| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/04/2006 | US20060091509 Flip chip package including a non-planar heat spreader and method of making the same |
| 05/04/2006 | US20060091508 Power distribution within a folded flex package method and apparatus |
| 05/04/2006 | US20060091507 IC package structures having separate circuit interconnection structures and assemblies constructed thereof |
| 05/04/2006 | US20060091506 Lead frame having a lead with a non-uniform width |
| 05/04/2006 | US20060091505 Low cost power MOSFET with current monitoring |
| 05/04/2006 | US20060091504 Film circuit substrate having Sn-In alloy layer |
| 05/04/2006 | US20060091503 High voltage lateral diffused MOSFET device |
| 05/04/2006 | US20060091486 Solid image-pickup device and method for manufacturing the solid image pickup device |
| 05/04/2006 | US20060091480 Lateral double diffused MOS transistors |
| 05/04/2006 | US20060091476 Sub-lithographic structures, devices including such structures, and methods for producing the same |
| 05/04/2006 | US20060091473 Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device |
| 05/04/2006 | US20060091468 Top and sidewall bridged interconnect structure and method |
| 05/04/2006 | US20060091465 Layout of semiconductor device with substrate-triggered esd protection |
| 05/04/2006 | US20060091464 Electrostatic protection circuit |
| 05/04/2006 | US20060091451 Semiconductor device |
| 05/04/2006 | US20060091403 Led module and method of packaging the same |
| 05/04/2006 | US20060091384 Substrate testing apparatus with full contact configuration |
| 05/04/2006 | US20060091383 Semiconductor structure and testing method thereof |
| 05/04/2006 | US20060091330 Alignment systems and methods for lithographic systems |
| 05/04/2006 | US20060090931 Semiconductor device and method for manufacture thereof, circuit board, and electronic Instrument |
| 05/04/2006 | US20060090918 Venting device for tamper resistant electronic modules |
| 05/04/2006 | US20060090888 Heat-exchange type cooler |
| 05/04/2006 | US20060090883 Liquid-cooled heat radiator kit |
| 05/04/2006 | US20060090541 Integration of thermal regulation and electronic fluid sensing |
| 05/04/2006 | US20060090334 Processes for packing memory cards by single mold |
| 05/04/2006 | DE202006002998U1 Vorrichtung zum Ausrichten und Bearbeiten eines Wafers Apparatus for aligning and processing a wafer |
| 05/04/2006 | DE202006000499U1 Heat exchanger for use in e.g. computer system, has air inlet and outlet sides between which transient areas are provided, and connecting units in areas for connecting heat exchanger with neighboring heat exchanger |
| 05/04/2006 | DE19926128B4 Leistungs-Halbleiterbauteil-Gehäuse Power semiconductor component packages |
| 05/04/2006 | DE19709295B4 Halbleiterbaugruppe Semiconductor package |
| 05/04/2006 | DE19549202B4 Gleichrichterdiode Rectifier diode |
| 05/04/2006 | DE10348715B4 Verfahren zum Herstellen eines Flachleiterrahmens mit verbesserter Haftung zwischen diesem und Kunststoff sowie Flachleiterrahmen A method for producing a leadframe having improved adhesion between it and plastic and leadframe |
| 05/04/2006 | DE10326458B4 Kühlanordnung für elektronische Bauelemente Cooling arrangement for electronic components |
| 05/04/2006 | DE102005039465A1 Micromachined ultrasonic transducer device for medical diagnostic ultrasound imaging system, has unit switch cells, each includes switches for closing pathways to connection point that is connected to respective sensor |
| 05/04/2006 | DE102004056879A1 Verfahren zum Herstellen eines Metall-Keramik-Substrates bzw. Kupfer-Keramik-Substrates sowie Träger zur Verwendung bei diesem Verfahren A method for producing a metal-ceramic substrate or copper-ceramic substrate and carrier for use in this method |
| 05/04/2006 | DE102004052903A1 Bus-system for e.g. microprocessor, has lines with two sections, in each case., where sections are connected with each other by repeater and/or buffer mechanisms as inverted and non-inverted repeater and/or buffer mechanisms |
| 05/04/2006 | DE102004052093A1 Schaltungsanordung mit Schutz gegen elektrostatische Zerstörung Circuit arrangement with protection against electrostatic destruction |
| 05/04/2006 | DE102004051039A1 Leistungshalbleitermodul mit Druckkontakteinrichtung Power semiconductor module with a pressure-contact means |
| 05/04/2006 | DE102004050178B3 Flip-Chip-Bauelement Flip-chip component |
| 05/04/2006 | DE102004036662B3 Verfahren zum Einringen von Durchbrechungen in eine Schablone oder Maske A method for out ahead of perforations in a stencil or mask |
| 05/04/2006 | DE102004015091B4 Flächenhafter Verdrahtungsträger A laminar wiring support |
| 05/04/2006 | DE10200382B4 Chipmodul für Chipkarten Chip module for smart cards |
| 05/04/2006 | DE10140045B4 IC-Chip mit Schutzstruktur IC chip having the protective structure |
| 05/04/2006 | DE10101875B4 Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips und Verfahren zu seiner Herstellung An electronic part having successive stacked semiconductor chips and process for its preparation |
| 05/03/2006 | EP1653518A2 Method of manufacturing a Zener zap diode compatible with tungsten plug technology |
| 05/03/2006 | EP1653511A2 Semiconductor device and method for manufacturing the same |
| 05/03/2006 | EP1653510A2 Semiconductor device and manufacturing method of the same |
| 05/03/2006 | EP1653509A2 Semiconductor device and manufacturing method of the same |
| 05/03/2006 | EP1653508A2 Semiconductor device and manufacturing method of the same |
| 05/03/2006 | EP1653507A1 High-heat-resistant semiconductor device |
| 05/03/2006 | EP1653506A1 Flip chip mounting substrate |
| 05/03/2006 | EP1653503A2 Semiconductor device, circuit board, electro-optic device, electronic device |
| 05/03/2006 | EP1653288A1 Apparatus and method for optical position assessment |
| 05/03/2006 | EP1652581A1 Curable thick film paste compositions for use in moisture control |
| 05/03/2006 | EP1652234A1 Ground arch for wirebond ball grid arrays |
| 05/03/2006 | EP1652232A1 Multichip circuit module and method for the production thereof |
| 05/03/2006 | EP1652231A1 Device comprising at least one heat source formed by a functional element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink and made of a thermally conducting material, and thermally conducting material, especially for use in such a device |
| 05/03/2006 | EP1652227A2 Lead frame routed chip pads for semiconductor packages |
| 05/03/2006 | EP1652199A2 Inductive and capacitive elements for semiconductor technologies with minimum pattern density requirements |
| 05/03/2006 | EP1652198A1 Compact impedance transformation circuit |
| 05/03/2006 | EP1410700A4 Integrated circuit carrier with recesses |
| 05/03/2006 | EP1346618B1 Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher ic power delivery |
| 05/03/2006 | EP1334647A4 An integrated circuit carrier |
| 05/03/2006 | CN2777918Y Radiating device |
| 05/03/2006 | CN2777760Y Fixing structure of LED visual panel |
| 05/03/2006 | CN2777757Y Conductor frame with enhanced heat radiation effect and package thereof |
| 05/03/2006 | CN2777756Y Conductor frame of increasing heat radiation effect and package thereof |
| 05/03/2006 | CN2777755Y CPU multi-face fin radiator |
| 05/03/2006 | CN2777754Y Sintered heat pipe |
| 05/03/2006 | CN2777753Y Radiator |
| 05/03/2006 | CN2777625Y Water cooled heat radiator for computer |
| 05/03/2006 | CN1768559A Multilayer printed wiring board |
| 05/03/2006 | CN1768557A Circuit board and process for producing the same |
| 05/03/2006 | CN1768454A Anisotropic electrically conductive film and method of producing the same |
| 05/03/2006 | CN1768426A Integrated circuit die having a copper contact and method therefor |
| 05/03/2006 | CN1768425A Electronic assemblies with fluid cooling and associated methods |
| 05/03/2006 | CN1768424A Thermal interface apparatus, systems, and methods |
| 05/03/2006 | CN1768423A Semiconductor device |
| 05/03/2006 | CN1768420A Semiconductor substrate having copper/diamond composite material and method of making same |
| 05/03/2006 | CN1768112A Epoxy resin molding material for sealing use and semiconductor device |
| 05/03/2006 | CN1768099A Thermally conductive adhesive composition and process for device attachment |
| 05/03/2006 | CN1767921A Phase change lead-free super plastic solders |
| 05/03/2006 | CN1767751A 模块散热器 Radiator module |
| 05/03/2006 | CN1767750A Heat radiation assembly and its flow direction control structure |
| 05/03/2006 | CN1767210A Semiconductor devices with reduced impact from alien particles |
| 05/03/2006 | CN1767195A Protecting element and semiconductor device using the same |
| 05/03/2006 | CN1767189A High brightness led with anti-static discharge impact protection funciton |
| 05/03/2006 | CN1767188A Device and method for implementing multi-time programming using once programmable element |
| 05/03/2006 | CN1767187A Semiconductor wafer with id mark, equipment for and method of manufacturing semiconductor device from them |
| 05/03/2006 | CN1767186A Lead frame and semiconductor package therefor |
| 05/03/2006 | CN1767185A Lead frame and method for fabricating resin-encapsulated semiconductor device using the same |
| 05/03/2006 | CN1767184A Embedded packaging structure and its packaging method |
| 05/03/2006 | CN1767183A Thyratron transistor valve water-cooling radiator |
| 05/03/2006 | CN1767182A Heat radiation assembly and its flow direction control structure |
| 05/03/2006 | CN1767181A High-performance passive phase-change radiation system and its application |
| 05/03/2006 | CN1767180A Solid-state optical device |
| 05/03/2006 | CN1767179A Wireless chip and manufacturing method of the same |
| 05/03/2006 | CN1767178A Semiconductor substrate and manufacturing method thereof and semiconductor package assembly |
| 05/03/2006 | CN1767177A Semiconductor device and electronic apparatus |
| 05/03/2006 | CN1767176A Flexible wiring board for tape carrier package having improved flame resistance |
| 05/03/2006 | CN1767170A Component built-in module and method of manufacturing the same |