| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/08/2006 | US20060118960 Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics |
| 06/08/2006 | US20060118959 Semiconductor device and the method of producing the same |
| 06/08/2006 | US20060118958 Line layout structure of semiconductor memory device |
| 06/08/2006 | US20060118957 Semiconductor device and fabricating method of the same |
| 06/08/2006 | US20060118956 System and method for manufacturing semiconductor devices using an anti-reflective coating layer |
| 06/08/2006 | US20060118955 Robust copper interconnection structure and fabrication method thereof |
| 06/08/2006 | US20060118954 Bit line barrier metal layer for semiconductor device and process for preparing the same |
| 06/08/2006 | US20060118953 Semiconductor component having thinned die with conductive vias |
| 06/08/2006 | US20060118952 Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device |
| 06/08/2006 | US20060118951 Switching element, antenna switch circuit and radio frequency module using the same |
| 06/08/2006 | US20060118950 Multi function module |
| 06/08/2006 | US20060118949 Integrated circuit cooling system and method |
| 06/08/2006 | US20060118948 Elevated heat dissipating device |
| 06/08/2006 | US20060118947 Thermal expansion compensating flip chip ball grid array package structure |
| 06/08/2006 | US20060118946 Semiconductor assembly with conductive rim and method of producing the same |
| 06/08/2006 | US20060118945 Low cost hermetic ceramic microcircuit package |
| 06/08/2006 | US20060118944 Method for fabricating semiconductor package having conductive bumps on chip |
| 06/08/2006 | US20060118943 Use of visco-elastic polymer to reduce acoustic and/or vibration induced error in microelectromechanical devices and systems |
| 06/08/2006 | US20060118942 Optoelectric module with handle-based delatching mechanism |
| 06/08/2006 | US20060118941 Semiconductor package and fabrication method thereof |
| 06/08/2006 | US20060118940 Semiconductor device and method of fabricating the same |
| 06/08/2006 | US20060118939 Stacked electronics for sensors |
| 06/08/2006 | US20060118938 Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging |
| 06/08/2006 | US20060118937 Stacked-type semiconductor package |
| 06/08/2006 | US20060118936 Circuit module component mounting system and method |
| 06/08/2006 | US20060118935 Laminated semiconductor substrate process for producing the same |
| 06/08/2006 | US20060118934 Multi-level semiconductor module and method for fabricating the same |
| 06/08/2006 | US20060118933 Stackable frames for packaging microelectronic devices |
| 06/08/2006 | US20060118932 Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method |
| 06/08/2006 | US20060118931 Assembly structure and method for embedded passive device |
| 06/08/2006 | US20060118930 Method and integrated circuits of module packing |
| 06/08/2006 | US20060118929 Ball assignment schemes for integrated circuit packages |
| 06/08/2006 | US20060118928 Electronic component device |
| 06/08/2006 | US20060118927 Memory module having interconnected and stacked integrated circuits |
| 06/08/2006 | US20060118926 Semiconductor package, memory card including the same, and mold for fabricating the memory card |
| 06/08/2006 | US20060118925 Liquid metal thermal interface material system |
| 06/08/2006 | US20060118924 Lead frame assemblies and decoupling capacitors |
| 06/08/2006 | US20060118923 Sharp corner lead frame |
| 06/08/2006 | US20060118922 Selectively growing a polymeric material on a semiconductor substrate |
| 06/08/2006 | US20060118921 Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip |
| 06/08/2006 | US20060118920 Method of wet etching vias and articles formed thereby |
| 06/08/2006 | US20060118916 Semiconductor wafer and a method for manufacturing a semiconductor wafer |
| 06/08/2006 | US20060118906 High power radio frequency integrated circuit capable of impeding parasitic current loss |
| 06/08/2006 | US20060118903 Molecular controlled semiconductor device |
| 06/08/2006 | US20060118902 Lateral semiconductor device and method for producing the same |
| 06/08/2006 | US20060118830 MSD raised metal interface features |
| 06/08/2006 | US20060118827 Electron-emitting apparatus |
| 06/08/2006 | US20060118826 Multi-layered metal routing technique |
| 06/08/2006 | US20060118816 Press pack power semiconductor module |
| 06/08/2006 | US20060118793 Thin film transistor array panel and method for manufacturing the same |
| 06/08/2006 | US20060118791 Thermal interface material and method for manufacturing same |
| 06/08/2006 | US20060118786 Thin film transistor, method of manufacturing the same, display apparatus having the same and method of manufacturing the display apparatus |
| 06/08/2006 | US20060118785 Techniques for patterning features in semiconductor devices |
| 06/08/2006 | US20060118784 Structure and method for failure analysis in a semiconductor device |
| 06/08/2006 | US20060118457 Film carrier tape for mounting electronic component |
| 06/08/2006 | US20060118278 Cooling device |
| 06/08/2006 | DE202006003958U1 Heat pipe for cooling of electronic components has working medium container with upper boundary in form of cover and lower boundary in form of evaporator plate in thermal contact with electronic component to be cooled |
| 06/08/2006 | DE202006001466U1 Attachment of coolers for central unit has through holes at both sides of slots on plate whereby fastening plate, having frame and two z-shaped lugs, is screwed at the lower surface of cooler |
| 06/08/2006 | DE112004001150T5 Mehrschichtiges thermisches Polymerlothybrid-Grenzflächenmaterial für einen integrierten Wärmeverteiler und Verfahren zum Herstellen desselben Of the same laminar thermal Polymerlothybrid interface material for an integrated heat spreader and methods for preparing |
| 06/08/2006 | DE102005050330A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 06/08/2006 | DE102005035654A1 Kühlsystem eines Stromhalbleitermoduls Cooling system of a power semiconductor module |
| 06/08/2006 | DE102005025667A1 Sensoranordnung mit einem umgossenen Signalausgabeabschnitt Sensor assembly having a overmolded signal output section |
| 06/08/2006 | DE102004062183B3 Thyristor arrangement, has external resistance and temperature zone each comprising temperature coefficients, where coefficients of external resistance are smaller than coefficients of resistance zone in specific temperature range |
| 06/08/2006 | DE102004058815A1 Chipmodul und Verfahren zu dessen Herstellung Chip module and method of producing the |
| 06/08/2006 | DE102004058806A1 Electronic circuit structure manufacturing method for heat sink, involves directly designing electrically insulating layer and electrically conductive layer on heat sink by thermal spraying method or cold gas-spraying method |
| 06/08/2006 | DE102004058395A1 Stackable semiconductor chip wiring method, involves applying filling material into semiconductor chip adjacent region, and applying conductive layer on chip front side, and connecting chip contacting region with contacting surfaces |
| 06/08/2006 | DE102004058227A1 Radiator for central processing unit, has base plate with engaging holes that fastens with fixing holes provided at securing arms of locating unit, through bolts |
| 06/08/2006 | DE102004057494A1 Metallisierte Folie zur flächigen Kontaktierung Metallized film for dimensional contacting |
| 06/08/2006 | DE102004057421A1 Pressure contact power semiconductor module for higher temperature operation as in motor vehicles has sinter contact technology and contact spring for control connection |
| 06/08/2006 | DE102004057238A1 Semiconductor component has crack forming structure between substrate and passivation layer to promote cracks at defined positions under mechanical stress |
| 06/08/2006 | DE102004056984A1 Stromrichteranordnung Converter assembly |
| 06/08/2006 | DE102004054063B3 Process to produce a crack free connection between two components of different thermal coefficients of expansion such a power semiconductor and heat sink uses hot gas spray |
| 06/08/2006 | DE102004047753A1 Verbesserte Chip-Kontaktierungsanordnung für Chip-Träger für Flip-Chip-Anwendungen Improved chip-contacting arrangement for chip carriers for flip-chip applications |
| 06/08/2006 | DE102004043663B4 Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip und Verfahren zur Herstellung eines Halbleitersensorbauteils mit Hohlraumgehäuse und Sensorchip A semiconductor sensor device comprising housing cavity and the sensor chip and method for producing a semiconductor sensor device with housing cavity and the sensor chip |
| 06/08/2006 | DE102004023462B4 Verfahren zur Ausbildung von Leiterbahnstrukturen auf Halbleiterbauelementen A process for the formation of conductor track structures on semiconductor devices |
| 06/08/2006 | DE10164879B4 Verdrahtungssubstrat Wiring substrate |
| 06/08/2006 | DE10147375B4 Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zur Herstellung desselben The same electronic component having a semiconductor chip and method for producing |
| 06/07/2006 | WO2006070863A1 Semiconductor chip mounting structure and method for manufacturing same |
| 06/07/2006 | EP1667508A1 Ceramic circuit board, method for making the same, and power module |
| 06/07/2006 | EP1667502A2 Printed wiring board and method of manufacturing the same |
| 06/07/2006 | EP1667241A1 Semiconductor device |
| 06/07/2006 | EP1667227A1 Module and mounting structure using the same |
| 06/07/2006 | EP1667226A2 Thermal management of surface-mount circuit devices |
| 06/07/2006 | EP1667225A1 Interposer and multilayer printed wiring board |
| 06/07/2006 | EP1667224A2 Chip packaging structure without leadframe |
| 06/07/2006 | EP1667206A1 Thick-film capacitors and methods of making them |
| 06/07/2006 | EP1666515A1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition |
| 06/07/2006 | EP1666408A1 Metal nanoparticle and method for producing same, liquid dispersion of metal nanoparticle and method for producing same, metal thin line, metal film and method for producing same |
| 06/07/2006 | EP1665916A1 Liquid cooling system |
| 06/07/2006 | EP1665383A2 Integrated circuit package having an inductance loop formed from a multi-loop configuration |
| 06/07/2006 | EP1665379A1 Electronic package having a folded flexible substrate and method of manufacturing the same |
| 06/07/2006 | EP1665378A1 Chip on flex tape with dimension retention pattern |
| 06/07/2006 | EP1665377A1 Thermal conductive material utilizing electrically conductive nanoparticles |
| 06/07/2006 | EP1665376A1 SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS |
| 06/07/2006 | EP1665375A1 Solvent-modified resin compositions and methods of use thereof |
| 06/07/2006 | EP1665374A2 Multiple cavity/compartment package |
| 06/07/2006 | EP1665371A1 Method for producing a multifunctional dielectric layer on a substrate |
| 06/07/2006 | EP1665369A1 Method of forming a through-substrate interconnect |
| 06/07/2006 | EP1665363A2 Wafer-level moat structures |
| 06/07/2006 | EP1665362A2 Technique for evaluating a fabrication of a semiconductor component and wafer |