| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/09/2006 | US7041513 Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates |
| 05/09/2006 | US7041331 Electronic device manufacture |
| 05/09/2006 | US7041237 Rigid, hardness adhesive; reliable adhesive; connecting semiconductor chips; heat resistance, waterproofing |
| 05/09/2006 | US7041151 Electrochemical displacement-deposition method for making composite metal powders |
| 05/09/2006 | US7040902 Electrical contact |
| 05/09/2006 | US7040817 Three-dimensional mounted assembly and optical transmission device |
| 05/09/2006 | US7040389 Integrated heat dissipation apparatus |
| 05/09/2006 | US7040388 Heat sink, method of manufacturing the same and cooling apparatus using the same |
| 05/09/2006 | US7040384 Heat dissipation device |
| 05/09/2006 | US7040383 Telecommunication device including a housing having improved heat conductivity |
| 05/09/2006 | US7040381 Cooling device |
| 05/09/2006 | US7040011 Wiring substrate manufacturing method |
| 05/04/2006 | WO2006047331A1 Twin fin arrayed cooling device with heat spreader |
| 05/04/2006 | WO2006047149A1 Desiccant film in top-emitting oled |
| 05/04/2006 | WO2006047028A2 Packaged device and method of forming same |
| 05/04/2006 | WO2006046713A1 Electronic component module and wireless communication equipment |
| 05/04/2006 | WO2006046655A1 Light emitting element mounting board, light emitting element storing package, light emitting device and lighting equipment |
| 05/04/2006 | WO2006046442A1 Semiconductor device and its manufacturing method |
| 05/04/2006 | WO2006046440A1 Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
| 05/04/2006 | WO2006046386A1 Film forming method, semiconductor device manufacturing method, semiconductor device, program and recording medium |
| 05/04/2006 | WO2006046022A1 Heat sink |
| 05/04/2006 | WO2006045267A1 Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method |
| 05/04/2006 | WO2006004671A3 Microelectronic package structure with spherical contact pins |
| 05/04/2006 | WO2005124856A3 Method and system for improved wire bonding |
| 05/04/2006 | WO2005106943A3 Level realignment following an epitaxy step |
| 05/04/2006 | WO2005104814B1 Composite ground shield for passive components in a semiconductor die |
| 05/04/2006 | WO2005101500A3 Manufacture of porous diamond films |
| 05/04/2006 | WO2005092070A3 Vertically stacked semiconductor device |
| 05/04/2006 | US20060095872 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 05/04/2006 | US20060094797 Epoxy resin composition and semiconductor device |
| 05/04/2006 | US20060094269 Electrical contact and connector and method of manufacture |
| 05/04/2006 | US20060094247 Method for producing a stepped edge profile comprised of a layered construction |
| 05/04/2006 | US20060094240 Neo-wafer device comprised of multiple singulated integrated circuit die |
| 05/04/2006 | US20060094228 Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits |
| 05/04/2006 | US20060094226 Bumping process |
| 05/04/2006 | US20060094223 Fabrication method of a wafer structure |
| 05/04/2006 | US20060094173 Method for forming semiconductor device |
| 05/04/2006 | US20060094161 Thermal enhance package and manufacturing method thereof |
| 05/04/2006 | US20060094155 Method of manufacturing a wafer assembly |
| 05/04/2006 | US20060094134 Method of manufacturing inspection unit |
| 05/04/2006 | US20060092614 Stacked module systems and methods |
| 05/04/2006 | US20060091942 Semiconductor integrated circuit device |
| 05/04/2006 | US20060091568 Semiconductor device and method for manufacturing same |
| 05/04/2006 | US20060091567 Cavity-down Package and Method for Fabricating the same |
| 05/04/2006 | US20060091566 Bond pad structure for integrated circuit chip |
| 05/04/2006 | US20060091565 LED with self aligned bond pad |
| 05/04/2006 | US20060091564 System to control effective series resistance of decoupling capacitor |
| 05/04/2006 | US20060091563 Semiconductor device and method for fabricating the same |
| 05/04/2006 | US20060091562 Flip chip BGA process and package with stiffener ring |
| 05/04/2006 | US20060091561 Electronic component comprising external surface contacts and a method for producing the same |
| 05/04/2006 | US20060091560 Multi-chip stack package |
| 05/04/2006 | US20060091559 Hardmask for improved reliability of silicon based dielectrics |
| 05/04/2006 | US20060091558 Circuitized substrate with trace embedded inside ground layer |
| 05/04/2006 | US20060091557 Semiconductor device and its manufacturing method |
| 05/04/2006 | US20060091556 Semiconductor device and its manufacturing method |
| 05/04/2006 | US20060091555 Method of and apparatus for mounting an electronic part to a substrate |
| 05/04/2006 | US20060091554 Multilayered barrier metal thin-films |
| 05/04/2006 | US20060091553 Wiring board and method for producing same |
| 05/04/2006 | US20060091552 Refractory metal substrate with improved thermal conductivity |
| 05/04/2006 | US20060091551 Differentially metal doped copper damascenes |
| 05/04/2006 | US20060091550 Method of analyzing operation of semiconductor integrated circuit device, analyzing apparatus used in the same, and optimization designing method using the same |
| 05/04/2006 | US20060091549 Semiconductor device with suppressed copper migration |
| 05/04/2006 | US20060091548 Flexible wiring board for tape carrier package having improved flame resistance |
| 05/04/2006 | US20060091547 Substrate provided with a thin film pattern, method of manufacturing a device, electro-optic device, and electronic instrument |
| 05/04/2006 | US20060091546 Layer system |
| 05/04/2006 | US20060091545 Printed circuit board for high-speed electrical connectors |
| 05/04/2006 | US20060091544 Wiring board and manufacturing method therefor |
| 05/04/2006 | US20060091543 Land grid array module |
| 05/04/2006 | US20060091542 Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same |
| 05/04/2006 | US20060091541 Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion |
| 05/04/2006 | US20060091540 Semiconductor chip with post-passivation scheme formed over passivation layer |
| 05/04/2006 | US20060091539 Semiconductor device, circuit board, electro-optic device, electronic device |
| 05/04/2006 | US20060091537 Semiconductor device and method of fabricating the same |
| 05/04/2006 | US20060091536 Bond pad structure with stress-buffering layer capping interconnection metal layer |
| 05/04/2006 | US20060091535 Fine pitch bonding pad layout and method of manufacturing same |
| 05/04/2006 | US20060091534 Chip part manufacturing method and chip parts |
| 05/04/2006 | US20060091533 Multi-row substrate strip and method for manufacturing the same |
| 05/04/2006 | US20060091532 Carbonaceous composite heat spreader and associated methods |
| 05/04/2006 | US20060091531 Cavity-down thermally enhanced package |
| 05/04/2006 | US20060091530 Multi-package module with heat spreader |
| 05/04/2006 | US20060091529 High capacity thin module system and method |
| 05/04/2006 | US20060091528 High heat dissipation flip chip package structure |
| 05/04/2006 | US20060091527 Semiconductor package with heat sink and method for fabricating same |
| 05/04/2006 | US20060091526 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 05/04/2006 | US20060091525 Wiring board with semiconductor component |
| 05/04/2006 | US20060091524 Semiconductor module, process for producing the same, and film interposer |
| 05/04/2006 | US20060091523 Semiconductor device and a method for manufacturing of the same |
| 05/04/2006 | US20060091522 Plastic package and semiconductor component comprising such a plastic package, and method for its production |
| 05/04/2006 | US20060091521 Stacking system and method |
| 05/04/2006 | US20060091520 Multiple die stack apparatus employing T-shaped interposer elements |
| 05/04/2006 | US20060091519 Multiple die stack apparatus employing T-shaped interposer elements |
| 05/04/2006 | US20060091518 Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module |
| 05/04/2006 | US20060091517 Stacked semiconductor multi-chip package |
| 05/04/2006 | US20060091516 Flexible leaded stacked semiconductor package |
| 05/04/2006 | US20060091515 Sensor chip packaging structure |
| 05/04/2006 | US20060091514 Fan out type wafer level package structure and method of the same |
| 05/04/2006 | US20060091513 Chip package having flat transmission surface of transparent molding compound and method for manufacturing the same |
| 05/04/2006 | US20060091512 Semiconductor device and manufacturing process thereof |
| 05/04/2006 | US20060091511 Chip-on-board package having flip chip assembly structure and manufacturing method thereof |
| 05/04/2006 | US20060091510 Probe card interposer |