| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/17/2006 | CN1773700A Packing structure of multichip |
| 05/17/2006 | CN1773699A Integrated circuit chip package having a ring-shaped silicon decoupling capacitor |
| 05/17/2006 | CN1773698A Die down ball grid array packages and method for making same |
| 05/17/2006 | CN1773697A High radiating insulating light-emitting diode packaging material |
| 05/17/2006 | CN1773696A Non-lug type chip encapsulation |
| 05/17/2006 | CN1773695A Radiator |
| 05/17/2006 | CN1773694A Packaging structure with high adhesivity between substrate and packing colloid |
| 05/17/2006 | CN1773690A Semiconductor structure and producing method thereof |
| 05/17/2006 | CN1773669A Method of forming a low thermal resistance device and structure |
| 05/17/2006 | CN1773668A A low thermal resistance device and method of forming the same |
| 05/17/2006 | CN1772794A Silicone encapsulants for light emitting diodes |
| 05/17/2006 | CN1256856C Electronic elements and manufacture thereof |
| 05/17/2006 | CN1256776C Lead frame for surface fixing type LED and manufacturing method thereof |
| 05/17/2006 | CN1256771C Wiring structure in semiconductor device |
| 05/17/2006 | CN1256770C Small setting of photovoltaic assembly |
| 05/17/2006 | CN1256769C Power source semiconductor module and cooling element for holding semiconductor module |
| 05/17/2006 | CN1256761C Contact component and its manufacture and probe contact assembly using the contact component |
| 05/17/2006 | CN1256760C Copper through-hole in low-K technology |
| 05/17/2006 | CN1256757C Semiconductor substrate, its manufacturing method and manufacturing method of semiconductor device |
| 05/17/2006 | CN1256738C High-frequency power amplifier |
| 05/16/2006 | US7047154 Interconnection pattern inspection method, manufacturing method of semiconductor device and inspection apparatus |
| 05/16/2006 | US7046522 Method for scalable architectures in stackable three-dimensional integrated circuits and electronics |
| 05/16/2006 | US7046516 Clip for heat sink |
| 05/16/2006 | US7046515 Method and apparatus for cooling a circuit component |
| 05/16/2006 | US7046501 Capacitor-embedded substrate |
| 05/16/2006 | US7046488 Disk drive comprising depletion mode MOSFET for protecting a head from electrostatic discharge |
| 05/16/2006 | US7046113 Inductor element |
| 05/16/2006 | US7046075 Semiconductor integrated circuit |
| 05/16/2006 | US7046029 Conductive material for integrated circuit fabrication |
| 05/16/2006 | US7046026 Testing vias and contracts in integrated circuit |
| 05/16/2006 | US7045909 Alignment mark structure |
| 05/16/2006 | US7045908 Semiconductor device and method for manufacturing the same |
| 05/16/2006 | US7045907 Semiconductor device and method of manufacturing same |
| 05/16/2006 | US7045906 Resin-encapsulated package, lead member for the same and method of fabricating the lead member |
| 05/16/2006 | US7045905 Molded package and semiconductor device using molded package |
| 05/16/2006 | US7045904 Patterned plasma treatment to improve distribution of underfill material |
| 05/16/2006 | US7045903 Integrated power circuits with distributed bonding and current flow |
| 05/16/2006 | US7045902 Circuitized substrate for fixing solder beads on pads |
| 05/16/2006 | US7045900 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device |
| 05/16/2006 | US7045899 Semiconductor device and fabrication method of the same |
| 05/16/2006 | US7045898 Semiconductor device and manufacturing method thereof |
| 05/16/2006 | US7045897 Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same |
| 05/16/2006 | US7045896 Metal interconnect layer of semiconductor device and method for forming a metal interconnect layer |
| 05/16/2006 | US7045895 Semiconductor device and method for manufacturing the same |
| 05/16/2006 | US7045894 Semiconductor device and manufacturing method thereof |
| 05/16/2006 | US7045893 Semiconductor package and method for manufacturing the same |
| 05/16/2006 | US7045892 Stack package of semiconductor device |
| 05/16/2006 | US7045891 Sockets for module extension and memory system using same |
| 05/16/2006 | US7045890 Heat spreader and stiffener having a stiffener extension |
| 05/16/2006 | US7045889 Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| 05/16/2006 | US7045888 Ultra thin dual chip image sensor package structure and method for fabrication |
| 05/16/2006 | US7045887 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 05/16/2006 | US7045886 Semiconductor device and method of fabricating the same |
| 05/16/2006 | US7045885 Placement of absorbing material in a semiconductor device |
| 05/16/2006 | US7045884 Semiconductor device package |
| 05/16/2006 | US7045883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same |
| 05/16/2006 | US7045882 Semiconductor package including flip chip |
| 05/16/2006 | US7045881 Electronic component with shielding and method for its production |
| 05/16/2006 | US7045878 Selectively bonded thin film layer and substrate layer for processing of useful devices |
| 05/16/2006 | US7045870 Solid image-pickup device and method for manufacturing the solid image pickup device |
| 05/16/2006 | US7045865 Semiconductor device with resistor elements formed on insulating film |
| 05/16/2006 | US7045863 Semiconductor device |
| 05/16/2006 | US7045849 Use of voids between elements in semiconductor structures for isolation |
| 05/16/2006 | US7045831 Semiconductor device |
| 05/16/2006 | US7045827 Lids for wafer-scale optoelectronic packages |
| 05/16/2006 | US7045755 Image sensor package and system |
| 05/16/2006 | US7045712 Method of producing an electronic device and electronic device |
| 05/16/2006 | US7045711 Module for a data carrier with improved bump counterparts |
| 05/16/2006 | US7045562 Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls |
| 05/16/2006 | US7045472 Method and apparatus for selectively altering dielectric properties of localized semiconductor device regions |
| 05/16/2006 | US7045470 Methods of making thin dielectric layers on substrates |
| 05/16/2006 | US7045460 Method for fabricating a packaging substrate |
| 05/16/2006 | US7045458 Semiconductor and method of manufacturing the same |
| 05/16/2006 | US7045452 Circuit structures and methods of forming circuit structures with minimal dielectric constant layers |
| 05/16/2006 | US7045443 Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus |
| 05/16/2006 | US7045441 Method for forming a single-crystal silicon layer on a transparent substrate |
| 05/16/2006 | US7045434 Semiconductor device and method for manufacturing the same |
| 05/16/2006 | US7045409 Semiconductor device having active regions connected together by interconnect layer and method of manufacture thereof |
| 05/16/2006 | US7045399 Electronic circuit |
| 05/16/2006 | US7045396 Stackable semiconductor package and method for manufacturing same |
| 05/16/2006 | US7045395 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader |
| 05/16/2006 | US7045394 Method of manufacturing semiconductor device and system of manufacturing semiconductor device |
| 05/16/2006 | US7045393 Method for manufacturing circuit devices |
| 05/16/2006 | US7045392 Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment |
| 05/16/2006 | US7045391 Multi-chips bumpless assembly package and manufacturing method thereof |
| 05/16/2006 | US7045390 Stacked die package |
| 05/16/2006 | US7045389 Method for fabricating a semiconductor devices provided with low melting point metal bumps |
| 05/16/2006 | US7045388 Semiconductor device provided with low melting point metal bumps |
| 05/16/2006 | US7045386 Semiconductor device and semiconductor chip for use therein |
| 05/16/2006 | US7045372 Apparatus and method for forming a battery in an integrated circuit |
| 05/16/2006 | US7045113 Wherein molybdenum encapsulates copper; may be sintered without copper leakage |
| 05/16/2006 | US7044802 USB flash-memory card with perimeter frame and covers that allow mounting of chips on both sides of a PCB |
| 05/16/2006 | US7044388 Non-contact IC card having enhanced reliability |
| 05/16/2006 | US7044212 Refrigeration device and a method for producing the same |
| 05/16/2006 | US7044204 Heat dissipating device with fan holder |
| 05/16/2006 | US7044202 Cooler for electronic devices |
| 05/16/2006 | US7044201 Flat heat transferring device and method of fabricating the same |
| 05/16/2006 | US7044199 Porous media cold plate |
| 05/16/2006 | US7044198 Electronic apparatus |
| 05/16/2006 | US7044197 Heat sink with combined fins |