| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/30/2006 | US7053474 Semiconductor component having at least two chips which are integrated in a housing and with which contact is made by a common contact chip |
| 05/30/2006 | US7053473 Compact integrated circuit package |
| 05/30/2006 | US7053471 Memory card |
| 05/30/2006 | US7053470 Multi-chip package having repairable embedded memories on a system chip with an EEPROM chip storing repair information |
| 05/30/2006 | US7053469 Leadless semiconductor package and manufacturing method thereof |
| 05/30/2006 | US7053468 IC substrate having over voltage protection function |
| 05/30/2006 | US7053467 Leadframe alteration to direct compound flow into package |
| 05/30/2006 | US7053466 High-speed signaling interface with broadside dynamic wave coupling |
| 05/30/2006 | US7053462 Planarization of metal container structures |
| 05/30/2006 | US7053461 Semiconductor device |
| 05/30/2006 | US7053460 Multi-level RF passive device |
| 05/30/2006 | US7053458 Suppressing radiation charges from reaching dark signal sensor |
| 05/30/2006 | US7053453 Substrate contact and method of forming the same |
| 05/30/2006 | US7053452 Metal oxide semiconductor device for electrostatic discharge protection circuit |
| 05/30/2006 | US7053426 Semiconductor device with heat sink |
| 05/30/2006 | US7053405 Phase-shifting mask and semiconductor device |
| 05/30/2006 | US7053315 Junction structure and junction method for conductive projection |
| 05/30/2006 | US7053312 Flexible wiring boards |
| 05/30/2006 | US7053299 Flange for integrated circuit package |
| 05/30/2006 | US7053295 Electronic device, information processor, and electromagnetic radiation suppressing member |
| 05/30/2006 | US7053165 Semiconductor integrated circuit including an inductor and method of manufacturing the same |
| 05/30/2006 | US7052995 Process of manufacturing semiconductor device including chemical-mechanical polishing |
| 05/30/2006 | US7052987 Method for fabricating a low capacitance wiring layout |
| 05/30/2006 | US7052985 Contact structure for an integrated semiconductor device |
| 05/30/2006 | US7052984 Bump formation method and bump forming apparatus for semiconductor wafer |
| 05/30/2006 | US7052975 Semiconductor chip and fabrication method thereof |
| 05/30/2006 | US7052955 Semiconductor memory device and manufacturing method thereof |
| 05/30/2006 | US7052938 Flip clip attach and copper clip attach on MOSFET device |
| 05/30/2006 | US7052937 Method and structure for providing improved thermal conduction for silicon semiconductor devices |
| 05/30/2006 | US7052935 Flip-chip package and fabricating process thereof |
| 05/30/2006 | US7052933 Method of manufacturing an electronic device, and electronic device |
| 05/30/2006 | US7052932 Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication |
| 05/30/2006 | US7052922 Stable electroless fine pitch interconnect plating |
| 05/30/2006 | US7052620 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device |
| 05/30/2006 | US7052236 Heat-dissipating device and housing thereof |
| 05/30/2006 | US7052189 Optical electronic device |
| 05/30/2006 | US7051934 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses |
| 05/30/2006 | US7051792 Heat dissipation device |
| 05/30/2006 | US7051791 Cooling apparatus and electronic equipment |
| 05/30/2006 | US7051790 Protect cover for a radiator |
| 05/30/2006 | US7051434 Designing a ball assignment for a ball grid array package |
| 05/30/2006 | US7051427 Integrated circuit trimming device broken die sensor |
| 05/30/2006 | CA2227612C Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom |
| 05/26/2006 | WO2006055906A2 Assembly for regulating the temperature of an integrated circuit |
| 05/26/2006 | WO2006055645A2 Rfid tag in a substrate |
| 05/26/2006 | WO2006055456A1 Method of making light emitting device with silicon-containing encapsulant |
| 05/26/2006 | WO2006055196A1 Method of making light emitting device with silicon-containing encapsulant |
| 05/26/2006 | WO2006054637A1 Wiring board, method for manufacturing same and semiconductor device |
| 05/26/2006 | WO2006054606A1 Semiconductor device and method for manufacturing semiconductor device |
| 05/26/2006 | WO2006054339A1 Semiconductor device |
| 05/26/2006 | WO2006053937A1 Cooling of a heated component |
| 05/26/2006 | WO2006053891A1 Off-width pitch for improved circuit card routing |
| 05/26/2006 | WO2006053846A1 Semiconductor switching module |
| 05/26/2006 | WO2006053832A1 Device and method for fabricating double-sided soi wafer scale package with through via connections |
| 05/26/2006 | WO2006038543A3 Light emitting device, lighting equipment or liquid crystal display device using such light emitting device |
| 05/26/2006 | WO2006036601A3 Process control monitors for the fabrication interferometric modulators |
| 05/26/2006 | WO2006012012A3 Chip-to-chip trench circuit structure |
| 05/26/2006 | WO2005069828A3 Thermal protection for electronic components during processing |
| 05/25/2006 | US20060110927 Package for a semiconductor device |
| 05/25/2006 | US20060110915 Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof |
| 05/25/2006 | US20060110893 Glass-type planar substrate, use thereof, and method for the production thereof |
| 05/25/2006 | US20060110886 MOSFET structure and method of fabricating the same |
| 05/25/2006 | US20060110858 Ultra-thin semiconductor package device and method for manufacturing the same |
| 05/25/2006 | US20060110857 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
| 05/25/2006 | US20060110850 Method for two-stage transfer molding device to encapsulate MMC module |
| 05/25/2006 | US20060110838 Multilayered circuit substrate, semiconductor device and method of producing same |
| 05/25/2006 | US20060110097 Optical device and optical apparatus |
| 05/25/2006 | US20060108700 Semiconductor device, method and apparatus for fabricating the same |
| 05/25/2006 | US20060108699 Electronic part and method for manufacturing the same |
| 05/25/2006 | US20060108698 Microelectronic assemblies and methods of making microelectronic assemblies |
| 05/25/2006 | US20060108697 Multi-chips semiconductor device assemblies and methods for fabricating the same |
| 05/25/2006 | US20060108696 Structure for reducing stress-induced voiding in an interconnect of integrated circuits |
| 05/25/2006 | US20060108695 Semiconductor device and manufacturing method of the same |
| 05/25/2006 | US20060108694 Circuit layout structure and method |
| 05/25/2006 | US20060108693 Solder for fabricating solder bumps and pumping process |
| 05/25/2006 | US20060108692 Bit line structure and method for the production thereof |
| 05/25/2006 | US20060108691 Semiconductor device and manufacturing method of the same |
| 05/25/2006 | US20060108690 Circuit board with reduced simultaneous switching noise |
| 05/25/2006 | US20060108689 Method of manufacturing semiconductor device |
| 05/25/2006 | US20060108688 Large grained polycrystalline silicon and method of making same |
| 05/25/2006 | US20060108687 Using zeolites to improve the mechanical strength of low-k interlayer dielectrics |
| 05/25/2006 | US20060108686 Semiconductor device for fingerprint recognition |
| 05/25/2006 | US20060108685 Integrated circuit package and assembly thereof |
| 05/25/2006 | US20060108684 Power module, phase leg, and three-phase inverter |
| 05/25/2006 | US20060108683 Semiconductor device, radiographic imaging apparatus, and method for manufacturing the same |
| 05/25/2006 | US20060108681 Semiconductor component package |
| 05/25/2006 | US20060108680 Multi-layer printed circuit board wiring layout and method for manufacturing the same |
| 05/25/2006 | US20060108679 Method for testing a chip with a package and for mounting the package on a board |
| 05/25/2006 | US20060108678 Probe arrays and method for making |
| 05/25/2006 | US20060108677 Multi-chip package and method of fabricating the same |
| 05/25/2006 | US20060108676 Multi-chip package using an interposer |
| 05/25/2006 | US20060108675 Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale |
| 05/25/2006 | US20060108674 Package structure of memory card and packaging method for the structure |
| 05/25/2006 | US20060108673 Method for forming an encapsulated device and structure |
| 05/25/2006 | US20060108672 Die bonded device and method for transistor packages |
| 05/25/2006 | US20060108671 Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys |
| 05/25/2006 | US20060108670 Leadframe designs for integrated circuit plastic packages |
| 05/25/2006 | US20060108669 Light emitting element |
| 05/25/2006 | US20060108668 Tamper resistant packaging and approach |
| 05/25/2006 | US20060108663 Surface mount inductor with integrated componentry |