| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/11/2006 | US20060097363 Semiconductor device having post-mold nickel/palladium/gold plated leads |
| 05/11/2006 | US20060097362 Method and apparatus for fabricating and connecting a semiconductor power switching device |
| 05/11/2006 | US20060097361 Microprotrusion structure, and process for producing the same |
| 05/11/2006 | US20060097360 Dielectric materials for electronic devices |
| 05/11/2006 | US20060097359 Low-k dielectric layer formed from aluminosilicate precursors |
| 05/11/2006 | US20060097356 Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device |
| 05/11/2006 | US20060097345 Gate dielectric antifuse circuits and methods for operating same |
| 05/11/2006 | US20060097344 Integrated thin film capacitor/inductor/interconnect system and method |
| 05/11/2006 | US20060097335 Electronic package for image sensor, and the packaging method thereof |
| 05/11/2006 | US20060097332 Semiconductor device, carrier, card reader, methods of initializing and checking authenticity |
| 05/11/2006 | US20060097324 Semiconductor integrated circuit and method for designing the same |
| 05/11/2006 | US20060097323 Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event |
| 05/11/2006 | US20060097322 Electrostatic discharge (ESD) protection circuit |
| 05/11/2006 | US20060097321 Electrostatic discharge protection device |
| 05/11/2006 | US20060097320 Protecting element and semiconductor device using the same |
| 05/11/2006 | US20060097309 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration |
| 05/11/2006 | US20060097303 Semiconductor device and its manufacturing method |
| 05/11/2006 | US20060097290 Semiconductor structure for imaging detectors |
| 05/11/2006 | US20060097276 Flip chip type LED lighting device manufacturing method |
| 05/11/2006 | US20060097262 Thin film transistor array panel |
| 05/11/2006 | US20060097253 Structured semiconductor element for reducing charging effects |
| 05/11/2006 | US20060097252 Interconnect including a pliable surface and use thereof |
| 05/11/2006 | US20060097245 Light emitting diode component |
| 05/11/2006 | US20060096743 Liquid cooling device |
| 05/11/2006 | US20060096737 Heat exchanger |
| 05/11/2006 | US20060096085 Methods for designing and tuning one or more packaged integrated circuits |
| 05/11/2006 | DE202006000077U1 Colored and textured device for heat removal has each fin with protective film applied to it by anodizing process |
| 05/11/2006 | DE19820816B4 Bondpadstruktur und entsprechendes Herstellungsverfahren Bondpadstruktur and manufacturing method thereof |
| 05/11/2006 | DE19806017B4 Halbleiter-Multichip-Modul Semiconductor multi-chip module |
| 05/11/2006 | DE102005025452A1 Halbleitervorrichtung mit einer Durchgangselektrode und Verfahren zu ihrer Herstellung A semiconductor device having a through electrode and process for their preparation |
| 05/11/2006 | DE102004054083A1 Electrical component e.g. chip condenser, has two connections stepped out from opposite sides of housing on different heights, where connections have different lengths and are guided outward along side surface in bottom side |
| 05/11/2006 | DE102004053760A1 Halbleitereinrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation |
| 05/11/2006 | DE102004052868A1 Integrierte Schaltkreis-Anordnung und Schaltkreis-Array Integrated circuit arrangement and circuit array |
| 05/11/2006 | DE102004046257B3 Process to form interlocking assembly profile in multilayered semiconductor component |
| 05/11/2006 | DE102004026145A1 Halbleiterstruktur mit einem spannungsempfindlichen Element und Verfahren zum Messen einer elastischen Spannung in einer Halbleiterstruktur Semiconductor structure having a voltage sensitive element and method for measuring an elastic stress in a semiconductor structure |
| 05/11/2006 | DE10138958B4 Chip-Scale-Packung, gedruckte Leiterplatte, Elektronikmodul und Leiterplatten-Entwurfsverfahren Chip-scale package, printed circuit board, electronic module and printed circuit board design techniques |
| 05/11/2006 | DE10055683B4 Vorrichtung zum Entriegeln eines in eine Aufnahmevorrichtung einsteckbaren elektronischen Bauelements A device for locking an insertable device into a receiving electronic device |
| 05/11/2006 | DE10018702B4 Kühlvorrichtung Cooler |
| 05/11/2006 | DE10016064B4 Substrat,Einzelsubstrat und Verfahren zur Herstellung derselben Substrate, single substrate and method of manufacturing the same |
| 05/10/2006 | EP1655778A1 Chip package structure |
| 05/10/2006 | EP1655777A1 In-print method and in-print device |
| 05/10/2006 | EP1655771A1 Method for forming film, method for manufacturing semiconductor device, semiconductor device and substrate treatment system |
| 05/10/2006 | EP1655769A2 Method of cleaning a semiconductor device and cleaning agent for this purpose |
| 05/10/2006 | EP1655746A2 Integrated spiral inductor including a shielding layer |
| 05/10/2006 | EP1655690A2 Fraud resistant RFID tag |
| 05/10/2006 | EP1654765A2 Power semiconductor device and method therefor cross reference to related applications |
| 05/10/2006 | EP1654762A1 Security-sensitive semiconductor product, particularly a smart-card chip |
| 05/10/2006 | EP1654761A2 Module for epas/ehpas applications |
| 05/10/2006 | EP1654760A1 Integrated connection arrangement and production method |
| 05/10/2006 | EP1654759A1 Phase change thermal interface materials using polyester resin and clay filler |
| 05/10/2006 | EP1654753A2 Semiconductor device package and method for manufacturing same |
| 05/10/2006 | EP1595287B1 Electronic component comprising a semiconductor chip and method for producing said component |
| 05/10/2006 | EP1438198B1 Method of manufacturing an electronic component and electronic component obtained by means of said method |
| 05/10/2006 | CN2779623Y Refrigeration chip structure for facilitating installation of curved surface |
| 05/10/2006 | CN2779619Y Tabulate electric power electron semiconductor device module |
| 05/10/2006 | CN2779618Y Laminative encapsulation chip structure improvement |
| 05/10/2006 | CN2779617Y Surface adhesive type electrostatic protect module structure |
| 05/10/2006 | CN2779616Y Projection-free wafer package |
| 05/10/2006 | CN2779615Y Wafer package |
| 05/10/2006 | CN2779614Y Packaged chip capable of lowering characteristic impedance |
| 05/10/2006 | CN2779613Y Radiator |
| 05/10/2006 | CN2779612Y Wafer Radiator |
| 05/10/2006 | CN2779611Y Electric bicycle and motorcycle controller with high effective radiation structure |
| 05/10/2006 | CN2779610Y Lead shelf electric encapsulation substance |
| 05/10/2006 | CN2779472Y Fan module and radiator using same |
| 05/10/2006 | CN1771771A Multilayer printed wiring board |
| 05/10/2006 | CN1771767A Method for manufacturing an electronic module and an electronic module |
| 05/10/2006 | CN1771601A Electronic packaging structure with integrated distributed decoupling capacitors |
| 05/10/2006 | CN1771600A Arrangement composed of an electrical component on a substrate, and method for the production of said arrangement |
| 05/10/2006 | CN1771599A Surface mounting electronic component and its manufacturing method |
| 05/10/2006 | CN1771598A Integrated circuit die I/O cells |
| 05/10/2006 | CN1771597A Cooling part, substrate and electronic equipment |
| 05/10/2006 | CN1771596A Encapsulated power semiconductor assembly |
| 05/10/2006 | CN1771595A Contact portion and manufacturing method thereof, thin film transistor array panel and manufacturing method thereof |
| 05/10/2006 | CN1771593A Semiconductor device |
| 05/10/2006 | CN1771591A Method of making a low profile highly-packaged semiconductor device |
| 05/10/2006 | CN1771584A Method of heat treatment and heat treatment apparatus |
| 05/10/2006 | CN1770487A White light LED package radiating structure |
| 05/10/2006 | CN1770462A Image sensor assembly and method for fabricating the same |
| 05/10/2006 | CN1770454A Chip for three-dimensional memory system |
| 05/10/2006 | CN1770452A Electrostatic discharge protection divice and method for its manufacture |
| 05/10/2006 | CN1770451A Ic device for improving chip area, the number of lead terminals of a package and parasitic inductance |
| 05/10/2006 | CN1770449A HV-MOS and mixed-signal circuit structure with low-k interconnection |
| 05/10/2006 | CN1770446A Lsi package with interface module, transmission line package, and ribbon optical transmission line |
| 05/10/2006 | CN1770445A Static discharge protecting method for full chip |
| 05/10/2006 | CN1770444A Semiconductor device, wafer and method of designing and manufacturing the same |
| 05/10/2006 | CN1770443A New fuse structure |
| 05/10/2006 | CN1770442A Integrated circuit design for routing an electrical connection |
| 05/10/2006 | CN1770441A Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
| 05/10/2006 | CN1770440A Semiconductor lead frame, semiconductor package having the same, and method of plating the same |
| 05/10/2006 | CN1770439A Cof-use copper-clad laminate and cof- use carry band |
| 05/10/2006 | CN1770438A Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
| 05/10/2006 | CN1770437A Bond pad structure |
| 05/10/2006 | CN1770436A Face-down bonding structure with low-melting point convex point and making method |
| 05/10/2006 | CN1770435A Conducting liquid crystal polymer nature comprising carbon nanotubes, use thereof and method of fabrication |
| 05/10/2006 | CN1770434A Integrated circuit chip packaging and manufacturing method thereof |
| 05/10/2006 | CN1770433A Integrated circuit chip and manufacturing method thereof |
| 05/10/2006 | CN1770432A Seal ring structure for integrated circuit chips |
| 05/10/2006 | CN1770322A Semiconductor memory device with on-die termination circuit |
| 05/10/2006 | CN1769364A Semiconductor encapsulating epoxy resin composition and semiconductor device |