Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/30/2014DE102013221674A1 Elektronische vorrichtung und verfahren zum herstellen derselben Electronic device and method of manufacturing the same
04/30/2014DE102013211552B3 Method for producing hetero-structure-type transistor e.g. power transistor for use in control device for electromotor in hybrid or electric car, involves connecting hetero-structure comprising carrier layer for dissipating heat
04/30/2014DE102013112029A1 Halbleiterbauelement mit Kapselung Semiconductor component with encapsulation
04/30/2014DE102013111772A1 Halbleiterbauelemente und Verfahren zur Herstellung von Halbleiterbauelementen Semiconductor devices and methods of manufacturing of semiconductor devices
04/30/2014DE102013111524A1 Druckerfassungsvorrichtung und Herstellungsverfahren derselben The pressure sensing device and manufacturing method thereof
04/30/2014DE102013104950B3 Leistungshalbleitermodul und Anordnung hiermit Power semiconductor module and assembly hereby
04/30/2014DE102013104268A1 Integrierte Schaltkreisstrukturen, die Basiswiderstandsabstimmungsbereiche aufweisen, und Verfahren zum Ausbilden derselben Integrated circuit structures having base resistance voting regions, and method of forming same
04/30/2014DE102013100645A1 Halbleiterbauteile, Verfahren zur Herstellung dieser sowie gepackte Halbleiterbauteile Semiconductor devices, processes for preparing these and packaged semiconductor devices
04/30/2014DE102013005984A1 Abgeschirmtes System Shielded system
04/30/2014DE102013000911A1 Formgehäuse für lichtemittierende Vorrichtung und lichtemittierende Vorrichtung, die dieses verwendet Case shape light emitting device and light emitting device using this
04/30/2014DE102012219879A1 Verfahren zum Herstellen eines LED-Moduls mit Kühlkörper A method for manufacturing an LED module with heat sink
04/30/2014DE102012219661A1 Individualisierte Spannungsversorgung von Bauelementen integrierter Schaltungen alsSchutzmaßnahme gegen Seitenkanalangriffe Individualized supply of components integrated circuits alsSchutzmaßnahme against side channel attacks
04/30/2014DE102012219622A1 Micro-technological component e.g. acceleration sensor, has interlayer arranged between substrate and multi-layer, where side surfaces of interlayer are covered by cover and bond is arranged between multi-layer and silicon layer
04/30/2014DE102012110322A1 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate
04/30/2014DE102012110261A1 Gehäuse für ein optoelektronisches Bauelement und Verfahren zur Herstellung eines Gehäuses A housing for an optoelectronic device and method for producing a housing
04/30/2014DE102009024370B4 Stromrichteranordnung mit Kühleinrichtung und Herstellungsverfahren hierzu Converter arrangement with cooling device and manufacturing method therefor
04/30/2014DE102007057728B4 Verfahren zur Herstellung eines Halbleiterbauelements mit einer Kurzschlusstruktur A process for producing a semiconductor device with a Kurzschlusstruktur
04/30/2014DE102006033222B4 Modul mit flachem Aufbau und Verfahren zur Bestückung Module having a flat structure and method for mounting
04/30/2014CN203573987U SMD diode
04/30/2014CN203573985U Alternating-current integrated built-in IC-package LED drive circuit module group
04/30/2014CN203573979U Igbt module
04/30/2014CN203573978U Chip packaging structure
04/30/2014CN203573977U IC chip stacking packaging part with high packaging density and good high-frequency performance
04/30/2014CN203573976U Four-surface flat no-pin packaging part with solder ball surface array
04/30/2014CN203573975U Novel semiconductor lead frame structure
04/30/2014CN203573974U SMD diode
04/30/2014CN203573973U DFN packaging lead frame
04/30/2014CN203573972U Novel radiator for IGBT module
04/30/2014CN203573971U Heat tube radiator used for thyristor
04/30/2014CN203573970U Insulation heat conduction structure for semiconductor element heat radiation bottom plate and heat radiation bottom plate thereof
04/30/2014CN203573969U Energy storage radiating fin
04/30/2014CN203573968U Igbt module
04/30/2014CN203573967U Chip overlapping and packaging structure
04/30/2014CN203573966U Four-surface flat no-pin packaging part with solder ball surface array
04/30/2014CN103765751A Power conversion device
04/30/2014CN103765578A Integrated circuit package
04/30/2014CN103765577A Power module
04/30/2014CN103765576A Hollow sealing structure
04/30/2014CN103765574A 半导体装置 Semiconductor device
04/30/2014CN103765563A 金属充填装置 Metal filling device
04/30/2014CN103765560A Metal filling apparatus
04/30/2014CN103764756A Resin composition for sealing electrical and electronic parts, method for producing sealed electrical and electronic parts, and sealed electrical and electronic parts
04/30/2014CN103764733A Method for producing thermally conductive sheet
04/30/2014CN103762294A Ceramic substrate with temperature sensing function and manufacturing method of ceramic substrate with temperature sensing function
04/30/2014CN103762214A Integrated circuit module applied to switching type adjuster
04/30/2014CN103762213A Integrated circuit module applied to switch-type regulator
04/30/2014CN103762212A Integrated circuit module applied to switch-type regulator
04/30/2014CN103762208A Semiconductor structure
04/30/2014CN103762207A Method for solving problem of DV lithography alignment mark damage
04/30/2014CN103762206A Electronic device interconnection body
04/30/2014CN103762205A Multifunctional base plate based on PCB technology and manufacturing method thereof
04/30/2014CN103762204A Chip-on-film module, display panel and display
04/30/2014CN103762203A Heat dissipation structure based on rigid-flexible printed circuit board three-dimensional packaging and manufacturing method
04/30/2014CN103762202A Chip packaging method and structure
04/30/2014CN103762201A MEMS sensor, semiconductor package device and method
04/30/2014CN103762200A Chip packaging part and packaging method of chip packaging part
04/30/2014CN103762187A Chip packaging method and structure
04/30/2014CN103762184A Chip package and a method for manufacturing a chip package
04/30/2014CN103761562A Double-interface IC manufacturing method and automatic production device of double-interface IC
04/30/2014CN103760728A Array substrate and display device thereof
04/30/2014CN103760721A Thin film transistor array substrate, preparation method for same and display device of thin film transistor array substrate
04/30/2014CN103759880A Leadless packaging structure and SOI absolute pressure sensitive device of leadless packaging structure
04/30/2014CN102792168B Mems传感器 Mems Sensor
04/30/2014CN102468260B Lead frame with compatible high voltage and low voltage, lead frame array and packaging structure thereof
04/30/2014CN102437147B Dense-pitch small-pad copper-line bonded intelligent card (IC) chip stacking packing piece and preparation method thereof
04/30/2014CN102368471B COF (Chip On Flex) packaging method and structure for LCD (liquid crystal display) driving chips
04/30/2014CN102339818B Power module and manufacture method thereof
04/30/2014CN102280441B Semiconductor device
04/30/2014CN102254880B Chip packaging device and manufacturing method thereof
04/30/2014CN102244066B Power semiconductor module
04/30/2014CN102231372B Multi-turn arranged carrier-free IC (Integrated Circuit) chip packaging component and manufacturing method thereof
04/30/2014CN102163586B 半导体装置 Semiconductor device
04/30/2014CN102160285B Piezoelectric vibrating part
04/30/2014CN102142856B 便携式电子装置 The portable electronic device
04/30/2014CN102097343B Wire bonding method for copper wire and support plate pad, and structure
04/30/2014CN102089581B Remote cooling by combining heat pipe and resonator for synthetic jet cooling
04/30/2014CN102067248B Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications
04/30/2014CN102066864B Heat pipe, method of manufacturing heat pipe, and circuit board with heat pipe function
04/30/2014CN102045939B Metal layer structure of flexible multilayer base plate and preparation method thereof
04/30/2014CN101983427B Inductor with patterned ground plane
04/30/2014CN101865369B Light-emitting diode lamp
04/30/2014CN101794770B Display device and manufacturing method thereof
04/30/2014CN101728390B Two terminal multi-channel ESD device and method therefor
04/29/2014US8712598 Adaptive flow for thermal cooling of devices
04/29/2014US8710894 Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor
04/29/2014US8710735 Organic electroluminescence element
04/29/2014US8710682 Materials and methods for stress reduction in semiconductor wafer passivation layers
04/29/2014US8710681 Isolation rings for blocking the interface between package components and the respective molding compound
04/29/2014US8710679 Electrode structure and its manufacturing method, and semiconductor module
04/29/2014US8710678 Device and method including a soldering process
04/29/2014US8710677 Multi-chip package with a supporting member and method of manufacturing the same
04/29/2014US8710675 Integrated circuit package system with bonding lands
04/29/2014US8710674 Internal wiring structure of semiconductor device
04/29/2014US8710671 Multi-level integrated circuit, device and method for modeling multi-level integrated circuits
04/29/2014US8710670 Integrated circuit packaging system with coupling features and method of manufacture thereof
04/29/2014US8710669 Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer
04/29/2014US8710668 Integrated circuit packaging system with laser hole and method of manufacture thereof
04/29/2014US8710667 Semiconductor device
04/29/2014US8710666 Semiconductor device and method for fabricating the same
04/29/2014US8710665 Electronic component, a semiconductor wafer and a method for producing an electronic component
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