| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/10/2006 | CN1768900A Curable thick film compositions for use in moisture control |
| 05/10/2006 | CN1256010C Electric parts device |
| 05/10/2006 | CN1256007C Laminated ceramic electronic component and manufacturing method thereof |
| 05/10/2006 | CN1256006C Circuit board |
| 05/10/2006 | CN1255910C PGA socket and contact |
| 05/10/2006 | CN1255875C Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs |
| 05/10/2006 | CN1255874C Contactor for semiconductor device |
| 05/10/2006 | CN1255867C Process for fabrication of microelectronic packages |
| 05/10/2006 | CN1255863C Improvement of titanium disilicide resistance in pinched active regions of semiconductor devices |
| 05/10/2006 | CN1255695C Three-D installed element, its mfg. method and optical transmission device |
| 05/10/2006 | CN1255692C Equipment and method for assembling optical device |
| 05/10/2006 | CN1255573C Low-permittivity material and processing method via CVD |
| 05/10/2006 | CN1255563C Thermal interface material and heat sink configuration |
| 05/09/2006 | US7042729 Thermal interface apparatus, systems, and fabrication methods |
| 05/09/2006 | US7042728 Clamping structure and heat dissipating module using same |
| 05/09/2006 | US7042727 Heat sink mounting and interface mechanism and method of assembling same |
| 05/09/2006 | US7042725 Power switching module and inverter equipped therewith |
| 05/09/2006 | US7042723 Cooling arrangement for an integrated circuit |
| 05/09/2006 | US7042719 Electronic device and module structure thereof |
| 05/09/2006 | US7042703 Energy conditioning structure |
| 05/09/2006 | US7042616 Electrochromic rearview mirror assembly incorporating a display/signal light |
| 05/09/2006 | US7042569 Overlay alignment metrology using diffraction gratings |
| 05/09/2006 | US7042532 Display device and method for repairing line disconnection thereof |
| 05/09/2006 | US7042398 Apparatus of antenna with heat slug and its fabricating process |
| 05/09/2006 | US7042307 Coupler resource module |
| 05/09/2006 | US7042303 Energy conditioning circuit assembly |
| 05/09/2006 | US7042106 Underfill integration for optical packages |
| 05/09/2006 | US7042105 Methods for dicing wafer stacks to provide access to interior structures |
| 05/09/2006 | US7042104 Semiconductor package using flexible film and method of manufacturing the same |
| 05/09/2006 | US7042103 Low stress semiconductor die attach |
| 05/09/2006 | US7042102 Semiconductor device |
| 05/09/2006 | US7042100 Damascene interconnection and semiconductor device |
| 05/09/2006 | US7042099 first insulating film which above the substrate has a relative dielectric constant which is at most a predetermined value, a second insulating film on a surface of the first insulating film has a relative dielectric contastant > than first |
| 05/09/2006 | US7042098 Bonding pad for a packaged integrated circuit |
| 05/09/2006 | US7042097 Structure for reducing stress-induced voiding in an interconnect of integrated circuits |
| 05/09/2006 | US7042096 Single semiconductor element in a flip chip construction |
| 05/09/2006 | US7042095 Improved dielectric breakdown strength between copper interconnects and reduced capacitance between the copper interconnects. |
| 05/09/2006 | US7042094 Via structure for semiconductor chip |
| 05/09/2006 | US7042093 Semiconductor device using metal nitride as insulating film |
| 05/09/2006 | US7042092 Multilevel metal interconnect and method of forming the interconnect with capacitive structures that adjust the capacitance of the interconnect |
| 05/09/2006 | US7042091 Fluorinated hard mask for micropatterning of polymers |
| 05/09/2006 | US7042090 Electronic device and method of fabricating the same |
| 05/09/2006 | US7042089 Group III nitride compound semiconductor device |
| 05/09/2006 | US7042088 Package structure with two solder arrays |
| 05/09/2006 | US7042087 Hybrid integrated circuit device |
| 05/09/2006 | US7042086 Stacked semiconductor module and assembling method of the same |
| 05/09/2006 | US7042085 Method for packaging electronic modules and multiple chip packaging |
| 05/09/2006 | US7042084 Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core |
| 05/09/2006 | US7042083 Package substrate and a flip chip mounted semiconductor device |
| 05/09/2006 | US7042082 Method and apparatus for a backsided and recessed optical package connection |
| 05/09/2006 | US7042081 Semiconductor device having heat dissipation layer |
| 05/09/2006 | US7042080 Semiconductor interconnect having compliant conductive contacts |
| 05/09/2006 | US7042079 Variable rotational assignment of interconnect levels in integrated circuit fabrication |
| 05/09/2006 | US7042078 Semiconductor package |
| 05/09/2006 | US7042077 Integrated circuit package with low modulus layer and capacitor/interposer |
| 05/09/2006 | US7042076 Vacuum sealed microdevice packaging with getters |
| 05/09/2006 | US7042075 Electronic device sealed under vacuum containing a getter and method of operation |
| 05/09/2006 | US7042074 Power semiconductor module and method for producing it |
| 05/09/2006 | US7042073 Semiconductor device and manufacturing method thereof |
| 05/09/2006 | US7042072 Semiconductor package and method of manufacturing the same which reduces warpage |
| 05/09/2006 | US7042071 Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
| 05/09/2006 | US7042070 Direct attachment of semiconductor chip to organic substrate |
| 05/09/2006 | US7042069 Semiconductor device and method of manufacturing same, wiring board, electronic module, and electronic instrument |
| 05/09/2006 | US7042068 Leadframe and semiconductor package made using the leadframe |
| 05/09/2006 | US7042067 Transmission line with integrated connection pads for circuit elements |
| 05/09/2006 | US7042066 Dual-trench isolated crosspoint memory array |
| 05/09/2006 | US7042065 Semiconductor device and method of manufacturing the same |
| 05/09/2006 | US7042063 Semiconductor wafer, semiconductor device, and process for manufacturing the semiconductor device |
| 05/09/2006 | US7042058 Image sensor with guard ring for suppressing radiation charges |
| 05/09/2006 | US7042053 Semiconductor device with polymer insulation of some electrodes |
| 05/09/2006 | US7042046 Super-junction semiconductor device and method of manufacturing the same |
| 05/09/2006 | US7042041 Semiconductor device |
| 05/09/2006 | US7042028 Electrostatic discharge device |
| 05/09/2006 | US7042021 Light emitting diode with reflection cup |
| 05/09/2006 | US7042020 Light emitting device incorporating a luminescent material |
| 05/09/2006 | US7042007 Semiconductor device and method for evaluating characteristics of the same |
| 05/09/2006 | US7041766 Applying to semiconductors |
| 05/09/2006 | US7041748 Polysilsesquioxane has acid-sensitive imageable groups; acid generator or a crosslinking agent; crosslinkable after exposing to light; photoresists, ladder polymers; film stacks |
| 05/09/2006 | US7041736 decreasing the volatilization thereby reducing porosity in cured underfills; electronic components |
| 05/09/2006 | US7041606 Electroless deposition of doped noble metals and noble metal alloys |
| 05/09/2006 | US7041605 Semiconductor contact structure and method of forming the same |
| 05/09/2006 | US7041595 Method of forming a barrier seed layer with graded nitrogen composition |
| 05/09/2006 | US7041594 Semiconductor device for applying well bias and method of fabricating the same |
| 05/09/2006 | US7041591 Method for fabricating semiconductor package substrate with plated metal layer over conductive pad |
| 05/09/2006 | US7041590 Formation method for conductive bump |
| 05/09/2006 | US7041589 Metal bump with an insulating sidewall and method of fabricating thereof |
| 05/09/2006 | US7041586 Semiconductor device having a multilayer interconnection structure |
| 05/09/2006 | US7041584 Method of manufacturing semiconductor device and the semiconductor device |
| 05/09/2006 | US7041571 Air gap interconnect structure and method of manufacture |
| 05/09/2006 | US7041566 Method for forming inductor in semiconductor device |
| 05/09/2006 | US7041537 Method for fabricating semiconductor component with on board capacitor |
| 05/09/2006 | US7041536 Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
| 05/09/2006 | US7041535 Power module and method of manufacturing the same |
| 05/09/2006 | US7041534 Semiconductor chip package and method for making the same |
| 05/09/2006 | US7041533 Stereolithographic method for fabricating stabilizers for semiconductor devices |
| 05/09/2006 | US7041532 Methods for fabricating interposers including upwardly protruding dams |
| 05/09/2006 | US7041531 Method of fabricating flip chip ball grid array package |
| 05/09/2006 | US7041527 Charge coupled device package |
| 05/09/2006 | US7041516 Multi chip module assembly |
| 05/09/2006 | US7041515 Balancing planarization of layers and the effect of underlying structure on the metrology signal |