| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/13/2006 | US7061022 Lateral heat spreading layers for epi-side up ridge waveguide semiconductor lasers |
| 06/13/2006 | US7061016 Electronic circuit |
| 06/13/2006 | US7061015 Contact portion of semiconductor device, and thin film transistor array panel for display device including the contact portion |
| 06/13/2006 | US7060909 Composition for forming low dielectric constant insulating film, method of forming insulating film using the composition and electronic parts having the insulating film produced thereby |
| 06/13/2006 | US7060895 Modifying the electro-mechanical behavior of devices |
| 06/13/2006 | US7060786 Heat resistant resin composition and adhesive film |
| 06/13/2006 | US7060747 For use in microprocessor architecture |
| 06/13/2006 | US7060634 Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications |
| 06/13/2006 | US7060618 Semiconductor device, method for manufacturing the same, and plating solution |
| 06/13/2006 | US7060617 Method of protecting a seed layer for electroplating |
| 06/13/2006 | US7060615 Methods of forming roughened layers of platinum |
| 06/13/2006 | US7060613 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding |
| 06/13/2006 | US7060607 Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface |
| 06/13/2006 | US7060604 Multilayer wiring substrate, and method of producing same |
| 06/13/2006 | US7060602 Method of manufacturing electronic part and mounting electronic part |
| 06/13/2006 | US7060601 Packaging substrates for integrated circuits and soldering methods |
| 06/13/2006 | US7060595 Circuit substrate and fabrication method thereof |
| 06/13/2006 | US7060555 Semiconductor device and method of manufacturing the same |
| 06/13/2006 | US7060554 PECVD silicon-rich oxide layer for reduced UV charging |
| 06/13/2006 | US7060543 Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method |
| 06/13/2006 | US7060538 Versatile system for electrostatic discharge protection utilizing silicon controlled rectifier |
| 06/13/2006 | US7060537 Microchip controller board manufacturing method |
| 06/13/2006 | US7060536 Dual row leadframe and fabrication method |
| 06/13/2006 | US7060534 Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins |
| 06/13/2006 | US7060533 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators |
| 06/13/2006 | US7060531 Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| 06/13/2006 | US7060530 wiring board or a lead frame, a wall member fixed onto the base member to define a cavity, and a cured-resin cap member for encapsulating a semiconductor chip in the cavity |
| 06/13/2006 | US7060529 Multiple chip semiconductor arrangement having electrical components in separating regions |
| 06/13/2006 | US7060528 Method for mounting a semiconductor element to an interposer by compression bonding |
| 06/13/2006 | US7060527 Semiconductor package having grooves formed at side flash, groove forming method, and deflashing method using semiconductor package formed with grooves |
| 06/13/2006 | US7060526 Wafer level methods for fabricating multi-dice chip scale semiconductor components |
| 06/13/2006 | US7060525 Semiconductive chip having a bond pad located on an active device |
| 06/13/2006 | US7060520 Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device |
| 06/13/2006 | US7060512 Patching methods and apparatus for fabricating memory modules |
| 06/13/2006 | US7060511 Evaluation method of a field effect transistor |
| 06/13/2006 | US7060361 Filling spacings between wires; baking organosilicon compound in oxygen |
| 06/13/2006 | US7060216 Tire pressure sensors and methods of making the same |
| 06/13/2006 | US7060193 Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits |
| 06/13/2006 | US7059512 Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device |
| 06/13/2006 | US7059391 Multiple evaporator heat pipe assisted heat sink |
| 06/13/2006 | US7059390 Cooling element |
| 06/13/2006 | US7059389 Integrated cooling unit |
| 06/13/2006 | US7059388 Heat dissipating device |
| 06/13/2006 | US7059049 Electronic package with optimized lamination process |
| 06/13/2006 | US7059047 Sockets for “springed” semiconductor devices |
| 06/13/2006 | US7059042 Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink |
| 06/08/2006 | WO2006060590A2 Reduced circuit area and improved gate length control in semiconductor device |
| 06/08/2006 | WO2006060495A1 Bga to lga interposer |
| 06/08/2006 | WO2006060408A2 Body-biased pmos protection against electrotatic discharge |
| 06/08/2006 | WO2006059907A2 Carrier for electrical components with soldered-on cooling body |
| 06/08/2006 | WO2006059666A1 Phosphorus-containing coated magnesium oxide powder, method for producing same and resin composition containing such powder |
| 06/08/2006 | WO2006059602A1 Method of forming film, film forming apparatus and storage medium |
| 06/08/2006 | WO2006059589A1 Packaged stacked semiconductor device and method for manufacturing same |
| 06/08/2006 | WO2006059556A1 Electronic component and production method therefor |
| 06/08/2006 | WO2006059547A1 Semiconductor device |
| 06/08/2006 | WO2006059542A1 Epoxy resin composition and semiconductor devices |
| 06/08/2006 | WO2006059381A1 Semiconductor device and method for manufacturing the same |
| 06/08/2006 | WO2006058984A1 Rectangular semiconductor support for microelectronics and method for making same |
| 06/08/2006 | WO2006058860A2 Heat exchange device for a semiconductor component and method for producing said heat exchange device |
| 06/08/2006 | WO2006058510A1 Semiconductor component comprising a semiconductor chip provided with a passivation layer, and method for producing the same |
| 06/08/2006 | WO2006058494A1 Vapor chamber with boiling-enhanced multi-wick structure |
| 06/08/2006 | WO2006058477A1 Thin small outline package in which mosfet and schottky diode being co-packaged |
| 06/08/2006 | WO2006004869A3 Heat exchange apparatus with parallel flow |
| 06/08/2006 | WO2005104226A3 Method for production of through-contacts in a plastic mass and semiconductor component with said through contacts |
| 06/08/2006 | WO2005101492A3 Stacked die bga or lga component assembly |
| 06/08/2006 | WO2005101491A3 Micropede stacked die component assembly |
| 06/08/2006 | US20060122740 Methods and apparatus for replacing cooling systems in operating computers |
| 06/08/2006 | US20060122304 Chain extension for thermal materials |
| 06/08/2006 | US20060121875 Wireless communication system |
| 06/08/2006 | US20060121732 Circuit package and method of plating the same |
| 06/08/2006 | US20060121710 Thermal conducting trench in a semiconductor structure |
| 06/08/2006 | US20060121703 Assembly structure of electronic element and heat sink |
| 06/08/2006 | US20060121686 Airdome enclosure for components |
| 06/08/2006 | US20060121650 Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device |
| 06/08/2006 | US20060121649 Methods for fabricating stiffeners for flexible substrates |
| 06/08/2006 | US20060121648 Methods and apparatus for addition of electrical conductors to previously fabricated device |
| 06/08/2006 | US20060121635 Lids for wafer-scale optoelectronic packages |
| 06/08/2006 | US20060121631 Method of producing semiconductor elements using a test structure |
| 06/08/2006 | US20060121363 Method for bonding a glass cap and mask for curing sealant |
| 06/08/2006 | US20060120125 Semiconductor memory device and defect remedying method thereof |
| 06/08/2006 | US20060120049 Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure |
| 06/08/2006 | US20060120048 Thermal management systems for micro-components |
| 06/08/2006 | US20060120047 Coolant cooled type semiconductor device |
| 06/08/2006 | US20060120015 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards |
| 06/08/2006 | US20060119512 Power semiconductor device |
| 06/08/2006 | US20060119374 Contactor having conductive particles in a hole as a contact electrode |
| 06/08/2006 | US20060118974 Structure provided on an overlay region, overlay mark having the structure, and method of forming the overlay mark |
| 06/08/2006 | US20060118973 Sheet for optical-semiconductor-element encapsulation and process for producing optical semiconductor device with the sheet |
| 06/08/2006 | US20060118972 Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip |
| 06/08/2006 | US20060118971 Fabricating stacked chips using fluidic templated-assembly |
| 06/08/2006 | US20060118970 Semiconductor device, its manufacturing method, and radio communication device |
| 06/08/2006 | US20060118969 Flip chip ball grid array package assemblies and electronic devices with heat dissipation capability |
| 06/08/2006 | US20060118968 Alloyed underlayer for microelectronic interconnects |
| 06/08/2006 | US20060118967 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
| 06/08/2006 | US20060118966 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
| 06/08/2006 | US20060118965 Semiconductor device, semiconductor module employing thereof and method for manufacturing semiconductor device |
| 06/08/2006 | US20060118964 Packaging structure with a plurality of drill holes formed directly below an underfill layer |
| 06/08/2006 | US20060118963 Semiconductor device and fabrication method for the same |
| 06/08/2006 | US20060118962 Damascene interconnect structure with cap layer |
| 06/08/2006 | US20060118961 Dual damascene integration of ultra low dielectric constant porous materials |