| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/06/2006 | US7057282 Semiconductor device and method for manufacturing the same, circuit board and electronic equipment |
| 06/06/2006 | US7057281 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
| 06/06/2006 | US7057280 Leadframe having lead locks to secure leads to encapsulant |
| 06/06/2006 | US7057279 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method |
| 06/06/2006 | US7057278 Semiconductor device |
| 06/06/2006 | US7057277 Chip package structure |
| 06/06/2006 | US7057276 Semiconductor package with heat sink |
| 06/06/2006 | US7057275 Device with power semiconductor components for controlling the power of high currents and use of said device |
| 06/06/2006 | US7057274 Semiconductor structures having through-holes sealed with feed-through metalization |
| 06/06/2006 | US7057273 Surface mount package |
| 06/06/2006 | US7057272 Power supply connection structure to a semiconductor device |
| 06/06/2006 | US7057271 Apparatus for connecting an IC terminal to a reference potential |
| 06/06/2006 | US7057270 Systems and methods for stacking chip components |
| 06/06/2006 | US7057269 Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package |
| 06/06/2006 | US7057267 Semiconductor device and method of fabrication thereof, electronic module, and electronic instrument |
| 06/06/2006 | US7057266 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device |
| 06/06/2006 | US7057265 Semiconductor device and process for fabrication thereof |
| 06/06/2006 | US7057264 Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates |
| 06/06/2006 | US7057263 Semiconductor wafer assemblies comprising photoresist over silicon nitride materials |
| 06/06/2006 | US7057262 High reflector tunable stress coating, such as for a MEMS mirror |
| 06/06/2006 | US7057261 Mixed LVR and HVR reticle set design for the processing of gate arrays, embedded arrays and rapid chip products |
| 06/06/2006 | US7057260 Method of making thin-film magnetic head |
| 06/06/2006 | US7057259 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them |
| 06/06/2006 | US7057247 Combined absolute differential transducer |
| 06/06/2006 | US7057232 Semiconductor structure with integrated shield |
| 06/06/2006 | US7057218 Edge intensive antifuse |
| 06/06/2006 | US7057217 Fuse arrangement and integrated circuit device using the same |
| 06/06/2006 | US7057210 Electrode for light-emitting semiconductor devices and method of producing the electrode |
| 06/06/2006 | US7057133 Methods of drilling through-holes in homogenous and non-homogenous substrates |
| 06/06/2006 | US7057116 Selective reference plane bridge(s) on folded package |
| 06/06/2006 | US7057114 Circuit board with added impedance |
| 06/06/2006 | US7057002 cyclic silylvinylsiloxane mixed with a germanium alkoxylate or halide; dielectrics for integrated circuits; improved mechanical properties and low dielectric constant |
| 06/06/2006 | US7056978 Toughened epoxy-anhydride no-flow underfill encapsulant |
| 06/06/2006 | US7056841 Method for fabricating semiconductor device |
| 06/06/2006 | US7056839 Method of forming a silica insulation film with a reduced dielectric constant |
| 06/06/2006 | US7056826 Method of forming copper interconnects |
| 06/06/2006 | US7056822 Method of fabricating an interconnect structure employing air gaps between metal lines and between metal layers |
| 06/06/2006 | US7056820 Bond pad |
| 06/06/2006 | US7056818 Semiconductor device with under bump metallurgy and method for fabricating the same |
| 06/06/2006 | US7056817 Forming a cap above a metal layer |
| 06/06/2006 | US7056813 Methods of forming backside connections on a wafer stack |
| 06/06/2006 | US7056812 Process for strengthening semiconductor substrates following thinning |
| 06/06/2006 | US7056811 Method for manufacturing semiconductor device |
| 06/06/2006 | US7056810 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance |
| 06/06/2006 | US7056807 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack |
| 06/06/2006 | US7056801 Radio frequency integrated circuit, and method for manufacturing the same |
| 06/06/2006 | US7056787 Method of manufacturing semiconductor device |
| 06/06/2006 | US7056772 Method for sealing semiconductor component |
| 06/06/2006 | US7056771 Method of forming an array of semiconductor packages |
| 06/06/2006 | US7056770 Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material |
| 06/06/2006 | US7056769 Method of manufacturing an electronic device |
| 06/06/2006 | US7056768 Cutting method and method of manufacturing semiconductor device |
| 06/06/2006 | US7056767 Method and apparatus for flip chip device assembly by radiant heating |
| 06/06/2006 | US7056766 Method of forming land grid array packaged device |
| 06/06/2006 | US7056765 Semiconductor device package and method of manufacture |
| 06/06/2006 | US7056763 Composite structure for electronic microsystems and method for production of said composite structure |
| 06/06/2006 | US7056752 Fabricating a die with test enable circuits between embedded cores |
| 06/06/2006 | US7056566 Preappliable phase change thermal interface pad |
| 06/06/2006 | US7056414 Connecting method for metal material and electric conductive plastic material and product thereby |
| 06/06/2006 | US7056406 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof |
| 06/06/2006 | US7056143 Electronic device having removable processor assembly and method of operating same |
| 06/06/2006 | US7056129 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
| 06/06/2006 | US7055589 Clip for heat sink |
| 06/06/2006 | US7055578 Heat dissipation device assembly with fan cover |
| 06/06/2006 | US7055577 Heat dissipation device for electronic device |
| 06/06/2006 | US7055532 Method to remove fluorine residue from bond pads |
| 06/06/2006 | US7055468 Drive arrangement for a motor vehicle |
| 06/06/2006 | US7055341 High efficiency cooling system and heat absorbing unit |
| 06/06/2006 | US7055241 Method of fabricating an integrated circuit package |
| 06/01/2006 | WO2006058175A2 System and method for removing film from planar substrate peripheries |
| 06/01/2006 | WO2006058030A2 Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys |
| 06/01/2006 | WO2006057940A1 Integrated multi-purpose getter for radio-frequency (rf) circuit modules |
| 06/01/2006 | WO2006057480A1 Package using selectively anodized metal and manufacturing method thereof |
| 06/01/2006 | WO2006057312A1 Wiring/electrode and sputtering target |
| 06/01/2006 | WO2006057298A1 Polymerizable composition |
| 06/01/2006 | WO2006057218A1 Curable composition and semiconductor device sealed/coated with such curable composition |
| 06/01/2006 | WO2006057205A1 Element mounting substrate and method for manufacturing same |
| 06/01/2006 | WO2006057175A1 Method for producing substrate having through hole filled with conductive material |
| 06/01/2006 | WO2006057117A1 Semiconductor device manufacturing method and semiconductor device |
| 06/01/2006 | WO2006057020A1 Non-evaporable getter alloys for hydrogen sorption |
| 06/01/2006 | WO2006056648A2 Electronics module and method for manufacturing the same |
| 06/01/2006 | WO2006056643A2 Method for manufacturing an electronics module |
| 06/01/2006 | WO2006056199A1 A flow distribution module and a stack of flow distribution modules |
| 06/01/2006 | WO2006005304A3 Semiconductor component with a semiconductor chip and electric connecting elements for connecting to a conductor structure |
| 06/01/2006 | WO2006002615A3 Electrical multi-layered component having a reliable soldering contact |
| 06/01/2006 | WO2006001032B1 Replaceable led system |
| 06/01/2006 | WO2005114731A3 Double density method for wirebond interconnect |
| 06/01/2006 | WO2005027200A8 Method and device for contacting vo semiconductor chips on a metallic substrate |
| 06/01/2006 | WO2004068558B1 Package for integrated circuit die |
| 06/01/2006 | US20060116004 Normally closed zero insertion force connector |
| 06/01/2006 | US20060115994 Pb-free solder-connected structure and electronic device |
| 06/01/2006 | US20060115974 Method of making a circuitized substrate |
| 06/01/2006 | US20060115951 Capacitor having an anodic metal oxide substrate |
| 06/01/2006 | US20060115932 Method for fabricating semiconductor components with conductive vias |
| 06/01/2006 | US20060115930 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument |
| 06/01/2006 | US20060115927 Attachment of flip chips to substrates |
| 06/01/2006 | US20060115751 Automated overlay metrology system |
| 06/01/2006 | US20060115637 Multilayer ceramic substrate and its manufacturing method |
| 06/01/2006 | US20060115596 Solution/suspension of precursors of lead, zirconium and titanium, which do not undergo ligand exchange (2,2,6,6-tetramethyl-3,5-heptanedione complexes); vaporized including Ar, N2, H2, He, or NH3 as a carrier and O2, N2O, or O3 as an oxidizing reactant |
| 06/01/2006 | US20060114656 Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core |