| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/07/2006 | EP1665359A2 Method of forming a bond pad |
| 06/07/2006 | EP1665337A2 Doped alloys for electrical interconnects, methods of production and uses thereof |
| 06/07/2006 | EP1665333A2 Coupler resource module |
| 06/07/2006 | EP1665294A2 Embedded toroidal inductors |
| 06/07/2006 | EP1664198A1 Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance |
| 06/07/2006 | EP1664192A1 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
| 06/07/2006 | EP1459379A4 Ebullition cooling device for heat generating component |
| 06/07/2006 | EP1407477A4 Improved connection assembly for integrated circuit sensors |
| 06/07/2006 | EP1356511A4 Use of protective caps as masks at a wafer scale |
| 06/07/2006 | CN2786787Y Interior connecting machine structure and IC assembly |
| 06/07/2006 | CN2786786Y Chip-type radiating module |
| 06/07/2006 | CN2786785Y Electric power and electronic power component module |
| 06/07/2006 | CN1784829A Piezoelectric device |
| 06/07/2006 | CN1784785A Module with built-in circuit element |
| 06/07/2006 | CN1784784A Composite material, electrical circuit or electric module |
| 06/07/2006 | CN1784783A Electrical or electronic component and method of producing same |
| 06/07/2006 | CN1784776A 非接触id卡及其制造方法 Non-contact id card and manufacturing method thereof |
| 06/07/2006 | CN1784775A Methods of selectively bumping integrated circuit substrates and related structures |
| 06/07/2006 | CN1784276A Fly ash powder, method for producing the same, and resin composition for sealing semiconductor using the same, and semiconductor device |
| 06/07/2006 | CN1784255A Method of crystallizing organic oligomer, epoxy resin composition containing organic oligomer obtained by the method and epoxy resin cured material |
| 06/07/2006 | CN1784135A Radiator and its producing method |
| 06/07/2006 | CN1784119A Flexible wiring substrate, method for producing it, semiconductor device and electronic device |
| 06/07/2006 | CN1784113A COF flexible printed wiring board and method of producing the wiring board |
| 06/07/2006 | CN1783721A Semiconductor integrated circuit |
| 06/07/2006 | CN1783510A MOS circuit arrangement |
| 06/07/2006 | CN1783508A Organic electroluminescent display device and method for fabricating the same |
| 06/07/2006 | CN1783503A Optical device and optical apparatus |
| 06/07/2006 | CN1783499A Semiconductor memory device |
| 06/07/2006 | CN1783494A 半导体晶片 Semiconductor wafer |
| 06/07/2006 | CN1783491A Semiconductor unit |
| 06/07/2006 | CN1783489A Semiconductor chip with ser immune cell structure |
| 06/07/2006 | CN1783487A Ciecuit device and its producing method |
| 06/07/2006 | CN1783484A Thin and small outer shape package combined by metal oxide semiconductor field effect transistor and schottky diode |
| 06/07/2006 | CN1783481A Semiconductor device |
| 06/07/2006 | CN1783480A Semiconductor device and method for manufacturing the same |
| 06/07/2006 | CN1783479A Interconnection structure and its forming method |
| 06/07/2006 | CN1783478A Semiconductor element of improved electronic migration and method for forming semiconductor element |
| 06/07/2006 | CN1783477A Semiconductor device and fabrication method thereof |
| 06/07/2006 | CN1783476A Interconnect structure of integrated circuit |
| 06/07/2006 | CN1783475A Internal on-line structure using diagonal layout |
| 06/07/2006 | CN1783474A Integrated circuit structure with switching welding pad set on active circuit top |
| 06/07/2006 | CN1783473A Insulating substrate and semiconductor device |
| 06/07/2006 | CN1783472A Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same |
| 06/07/2006 | CN1783471A Semiconductor packaging and semiconductor module |
| 06/07/2006 | CN1783470A 半导体装置 Semiconductor device |
| 06/07/2006 | CN1783469A Structure for integrated circuit wafer |
| 06/07/2006 | CN1783468A Electronic component |
| 06/07/2006 | CN1783467A Electronic packaging body and its soft circuit board |
| 06/07/2006 | CN1783466A Boiling cavity type radiator |
| 06/07/2006 | CN1783465A Mounting structure for integrated circuit element |
| 06/07/2006 | CN1783464A Heat dissipation system for multiple integrated circuits mounted on a printed circuit board |
| 06/07/2006 | CN1783463A Semiconductor chip heat transfer device |
| 06/07/2006 | CN1783462A Heat sink made from a singly extruded heatpipe |
| 06/07/2006 | CN1783461A Flip chip ball grid array package assemblies and electronic devices with heat dissipation capability |
| 06/07/2006 | CN1783460A Radiator and its noise reducing method |
| 06/07/2006 | CN1783459A Semiconductor device and its manufacturing method |
| 06/07/2006 | CN1783455A Storage element and array, method for making contact structure and produced device and element |
| 06/07/2006 | CN1783446A Method for manufacturing semiconductor device |
| 06/07/2006 | CN1783445A Surface mounted semiconductor electronic parts and producing method |
| 06/07/2006 | CN1783443A Optical device and its manufacturing method, optical module, circuit board and electronic equipment |
| 06/07/2006 | CN1783442A Wafer contact window of soft sheet bearing device and joint pad open and driving hole process |
| 06/07/2006 | CN1783427A Temperature-compensated resistor and fabrication method therefor |
| 06/07/2006 | CN1783424A Semiconductor device and producing method thereof |
| 06/07/2006 | CN1782947A High efficiency porous radiation fin array |
| 06/07/2006 | CN1782832A Array substrate with electrostatic discharge protection and display device and its producing method |
| 06/07/2006 | CN1782650A Foil sheet groove liquid sucking core of heat pipe radiator |
| 06/07/2006 | CN1781985A Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof |
| 06/07/2006 | CN1258958C Wiring board having sandwich layer containing inorganic filling |
| 06/07/2006 | CN1258954C Manufacturing method for circuit device |
| 06/07/2006 | CN1258817C Semiconductor device and its manufacture |
| 06/07/2006 | CN1258816C Semiconductor device and mfg. method thereof |
| 06/07/2006 | CN1258815C Electronic assembly comprising solderable thermal interface and methods of manufacture |
| 06/07/2006 | CN1258814C Method for making semiconductor device |
| 06/07/2006 | CN1258809C Method and device for alignment |
| 06/07/2006 | CN1258784C Method for mfg. laminated ceramic electronic device, assembly electronic device and laminated ceramic electronic device |
| 06/07/2006 | CN1258542C Amorphous copolymer of tetrafuoro ethylene and hexafluoro propylene |
| 06/06/2006 | USRE39120 Ceramic sintered product and process for producing the same |
| 06/06/2006 | US7057897 Means for securing a cooling device |
| 06/06/2006 | US7057896 Power module and production method thereof |
| 06/06/2006 | US7057895 Thermal standoff for close proximity thermal management |
| 06/06/2006 | US7057891 Heat dissipation structure |
| 06/06/2006 | US7057875 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor |
| 06/06/2006 | US7057301 Semiconductor wafer |
| 06/06/2006 | US7057300 Mask, method of producing mask, and method of producing semiconductor device |
| 06/06/2006 | US7057299 Alignment mark configuration |
| 06/06/2006 | US7057298 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
| 06/06/2006 | US7057297 Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods |
| 06/06/2006 | US7057296 Bonding pad structure |
| 06/06/2006 | US7057295 IC module assembly |
| 06/06/2006 | US7057294 Semiconductor device |
| 06/06/2006 | US7057293 Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same |
| 06/06/2006 | US7057292 Solder bar for high power flip chips |
| 06/06/2006 | US7057291 Methods for securing vertically mountable semiconductor devices in back-to back relation |
| 06/06/2006 | US7057290 Electronic parts packaging structure and method of manufacturing the same |
| 06/06/2006 | US7057289 Etch stop in damascene interconnect structure and method of making |
| 06/06/2006 | US7057288 Electric device and method for fabricating the same |
| 06/06/2006 | US7057287 Dual damascene integration of ultra low dielectric constant porous materials |
| 06/06/2006 | US7057286 Semiconductor device and method of manufacturing the same |
| 06/06/2006 | US7057284 Fine pitch low-cost flip chip substrate |
| 06/06/2006 | US7057283 Semiconductor device and method for producing the same |