| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/16/2006 | US7044196 Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
| 05/16/2006 | US7044195 Heat dissipation structure |
| 05/16/2006 | US7043830 Method of forming conductive bumps |
| 05/16/2006 | US7043828 Tile-based routing method of a multi-layer circuit board |
| 05/11/2006 | WO2006050446A1 Structures and methods for proximity communication using bridge chips |
| 05/11/2006 | WO2006050439A2 Multichip semiconductor package |
| 05/11/2006 | WO2006050403A2 Gallium nitride/silicon based monolithic microwave integrated circuit |
| 05/11/2006 | WO2006050205A2 Refractory metal substrate with improved thermal conductivity |
| 05/11/2006 | WO2006050127A2 Semiconductor device package with bump overlying a polymer layer |
| 05/11/2006 | WO2006049808A1 Heat conducting mounting fixture for solid-state lamp |
| 05/11/2006 | WO2006049768A1 Immersion cooling apparatus |
| 05/11/2006 | WO2006049751A1 Packaging and manufacturing of an integrated circuit |
| 05/11/2006 | WO2006049737A2 A new thermally enhanced molded package for semiconductors |
| 05/11/2006 | WO2006049731A1 Method of singulating electronic devices |
| 05/11/2006 | WO2006049473A1 Electronic package for image sensor, and the packaging method thereof |
| 05/11/2006 | WO2006049172A1 Semiconductor chip |
| 05/11/2006 | WO2006049156A1 Epoxy resin composition and semiconductor device |
| 05/11/2006 | WO2006049024A1 High temperature lead-free solder and package for storing semiconductor element |
| 05/11/2006 | WO2006048982A1 Cap for airtight sealing, process for producing the same and package for electronic part accommodation |
| 05/11/2006 | WO2006048848A1 Nanotube-based fluid interface material and approach |
| 05/11/2006 | WO2006048846A2 Semiconductor chip connection based on carbon nanotubes |
| 05/11/2006 | WO2006048845A2 Carbon nanotube-based conductive connections for integrated circuit devices |
| 05/11/2006 | WO2006048844A1 Carbon nanotube-based filler for integrated circuits |
| 05/11/2006 | WO2006048836A1 Inner bridges for chip-to-chip interconnections in a multi-chip ic package |
| 05/11/2006 | WO2006048245A1 Photovoltaic solar energy module |
| 05/11/2006 | WO2006048124A1 Working fluid for heat transfer |
| 05/11/2006 | WO2006013230A3 Manufacture of a layer including a component |
| 05/11/2006 | WO2006010822A3 Improved cooling devices for different applications |
| 05/11/2006 | WO2006008315A8 A heat-sink structure for electronic devices and the like |
| 05/11/2006 | WO2006007162A3 Thermoelectric module |
| 05/11/2006 | US20060100397 Useful for casting out optoelectronic components; acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak |
| 05/11/2006 | US20060100336 thermoconductive blends of end capped polysiloxanes, alumina fillers surface treated with end capped polysiloxanes, having plasticity and moldability |
| 05/11/2006 | US20060100315 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 05/11/2006 | US20060099823 Active area bonding compatible high current structures |
| 05/11/2006 | US20060099815 Cooling system for a semiconductor device and method of fabricating same |
| 05/11/2006 | US20060099796 Method of forming a multi-layer semiconductor structure having a seam-less bonding interface |
| 05/11/2006 | US20060099775 Crack stop for low K dielectrics |
| 05/11/2006 | US20060099742 Electronic device and method of manufacturing same |
| 05/11/2006 | US20060099741 Fabricating surface mountable semiconductor components with leadeframe strips |
| 05/11/2006 | US20060099740 High density direct connect loc assembly |
| 05/11/2006 | US20060099739 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 05/11/2006 | US20060099736 Flip chip underfilling |
| 05/11/2006 | US20060099735 Method for wafer level stack die placement |
| 05/11/2006 | US20060099725 Semiconductor device and process for producing the same |
| 05/11/2006 | US20060099438 Metal plating structure and method for production thereof |
| 05/11/2006 | US20060099403 combining electromagnetic interference (EMI) absorbing materials with thermoconductive materials to improve EMI shielding effectiveness in an economical manner; electronics; e.g. includes carbonyl iron; ferrite particles combined with ceramics suspended within an elastomeric matrix |
| 05/11/2006 | US20060098411 Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same |
| 05/11/2006 | US20060098410 Thermal management system and method for electronic equipment mounted on coldplates |
| 05/11/2006 | US20060098408 Heat dissipating device |
| 05/11/2006 | US20060098398 Plasma display panel assembly |
| 05/11/2006 | US20060098244 Image sensor assembly and method for fabricating the same |
| 05/11/2006 | US20060097849 Wireless communication devices and methods of forming and operating the same |
| 05/11/2006 | US20060097841 Crosspoint switch with switch matrix module |
| 05/11/2006 | US20060097828 Waveguide coupler |
| 05/11/2006 | US20060097410 Semiconductor capacitor structure and method for manufacturing the same |
| 05/11/2006 | US20060097409 Semiconductor device |
| 05/11/2006 | US20060097408 Semiconductor package device and method for fabricating the same |
| 05/11/2006 | US20060097407 Integration type semiconductor device and method for manufacturing the same |
| 05/11/2006 | US20060097406 Semiconductor chip capable of implementing wire bonding over active circuits |
| 05/11/2006 | US20060097405 IC chip package and method for packaging same |
| 05/11/2006 | US20060097404 Semiconductor package with conductive molding compound and manufacturing method thereof |
| 05/11/2006 | US20060097403 No-flow underfill materials for flip chips |
| 05/11/2006 | US20060097402 Semiconductor device having flip-chip package and method for fabricating the same |
| 05/11/2006 | US20060097401 Method for designing wiring connecting section and semiconductor device |
| 05/11/2006 | US20060097400 Substrate via pad structure providing reliable connectivity in array package devices |
| 05/11/2006 | US20060097399 Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program product |
| 05/11/2006 | US20060097398 Method and structure to reduce risk of gold embrittlement in solder joints |
| 05/11/2006 | US20060097397 Method for forming a dual layer, low resistance metallization during the formation of a semiconductor device |
| 05/11/2006 | US20060097396 Semiconductor device |
| 05/11/2006 | US20060097394 Detection of residual liner materials after polishing in damascene process |
| 05/11/2006 | US20060097393 Low dielectric constant insulating material and semiconductor device using the material |
| 05/11/2006 | US20060097392 Wafer structure, chip structure and bumping process |
| 05/11/2006 | US20060097391 Semiconductor device and a method of manufacturing the same |
| 05/11/2006 | US20060097390 Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the same |
| 05/11/2006 | US20060097389 Nanowire interconnection and nano-scale device applications |
| 05/11/2006 | US20060097388 Electrical system, especially a microelectronic or microelectromechanical high frequency system |
| 05/11/2006 | US20060097387 Staggered wirebonding configuration |
| 05/11/2006 | US20060097386 Semiconductor wafer with electrically connected contact and test areas |
| 05/11/2006 | US20060097385 Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| 05/11/2006 | US20060097384 Method and apparatus for thermal characterization under non-uniform heat load |
| 05/11/2006 | US20060097383 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
| 05/11/2006 | US20060097382 High frequency module |
| 05/11/2006 | US20060097381 Chip package with grease heat sink |
| 05/11/2006 | US20060097380 Semiconductor module |
| 05/11/2006 | US20060097379 Substrate for electrical device and methods for making the same |
| 05/11/2006 | US20060097378 Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same |
| 05/11/2006 | US20060097377 Flip chip bonding structure using non-conductive adhesive and related fabrication method |
| 05/11/2006 | US20060097376 Electronic product, a body and a method of manufacturing |
| 05/11/2006 | US20060097375 Interconnect shunt used for current distribution and reliability redundancy |
| 05/11/2006 | US20060097374 Multi chip package |
| 05/11/2006 | US20060097373 Electronic device package and electronic equipment |
| 05/11/2006 | US20060097372 IC chip package with isolated vias |
| 05/11/2006 | US20060097371 Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads |
| 05/11/2006 | US20060097370 Stepped integrated circuit packaging and mounting |
| 05/11/2006 | US20060097369 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
| 05/11/2006 | US20060097368 Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate |
| 05/11/2006 | US20060097367 Integrated circuit device having flexible leadframe |
| 05/11/2006 | US20060097366 Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound |
| 05/11/2006 | US20060097365 Integrated circuit chip package having a ring-shaped silicon decoupling capacitor |
| 05/11/2006 | US20060097364 Electro-optical device and electronic apparatus |