/02/2006 | US7037824 Copper to aluminum interlayer interconnect using stud and via liner |
| 05/02/2006 | US7037820 Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding |
| 05/02/2006 | US7037819 Method of making a circuitized substrate |
| 05/02/2006 | US7037808 Method of forming semiconductor constructions |
| 05/02/2006 | US7037804 Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration |
| 05/02/2006 | US7037800 Radio frequency semiconductor device and method of manufacturing the same |
| 05/02/2006 | US7037766 Method of fabricating an active matrix substrate for liquid crystal display utilizing interconnection lines formed from multilayered films that include an aluminum-neodymium alloy layer |
| 05/02/2006 | US7037761 Method of producing an electronic component |
| 05/02/2006 | US7037760 Fabrication method of semiconductor integrated circuit device |
| 05/02/2006 | US7037759 Semiconductor package and method for manufacturing the same |
| 05/02/2006 | US7037757 Stacked semiconductor module |
| 05/02/2006 | US7037755 Three dimensional device integration method and integrated device |
| 05/02/2006 | US7037754 Semiconductor chip and method of producing the same |
| 05/02/2006 | US7037753 Non-planar surface for semiconductor chips |
| 05/02/2006 | US7037752 Semiconductor device and manufacturing method thereof |
| 05/02/2006 | US7037750 Method for manufacturing a package |
| 05/02/2006 | US7037744 Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby |
| 05/02/2006 | US7037732 Method and device for cutting wire formed on semiconductor substrate |
| 05/02/2006 | US7037451 Forming the abrasive silica*alumina particles in the aerosol stream, heating; use for chemical mechanical polishing integrated circuit; fine particles coupling with coatings by silanes, narrow particle size distribution, unagglomerated |
| 05/02/2006 | US7037399 Epoxy resins |
| 05/02/2006 | US7037002 Optical component and method of manufacturing the same |
| 05/02/2006 | US7036573 Polymer with solder pre-coated fillers for thermal interface materials |
| 05/02/2006 | US7036385 Pressure sensor and related method |
| 05/02/2006 | US7036221 Method of manufacturing a semiconductor element-mounting board |
| 05/02/2006 | US7036216 Method and apparatus for connecting at least one chip to an external wiring configuration |
| 05/02/2006 | CA2217938C Method for connecting area grid arrays to printed wire board |
| 05/02/2006 | CA2115984C The use of substantially fluorinated compounds as heat transfer agents |
| 04/28/2006 | CA2552972A1 Piezoelectric element and method of manufacturing the same |
| 04/27/2006 | WO2006044804A2 Multi chip leadframe package |