| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/31/2006 | EP1661181A1 Surface-mounted device with leads |
| 05/31/2006 | EP1661180A2 Electronic component packaging |
| 05/31/2006 | EP1661179A1 Active area bonding compatible high current structures |
| 05/31/2006 | EP1661178A1 Electronic component comprising a cooling surface |
| 05/31/2006 | EP1661174A1 Process for fabricating electronic components using liquid injection molding |
| 05/31/2006 | EP1661168A1 Integrated circuit with a capacitor and method for the production thereof |
| 05/31/2006 | EP1661160A2 Supercritical fluid-assisted deposition of materials on semiconductor substrates |
| 05/31/2006 | EP1661157A2 Method and device for contacting semiconductor chips |
| 05/31/2006 | EP1661138A1 Method and arrangement for the production of a memory chip having different data bit widths |
| 05/31/2006 | EP1660897A2 Temperature control system which sprays liquid coolant droplets against an ic-module and directs radiation against the ic-module |
| 05/31/2006 | EP1660585A1 Thin bond-line silicone adhesive composition and method for preparing the same |
| 05/31/2006 | EP1660578A2 Nano-filled composite materials with exceptionally high glass transition temperature |
| 05/31/2006 | EP1660403A1 Fabricating nanoscale and atomic scale devices |
| 05/31/2006 | EP1415344B1 Semiconductor structure implementing sacrificial material and methods for making and implementing the same |
| 05/31/2006 | EP1221177B1 Conformal lining layers for damascene metallization |
| 05/31/2006 | EP1135796B1 PROCESS FOR FORMING A SiON/SiO2 INTERLEVEL DIELECTRIC WITH AFTER-TREATMENT OF THE CVD SILICIUM OXYNITRIDE LAYER |
| 05/31/2006 | EP1099252A4 Electrically isolated power semiconductor package |
| 05/31/2006 | EP1062848A4 Integrated circuit connection using an electrically conductive adhesive |
| 05/31/2006 | EP1043591B1 Power semiconductor module |
| 05/31/2006 | CN2785322Y Heat radiator |
| 05/31/2006 | CN2785143Y Metal socket of LED |
| 05/31/2006 | CN2785140Y Stack structure of semiconductor chip |
| 05/31/2006 | CN2785138Y Aluminum section bar water-cooling heat radiator for semiconductor device |
| 05/31/2006 | CN2785137Y Heat pipe and heat radiator of CPU |
| 05/31/2006 | CN2785136Y Heat radiating lid cartridge clip |
| 05/31/2006 | CN2785135Y Heat radiator with assistant heat radiating fin |
| 05/31/2006 | CN2785134Y Tooth-shaped basic batten for semiconductor ball grid array package |
| 05/31/2006 | CN1781189A Electronic component and method of manufacturing same |
| 05/31/2006 | CN1781155A Memory circuit arrangement and method for the production thereof |
| 05/31/2006 | CN1781007A Cooling device of thin plate type for preventing dry-out |
| 05/31/2006 | CN1780545A Heating assembly with radiating structure |
| 05/31/2006 | CN1780544A Radiator unit |
| 05/31/2006 | CN1779980A Dielectric multilayer of microelectronic device and method of fabricating the same |
| 05/31/2006 | CN1779977A Semiconductor device |
| 05/31/2006 | CN1779972A Semiconductor device with inverted chip packer coating and its production thereof |
| 05/31/2006 | CN1779971A Semiconductor device and method for producing the same |
| 05/31/2006 | CN1779969A Integrated circuit structure with welding pad on top of active circuit |
| 05/31/2006 | CN1779968A Flexible displays |
| 05/31/2006 | CN1779967A Semiconductor device including metal-insulator-metal capacitor arrangement |
| 05/31/2006 | CN1779966A Semiconductor device |
| 05/31/2006 | CN1779965A Metal interconnecting structure and manufacture thereof |
| 05/31/2006 | CN1779964A Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same |
| 05/31/2006 | CN1779963A Manufacture of substrate and multi-chip assembly therewith |
| 05/31/2006 | CN1779962A Semiconductor device and manufacturing method of the same |
| 05/31/2006 | CN1779961A Semiconductor device and manufacturing method of the same |
| 05/31/2006 | CN1779960A Semiconductor device and manufacturing method of the same |
| 05/31/2006 | CN1779959A Semiconductor device and manufacturing method thereof, circuit board, electro-optic device, electronic device |
| 05/31/2006 | CN1779958A Fcbga package structure |
| 05/31/2006 | CN1779957A Pin shared system |
| 05/31/2006 | CN1779956A Hot pipe and capillary structure |
| 05/31/2006 | CN1779955A Agglomerated flat-tubing hot-pipe radiator |
| 05/31/2006 | CN1779954A Light-emitting diode radiating substrate and production thereof |
| 05/31/2006 | CN1779953A Radiating modules |
| 05/31/2006 | CN1779952A Radiating structure and package of semiconductor device |
| 05/31/2006 | CN1779951A Semiconductor device and a method for manufacturing of the same |
| 05/31/2006 | CN1779950A Composite structure with high heat dissipation |
| 05/31/2006 | CN1779949A Method of substrate in-place bonding of microstructures and its semiconductor structure |
| 05/31/2006 | CN1779948A Semiconductor integrated device, design method thereof, designing apparatus thereof, program thereof, manufacturing method thereof, and manufacturing apparatus thereof |
| 05/31/2006 | CN1779946A Method of forming low resistance and reliable via in inter-level dielectric interconnect |
| 05/31/2006 | CN1779945A Utilization of electric silicon fuse assembly |
| 05/31/2006 | CN1779932A Semiconductor package and fabrication method |
| 05/31/2006 | CN1779931A Radiating pack structure and production thereof |
| 05/31/2006 | CN1779907A Electronic part and method for manufacturing the same |
| 05/31/2006 | CN1779880A Use of non-crystal diamond material |
| 05/31/2006 | CN1779868A Conducting material with anisotropy |
| 05/31/2006 | CN1779406A Radiator |
| 05/31/2006 | CN1258308C Printed circuit board, its manufacturing method and semiconductor device |
| 05/31/2006 | CN1258252C 半导体激光器件 The semiconductor laser device |
| 05/31/2006 | CN1258217C Interconnection structure and method for forming the same |
| 05/31/2006 | CN1258208C Semiconductor device and method of manufacturing the same, semiconductor wafer, circuit board and electronic instrument |
| 05/31/2006 | CN1258190C Method for identifying integrated circuit |
| 05/30/2006 | US7055119 Customized mesh plane, method and computer program product for creating customized mesh planes within electronic packages |
| 05/30/2006 | US7055069 Spare input/output buffer |
| 05/30/2006 | US7054599 High density interconnect structure for use on software defined radio |
| 05/30/2006 | US7054159 Printed wiring board having heat radiating means and method of manufacturing the same |
| 05/30/2006 | US7054158 Cooling body |
| 05/30/2006 | US7053747 Method for producing a spiral inductance on a substrate, and a device fabricated according to such a method |
| 05/30/2006 | US7053696 Semiconductor device with resistor element |
| 05/30/2006 | US7053634 Test pattern for testing contact resistance of a subject via hole |
| 05/30/2006 | US7053521 Method for enhancing epoxy adhesion to gold surfaces |
| 05/30/2006 | US7053496 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor |
| 05/30/2006 | US7053495 Semiconductor integrated circuit device and method for fabricating the same |
| 05/30/2006 | US7053494 Semiconductor device and production method therefor |
| 05/30/2006 | US7053493 Semiconductor device having stiffener |
| 05/30/2006 | US7053492 Circuit device and method of manufacturing the same |
| 05/30/2006 | US7053491 Sperical core of high melting metal; connector of low melting eutectic |
| 05/30/2006 | US7053490 Planar bond pad design and method of making the same |
| 05/30/2006 | US7053489 Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection |
| 05/30/2006 | US7053487 Semiconductor device |
| 05/30/2006 | US7053486 Semiconductor device with improved design freedom of external terminal |
| 05/30/2006 | US7053485 Microelectronic packages with self-aligning features |
| 05/30/2006 | US7053484 Miniature broadband switched filter bank |
| 05/30/2006 | US7053483 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 05/30/2006 | US7053482 Ceramic package with radiating lid |
| 05/30/2006 | US7053481 High capacitance package substrate |
| 05/30/2006 | US7053480 Integrated circuit with offset pins |
| 05/30/2006 | US7053479 Package of semiconductor device and its manufacturing method |
| 05/30/2006 | US7053478 Pitch change and chip scale stacking system |
| 05/30/2006 | US7053477 Semiconductor multi-package module having inverted bump chip carrier second package |
| 05/30/2006 | US7053476 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |