| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/18/2006 | US20060103018 Coating support and method for the selective coating of conductive tracks on one such support |
| 05/18/2006 | US20060103017 Semiconductor device |
| 05/18/2006 | US20060103016 Heat sinking structure |
| 05/18/2006 | US20060103015 Multi-chip electronic package and cooling system |
| 05/18/2006 | US20060103014 Heat dissipating packages structure and method for fabricating the same |
| 05/18/2006 | US20060103013 Techniques for cooling a circuit board component within an environment with little or no forced convection airflow |
| 05/18/2006 | US20060103012 Solid-state semiconductor light emitting device |
| 05/18/2006 | US20060103011 Apparatus and methods for cooling semiconductor integrated circuit chip packages |
| 05/18/2006 | US20060103010 Semiconductor package system with substrate heat sink |
| 05/18/2006 | US20060103009 Integrated circuit package system with heat slug |
| 05/18/2006 | US20060103008 Hyper thermally enhanced semiconductor package system |
| 05/18/2006 | US20060103007 Heater for annealing trapped charge in a semiconductor device |
| 05/18/2006 | US20060103006 Substrate design to improve chip package reliability |
| 05/18/2006 | US20060103005 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |
| 05/18/2006 | US20060103004 Wiring board for semiconductor integrated circuit package and semiconductor integrated circuit device using the same |
| 05/18/2006 | US20060103003 Modular construction component with encapsulation |
| 05/18/2006 | US20060103002 Semiconductor packages with asymmetric connection configurations |
| 05/18/2006 | US20060103001 Configuration terminal for integrated devices and method for configuring an integrated device |
| 05/18/2006 | US20060103000 Electronic device package and electronic equipment |
| 05/18/2006 | US20060102999 Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end |
| 05/18/2006 | US20060102998 Flip-chip component |
| 05/18/2006 | US20060102997 Semiconductor module and method of manufacturing the same |
| 05/18/2006 | US20060102996 Stack package using anisotropic conductive film (ACF) and method of making same |
| 05/18/2006 | US20060102995 Apparatus for stacking electrical components using insulated and interconnecting via |
| 05/18/2006 | US20060102994 Multi-chip semiconductor package and fabrication method thereof |
| 05/18/2006 | US20060102993 Method and apparatus for stacking electrical components using via to provide interconnection |
| 05/18/2006 | US20060102992 Multi-chip package |
| 05/18/2006 | US20060102991 Semiconductor apparatus |
| 05/18/2006 | US20060102990 Carrier for substrate film |
| 05/18/2006 | US20060102989 Integrated circuit package system with leadframe substrate |
| 05/18/2006 | US20060102987 Marking method and sheet for both protective film forming and dicing |
| 05/18/2006 | US20060102956 Etch-stop layers for patterning block structures for reducing thermal protrusion |
| 05/18/2006 | US20060102951 Nonvolatile Memory Device and Method for Manufacturing the Same |
| 05/18/2006 | US20060102936 Lead frame for a semiconductor device |
| 05/18/2006 | US20060102935 Transistor-based biosensors having gate electrodes coated with receptor molecules |
| 05/18/2006 | US20060102923 Optical element housing package |
| 05/18/2006 | US20060102873 Getter |
| 05/18/2006 | US20060102701 Bump formation method and bump forming apparatus for semiconductor wafer |
| 05/18/2006 | US20060102485 Electroless plating method, electroless plating device, and production method and production device of semiconductor device |
| 05/18/2006 | US20060102374 Component with ultra-high frequency connections in a substrate |
| 05/18/2006 | US20060102373 Member for semiconductor device |
| 05/18/2006 | DE19729677B4 Gehäuse für Halbleiterbauelemente, insbesondere für Leistungshalbleiterbauelemente Enclosure for semiconductor devices, in particular for power semiconductor components |
| 05/18/2006 | DE112005000014T5 Innenleiterverbindungsstruktur und Mehrschichtsubstrat Inner conductor connection structure and multi-layer substrate |
| 05/18/2006 | DE112004001317T5 Verfahren zum Ausbilden eines Kontaktlochs mit einer Barrierenschicht in einem Bauelement und resultierendes Bauelement A method of forming a contact hole with a barrier layer in a device and resultant component |
| 05/18/2006 | DE10349839B4 Elektrisches Bauelement mit einem transparenten Kunststoffgehäuse Electrical component with a transparent plastic case |
| 05/18/2006 | DE102004058305B3 Semiconductor component with polymer cover layer over electrical linkages leaving contacts exposed |
| 05/18/2006 | DE102004055333A1 Barrier layer system for encapsulating thin layer solar cells, acoustic surface wave components and similar components comprises thin layers of highly molten metals applied on the surface of a functional component to be protected |
| 05/18/2006 | DE102004055061A1 Verfahren zur Anordnung eines Flip-Chips auf einem Substrat A process for the assembly of a flip chip on a substrate |
| 05/18/2006 | DE102004053761A1 Halbleitereinrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation |
| 05/18/2006 | DE10126310B4 Leiterplattenvorrichtung, deren Verwendung und Halbleiterspeichervorrichtung Printed circuit board means, their use and the semiconductor memory device |
| 05/18/2006 | DE10038424B4 Elektronisches Bauelement mit Anschluss und Anschlussklemme Electronic device with connection and terminal |
| 05/17/2006 | EP1657758A2 Light emitting diode with molded lens and method of manufacturing the same |
| 05/17/2006 | EP1657750A1 Semiconductor device |
| 05/17/2006 | EP1657749A2 Multilevel microelectronic package with internal shielding |
| 05/17/2006 | EP1657748A1 Semiconductor device, method for manufacturing same, and power converter using such semiconductor device |
| 05/17/2006 | EP1657747A1 Method of manufacturing highly moisture-sensitive electronic device elements |
| 05/17/2006 | EP1657746A1 Semiconductor device and method for making the same |
| 05/17/2006 | EP1657742A1 Flip chip system with organic/inorganic hybrid underfill composition |
| 05/17/2006 | EP1656819A2 Thermally enhanced electronic module with self-aligning heat sink |
| 05/17/2006 | EP1656719A1 Pressure contact spring for a contact arrangement in a power semiconductor module |
| 05/17/2006 | EP1656698A2 Semiconductor device having electrical contact from opposite sides and method therefor |
| 05/17/2006 | EP1656695A1 Method for sealing thin film transistors |
| 05/17/2006 | EP1656636A2 Rfid device and method of making |
| 05/17/2006 | EP1656467A2 Copper-containing pvd targets and methods for their manufacture |
| 05/17/2006 | EP1656323A1 Boron nitride agglomerated powder |
| 05/17/2006 | EP1360719A4 Molds for wafer scale molding of protective caps |
| 05/17/2006 | EP1356515A4 Molding assembly for wafer scale molding of protective caps |
| 05/17/2006 | EP1356514A4 Use of infrared radiation in molding of protective caps |
| 05/17/2006 | EP1356513A4 Molding of protective caps |
| 05/17/2006 | EP1147556B1 Mechanical assembly for regulating the temperature of an electronic device |
| 05/17/2006 | EP0991119B1 Semiconductor device and method for manufacturing the same |
| 05/17/2006 | EP0985007B1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 05/17/2006 | CN2781573Y Integrated circuit component |
| 05/17/2006 | CN2781572Y Integrated circuit assembly and three-dimentional integrated circuit assembly |
| 05/17/2006 | CN2781571Y Cooling device of rectifier |
| 05/17/2006 | CN2781570Y Electronic chip heat sink of shades blind structure |
| 05/17/2006 | CN2781569Y CPU cooling device capable of quickly cooling |
| 05/17/2006 | CN2781568Y Device for fixing cover of heat sink |
| 05/17/2006 | CN2781567Y Improved structure of cooling fin |
| 05/17/2006 | CN2781566Y Central heat collection cooling plate and cooling mocule |
| 05/17/2006 | CN1774965A Module component and method for manufacturing the same |
| 05/17/2006 | CN1774959A Electomagnetic interference shielding for a printed circuit board |
| 05/17/2006 | CN1774958A High frequency heating apparatus |
| 05/17/2006 | CN1774838A Anisotropic conductive connector and circuit-device electrical-inspection device |
| 05/17/2006 | CN1774819A LED light assembly with active cooling |
| 05/17/2006 | CN1774810A Method for manufacturing backside-illuminated optical sensor |
| 05/17/2006 | CN1774806A Line element and semiconductor circuit applied with line element |
| 05/17/2006 | CN1774805A Low voltage silicon controlled rectifier (SCR) for electrostatic discharge (ESD) protection on silicon-on-insulator technologies |
| 05/17/2006 | CN1774804A EMI shielding for electronic component packaging |
| 05/17/2006 | CN1774803A Lead frame for semiconductor device |
| 05/17/2006 | CN1774802A Circuit device with at least partial packaging and method for forming |
| 05/17/2006 | CN1774801A Insulated power semiconductor module with reduced partial discharge and manufacturing method |
| 05/17/2006 | CN1774800A Metal-base circuit board and its manufacturing method |
| 05/17/2006 | CN1774674A Masking arrangement and method for producing integrated circuit arrangements |
| 05/17/2006 | CN1774475A Acrylic-based thermally conductive composition and thermally conductive sheet |
| 05/17/2006 | CN1774159A 等离子体显示器面板组件 Plasma display panel assembly |
| 05/17/2006 | CN1773740A Integrated thermoelectric cooling devices and methods for fabricating same |
| 05/17/2006 | CN1773734A Light-emitting diode support and producing method thereof |
| 05/17/2006 | CN1773704A A semiconductor structure for electrostatic discharge protection |
| 05/17/2006 | CN1773701A Electronic packed element containing photoelectric element and integrated circuit |