| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/01/2006 | US20060114434 Apparatus to easily measure reticle blind positioning with an exposure apparatus |
| 06/01/2006 | US20060114013 Miniature fluid-cooled heat sink with integral heater |
| 06/01/2006 | US20060113685 Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device |
| 06/01/2006 | US20060113684 Bond pad for ball grid array package |
| 06/01/2006 | US20060113683 Doped alloys for electrical interconnects, methods of production and uses thereof |
| 06/01/2006 | US20060113682 Semiconductor component having plate and stacked dice |
| 06/01/2006 | US20060113681 Reinforced solder bump structure and method for forming a reinforced solder bump |
| 06/01/2006 | US20060113680 Microelectronic packages with solder interconnections |
| 06/01/2006 | US20060113679 Semiconductor device |
| 06/01/2006 | US20060113678 CSP chip stack with flex circuit |
| 06/01/2006 | US20060113677 Multi-chip module |
| 06/01/2006 | US20060113676 Semiconductor device and method of manufacture thereof |
| 06/01/2006 | US20060113675 Barrier material and process for Cu interconnect |
| 06/01/2006 | US20060113674 Semiconductor device and manufacturing method of semiconductor device |
| 06/01/2006 | US20060113673 Semiconductor device and fabrication method thereof |
| 06/01/2006 | US20060113672 Improved hdp-based ild capping layer |
| 06/01/2006 | US20060113671 Semiconductor device and method for manufacturing the same |
| 06/01/2006 | US20060113670 Multi-layer wiring, method of manufacturing the same and thin film transistor having the same |
| 06/01/2006 | US20060113669 Printed circuit board and manufacturing method thereof |
| 06/01/2006 | US20060113668 Substrate package structure and packaging method thereof |
| 06/01/2006 | US20060113666 Electronic component |
| 06/01/2006 | US20060113665 Wire bond interconnection |
| 06/01/2006 | US20060113664 Semiconductor device |
| 06/01/2006 | US20060113663 Heat stud for stacked chip package |
| 06/01/2006 | US20060113662 Micro heat pipe with wedge capillaries |
| 06/01/2006 | US20060113661 Cooling system of power semiconductor module |
| 06/01/2006 | US20060113660 Chip package mechanism |
| 06/01/2006 | US20060113659 Pulse transformer package and method for making the same |
| 06/01/2006 | US20060113658 Substrate core and method for fabricating the same |
| 06/01/2006 | US20060113657 Designated MOSFET and driver design to achieve lowest parasitics in discrete circuits |
| 06/01/2006 | US20060113656 Composite conductive film and semiconductor package using such film |
| 06/01/2006 | US20060113655 Semiconductor die attachment for high vacuum tubes |
| 06/01/2006 | US20060113654 Package of a semiconductor device with a flexible wiring substrate and method for the same |
| 06/01/2006 | US20060113653 Stack package for high density integrated circuits |
| 06/01/2006 | US20060113652 Battery mounted integrated circuit device |
| 06/01/2006 | US20060113651 IC card |
| 06/01/2006 | US20060113650 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element |
| 06/01/2006 | US20060113649 Light transmissive cover, device provided with same and methods for manufacturing them |
| 06/01/2006 | US20060113648 Semiconductor chip and tab package having the same |
| 06/01/2006 | US20060113647 Semiconductor device with improved heat dissipation |
| 06/01/2006 | US20060113646 Connection arrangement for micro lead frame plastic packages |
| 06/01/2006 | US20060113645 Microelectronic assemblies incorporating inductors |
| 06/01/2006 | US20060113644 Method for reducing harmonic distortion in comb drive devices |
| 06/01/2006 | US20060113643 Simplified multichip packaging and package design |
| 06/01/2006 | US20060113642 Semiconductor device |
| 06/01/2006 | US20060113641 Method of forming a field effect transistor having a stressed channel region |
| 06/01/2006 | US20060113640 Method and apparatus for polymer dielectric surface recovery by ion implantation |
| 06/01/2006 | US20060113639 Integrated circuit including silicon wafer with annealed glass paste |
| 06/01/2006 | US20060113637 Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
| 06/01/2006 | US20060113632 Semiconductor device and voltage regulator |
| 06/01/2006 | US20060113625 Semiconductor device having improved power density |
| 06/01/2006 | US20060113621 Methods for aligning semiconductor fabrication molds and semiconductor substrates |
| 06/01/2006 | US20060113613 Semiconductor device |
| 06/01/2006 | US20060113604 Methods for reduced circuit area and improved gate length control |
| 06/01/2006 | US20060113600 Body-biased pMOS protection against electrostatic discharge |
| 06/01/2006 | US20060113562 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
| 06/01/2006 | US20060113559 Notched compound semiconductor wafer |
| 06/01/2006 | US20060113558 Notched compound semiconductor wafer |
| 06/01/2006 | US20060113535 Probe look ahead: testing parts not currently under a probehead |
| 06/01/2006 | US20060113534 Test structure of semiconductor device |
| 06/01/2006 | US20060113533 Semiconductor device and layout design method for the same |
| 06/01/2006 | US20060113532 Multidirectional leakage path test structure |
| 06/01/2006 | US20060113471 Contact opening metrology |
| 06/01/2006 | US20060113289 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 06/01/2006 | US20060113184 Lead frame plating apparatus |
| 06/01/2006 | US20060113105 Package unit, printed board having the same, and electronic apparatus having the printed board |
| 06/01/2006 | US20060113062 Radiating fin assembly |
| 06/01/2006 | DE202006003380U1 Heat sink for e.g. central processing unit, has grooves provided on upper surface of side of fin and thread bolts fastened in continuous holes of carrier material and in screw holes of fin for fastening heating units with each other |
| 06/01/2006 | DE202006003004U1 Packing base plate for dissipation of strong waste heat of light emitting diode with high candlepower has heat dissipation element whose surface is provided with concavity and is connected to printed circuit board |
| 06/01/2006 | DE19755155B4 Elektronisches Modul Electronic module |
| 06/01/2006 | DE19744818B4 Signal testing apparatus for large circuits - has cell chain operating in normal mode to supply analog- digital signal to digital circuit and digital-analog signal to analog circuit and in test mode analog circuit is decoupled from digital circuit |
| 06/01/2006 | DE19700734B4 Verfahren zur Herstellung von Sensoren sowie nicht-vereinzelter Waferstapel Process for the production of sensors and non-singulated wafer stack |
| 06/01/2006 | DE112004001211T5 Wärmetauscher Heat exchanger |
| 06/01/2006 | DE112004000204T5 Verfahren und Vorrichtung zur Herstellung von preisgünstigen elektrokinetischen Pumpen Method and apparatus for the production of low-cost electrokinetic pumps |
| 06/01/2006 | DE102005054393A1 Isolierendes Substrat und Halbleiterbauelement Insulating substrate and the semiconductor component |
| 06/01/2006 | DE102005053689A1 ESD-Schutzvorrichtung für ein elektrisches Bauelement ESD protection device for an electrical component |
| 06/01/2006 | DE102005051142A1 Biegbarer Wärmeverteiler mit metallischer Mikrostruktur auf Basis eines Drahtnetzes sowie Verfahren zur Herstellung derselben Bendable heat spreader with metallic micro structure on the basis of a wire net as well as methods for producing the same |
| 06/01/2006 | DE102005028629A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 06/01/2006 | DE102004061876A1 Package structure, e.g. flip chip ball grid array package, includes substrate having conductive lines, solder bumps, patterned elastic dielectric layers, and conductive layer to form zigzag conductive layer pattern |
| 06/01/2006 | DE102004057804A1 Housing body for semiconductor chip e.g. light emitting diode, has poured ceramic material e.g. aluminum oxide or zirconium oxide, in which lead frame is partially embedded, and recess with material that partially surrounds chip |
| 06/01/2006 | DE102004057497A1 Heat exchange device for power semiconductor module, has fluid conduit conducting cooling liquid and arranged between layers such that conduit is limited by both layers, where one layer has thermally conductive material |
| 06/01/2006 | DE102004057485A1 Integrated power semiconductor component comprises a semiconductor material region, a semiconductor circuit, contact points, metallised regions and a protective material |
| 06/01/2006 | DE102004056534A1 Halbleiterbauteil mit einem Halbleiterchip und mit Außenkontakten sowie Verfahren zur Herstellung desselben Of the same semiconductor device with a semiconductor chip and to external contacts as well as methods for preparing |
| 06/01/2006 | DE102004056111A1 Halbleiterschaltmodul Semiconductor switching module |
| 06/01/2006 | DE102004055929A1 Non-volatile memory cell array e.g. 4F2 memory cell array, has cells formed by transistors, where source/drain connection of each transistor of two columns is connected with electrical conductor in respective metallization levels |
| 06/01/2006 | DE102004055677A1 Compound chip carrier, as an image sensor for military night sights and the like, has a chip bonded to the substrate with contact surfaces and conductive zones through the substrate |
| 06/01/2006 | DE102004054818A1 Reversibler Oxidationsschutz von Mikro-Bauelementen Reversible oxidation of micro-components |
| 06/01/2006 | DE102004054553A1 Moisture-sensitive electronic device element manufacture involves activating desiccant on internal surface of enclosure, upon exposure to microwave radiation of wavelength that is absorbed by water molecules |
| 06/01/2006 | DE10155020B4 Referenzprobe zur quantitativen Bestimmung von Oberflächenkontaminationen und Verfahren zu ihrer Herstellung Reference sample for quantitative determination of surface contamination and processes for their preparation |
| 06/01/2006 | DE10100460B4 Leistungshalbleitermodul mit Gehäuse und Anschlußelementen Power semiconductor module with housing and connection elements |
| 06/01/2006 | DE10031465B4 Kühleinrichtung für eine Schaltungsanordnung Cooling device for a circuit arrangement |
| 06/01/2006 | CA2587812A1 Non-evaporable getter alloys for hydrogen sorption |
| 05/31/2006 | EP1662852A1 Techniques for microchannel cooling |
| 05/31/2006 | EP1662570A2 Electronic device with a capacitor and an inductor and method of manufacturing the same |
| 05/31/2006 | EP1662567A2 Simplified multichip packaging and package design |
| 05/31/2006 | EP1662566A2 Semiconductor device and method of fabricating the same |
| 05/31/2006 | EP1662565A2 Semiconductor package |
| 05/31/2006 | EP1662564A1 Semiconductor package and manufacturing method thereof |
| 05/31/2006 | EP1661872A2 Process for manufacturing ceramic articles having improved strength at low temperatures, articles obtained thereby and their use |
| 05/31/2006 | EP1661850A1 Method for packaging a micro-component using a mould |