H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2006
05/25/2006	US20060108660 Amplifier circuit, control method of the same, and amplifier circuit module
05/25/2006	US20060108652 Microelectromechanical systems, and methods for encapsulating and fabricating same
05/25/2006	US20060108637 ESD protection apparatus for an electrical device
05/25/2006	US20060108607 Integrated circuit component and mounting method thereof
05/25/2006	US20060108601 Insulating substrate and semiconductor device
05/25/2006	US20060108583 System and method for removing film from planar substrate peripheries
05/25/2006	US20060108430 Electronic device and method of manufacturing the same
05/25/2006	US20060108146 Structure of electronic package and method for fabricating the same
05/25/2006	US20060108105 Modularized cooler
05/25/2006	US20060108099 Liquid-cooled pipe
05/24/2006	EP1659841A2 Printed circuit board
05/24/2006	EP1659838A2 Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate, and liquid-jetting head
05/24/2006	EP1659629A1 Semiconductor device and its manufacturing method
05/24/2006	EP1659628A1 High lead density electronic device
05/24/2006	EP1659627A1 chip scale package
05/24/2006	EP1659626A1 Lead-on-chip leadframe
05/24/2006	EP1659625A2 Semiconductor device and method for manufacturing the same, circuit board, and electronic instrument
05/24/2006	EP1658638A1 Microelectronic security coatings
05/24/2006	EP1658637A1 Press-fit diode comprising a silver-plated wire terminal
05/24/2006	EP1658636A1 Chip support of a lead frame for an integrated circuit package
05/24/2006	EP1658634A2 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
05/24/2006	EP1658508A1 Current sensor
05/24/2006	EP1310966B1 Composite electronic components
05/24/2006	EP1211292B1 Use of a crosslinked elastomer composition for sealing a semiconductor production apparatus
05/24/2006	EP0838090B1 A method of making a monolithic microwave circuit with thick conductors
05/24/2006	DE19931694B4 Verfahren zum Herstellen von elektrischen Schaltkreisen oder Modulen sowie elektrischer Schaltkreis oder elektrisches Modul hergestellt nach diesem Verfahren A method of making electrical circuits or modules as well as electrical circuit or electrical module manufactured according to this method
05/24/2006	DE19527611B4 Verfahren zum Herstellen eines Substrats für elektrische Schaltkreise A method for producing a substrate for electrical circuits
05/24/2006	DE112004001018T5 Hohe Wärmeleitfähigkeit aufweisendes Masseneinsatzmaterial und Verfahren zum Herstellen desselben Thereof exhibiting high thermal conductivity mass feedstock and process for producing
05/24/2006	DE102004055955A1 Anordnung zum Kontaktieren einer in einem Gehäuse integrierten Schaltung Arrangement for contacting an integrated circuit contained in a housing
05/24/2006	DE102004055900A1 Production process for porous ceramic bodies having enhanced rigidity infiltrates with solvent for a component and leaves for a period at below 150 degrees
05/24/2006	DE102004055534A1 Power semiconductor module, has wiring layer internally connected with sprayed layer, coated on insulating layer and formed by spraying particle on particle area of heat-sink in stream of hot gas
05/24/2006	DE102004055057A1 Protection for integrated sensor circuit output from overvoltage, reverse polarity and supply line faults, includes semiconductor switch operating in accordance with limiting potentials
05/24/2006	DE102004054598A1 Halbleiterbauteil mit mindestens einem Halbleiterchip und Abdeckmasse und Verfahren zur Herstellung desselben Of the same semiconductor device with at least one semiconductor chip and covering composition and methods for preparing
05/24/2006	DE102004054597A1 Elektronisches Bauteil und Verfahren zur Herstellung des elektronischen Bauteils Electronic component and method for manufacturing the electronic component
05/24/2006	DE102004029587B4 Substratbasiertes BGA-Gehäuse, insbesondere FBGA-Gehäuse Substrate-based BGA package, in particular FBGA package
05/24/2006	DE102004019382B4 Kühlanordnung mit einer Montageplatte für elektronische Bauteile Cooling arrangement with a mounting plate for electronic components
05/24/2006	DE10159851B4 Halbleiterbauelementanordnung mit verminderter Oszillationsneigung Semiconductor device assembly with reduced to oscillation
05/24/2006	DE10104219B4 Anordnung zur aktiven Kühlung eines Halbleiterbausteins und Verfahren zum Betrieb der Anordnung Arrangement for active cooling of a semiconductor device and method of operation of the arrangement
05/24/2006	DE10102621B4 Leistungsmodul Power module
05/24/2006	DE10041112B4 Isolierelement Insulating
05/24/2006	CN2783126Y Radiation structure for high power LED lamp set
05/24/2006	CN1777992A 半导体器件 Semiconductor devices
05/24/2006	CN1777991A Lamp and method of producing a lamp
05/24/2006	CN1777990A Thermal interconnect systems methods of production and uses thereof
05/24/2006	CN1777989A Relay base plate and multilayer printed wiring board
05/24/2006	CN1777988A Taped lead frames and methods of making and using the same in semiconductor packaging
05/24/2006	CN1776971A Energy-saving lamp socket assembly with ballast
05/24/2006	CN1776909A Integrated circuit chip programmable and operation method
05/24/2006	CN1776907A P-type passage high-voltage input-output element with high static-discharge protection capacity
05/24/2006	CN1776906A Configuration system of chip identifying code and con figuration method
05/24/2006	CN1776905A Methods for incorporating high k dielectric materials for enhanced SRAM operation and structures produced thereby
05/24/2006	CN1776904A Mounting base-board and electronic equipment
05/24/2006	CN1776903A Semiconductor device and manufacturing method of semiconductor device
05/24/2006	CN1776902A Chip-arrange type component insulation structure and making method
05/24/2006	CN1776901A Package structure of memory card and packaging method for the structure
05/24/2006	CN1776900A Chip package structure and making method
05/24/2006	CN1776899A 半导体器件 Semiconductor devices
05/24/2006	CN1776898A Semiconductor wafer and testing method therefor
05/24/2006	CN1776897A Mirror-seat structure with chip package and making method therefor
05/24/2006	CN1776895A Integrated passive devices
05/24/2006	CN1776892A Wiring board and method of producing the same
05/24/2006	CN1776885A Electronic component and method for manufacturing the same
05/24/2006	CN1775656A Interconnection of high-density nano structure
05/24/2006	CN1257575C Coupling device using buried capacitors in multiple layered substrate
05/24/2006	CN1257552C 半导体器件 Semiconductor devices
05/24/2006	CN1257551C Semiconductor device and its producing method
05/24/2006	CN1257550C Semiconductor device and producing method thereof
05/24/2006	CN1257549C Semiconductor device and its manufacturing method
05/24/2006	CN1257548C Cooling device for evaporating and condensating refrigerant
05/24/2006	CN1257547C Multiphase low dielectric constant material and method of deposition and use
05/24/2006	CN1257546C Integrated circuit element installation structure and method
05/24/2006	CN1257545C Method for manufacturing electronic packaging, and electronic package
05/24/2006	CN1257544C Method for producing semiconductor device
05/24/2006	CN1257541C Method for forming packaging of flip-chip semiconductor
05/24/2006	CN1257540C Semiconductor chip package method and its package structure
05/23/2006	US7051311 Semiconductor circuit designing method, semiconductor circuit designing apparatus, program, and semiconductor device
05/23/2006	US7050308 Power conditioning module
05/23/2006	US7050304 Heat sink structure with embedded electronic components for semiconductor package
05/23/2006	US7050303 Semiconductor module with vertically mounted semiconductor chip packages
05/23/2006	US7050302 Captive socket actuator
05/23/2006	US7050291 Integrated ultracapacitor as energy source
05/23/2006	US7050290 Integrated capacitor
05/23/2006	US7050103 Image pickup device and cover plate with conductive film layer
05/23/2006	US7049836 Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method
05/23/2006	US7049746 Light-emitting unit and illuminator utilizing the same
05/23/2006	US7049740 Light emitting diode
05/23/2006	US7049706 Semiconductor device with staggered electrodes and increased wiring width
05/23/2006	US7049705 Chip structure
05/23/2006	US7049703 Semiconductor device having a tapered interconnection with insulating material on conductive sidewall thereof within through hole
05/23/2006	US7049702 Damascene structure at semiconductor substrate level
05/23/2006	US7049701 Semiconductor device using insulating film of low dielectric constant as interlayer insulating film
05/23/2006	US7049700 Semiconductor test board having laser patterned conductors
05/23/2006	US7049699 Low RC structures for routing body-bias voltage
05/23/2006	US7049698 Semiconductor integrated circuit having transistor with reduced resistance
05/23/2006	US7049697 Process for making fine pitch connections between devices and structure made by the process
05/23/2006	US7049696 IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device
05/23/2006	US7049695 Method and device for heat dissipation in semiconductor modules
05/23/2006	US7049694 Semiconductor package with crossing conductor assembly and method of manufacture
05/23/2006	US7049693 Electrical contact array for substrate assemblies
05/23/2006	US7049692 Stacked semiconductor device

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