| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/14/2006 | CN1788346A Methods and apparatus for attaching getters to mems device housings |
| 06/14/2006 | CN1788345A Card with embedded IC and electrochemical cell |
| 06/14/2006 | CN1788322A Aluminum alloy wiring material having high resistance to heat and target material |
| 06/14/2006 | CN1787733A Radiating equipment structure |
| 06/14/2006 | CN1787320A Protecting apparatus for electrostatic discharge |
| 06/14/2006 | CN1787223A Local interconnect structure and method for a cmos image sensor |
| 06/14/2006 | CN1787221A Solid-state imaging device and method for making the same |
| 06/14/2006 | CN1787217A Array substrate, display apparatus having the same and method for repairing the same |
| 06/14/2006 | CN1787213A Image pickup module |
| 06/14/2006 | CN1787212A Multi-level semiconductor module and method for fabricating the same |
| 06/14/2006 | CN1787211A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/14/2006 | CN1787210A Power semiconductor module with auxiliary connector |
| 06/14/2006 | CN1787209A Combined structure of electronic assembly with radiating apparatus |
| 06/14/2006 | CN1787208A Radiating apparatus and preparation method thereof |
| 06/14/2006 | CN1787193A Method for mfg. electrostatic preventing structure of deep slot type power MOS tube |
| 06/14/2006 | CN1786801A Thin film transistor array panel and method for manufacturing the same |
| 06/14/2006 | CN1785686A Flashing mode luminous electron congratulation card |
| 06/14/2006 | CN1259809C Thin circuit board and method for mfg. same |
| 06/14/2006 | CN1259730C Semiconductor device and producing method thereof |
| 06/14/2006 | CN1259719C IC device and its manufacture method |
| 06/14/2006 | CN1259718C Electrooptical device and semiconductor device |
| 06/14/2006 | CN1259717C Power semiconductor module |
| 06/14/2006 | CN1259698C Semiconductor device and method for producing semiconductor device |
| 06/14/2006 | CN1259678C Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| 06/14/2006 | CN1259231C Vacuum packing method for elements used in microelectromechanical system |
| 06/14/2006 | CN1259024C Semiconductor device for fingerprint identification |
| 06/13/2006 | USRE39124 Integrated circuit having capacitive elements |
| 06/13/2006 | US7062742 Routing structure for transceiver core |
| 06/13/2006 | US7062732 Semiconductor device, method of generating pattern for semiconductor device, method of manufacturing semiconductor device and device for generating pattern used for semiconductor device |
| 06/13/2006 | US7062392 Configurable voltage regulator |
| 06/13/2006 | US7062346 Method for manufacturing multi-kind and small quantity semiconductor products in a mass-production line and system thereof |
| 06/13/2006 | US7062117 Layered board, and apparatus incorporated such layered board |
| 06/13/2006 | US7061785 Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package |
| 06/13/2006 | US7061772 Electronic circuit with transmission line type noise filter |
| 06/13/2006 | US7061764 Heat sink clip with rotating CAM |
| 06/13/2006 | US7061746 Semiconductor component with integrated capacitance structure having a plurality of metallization planes |
| 06/13/2006 | US7061737 System and method for ESD protection on high voltage I/O circuits triggered by a diode string |
| 06/13/2006 | US7061565 Array substrate having double-layered metal patterns and method of fabricating the same |
| 06/13/2006 | US7061361 Circuit board assembly and flat coil |
| 06/13/2006 | US7061359 On-chip inductor with magnetic core |
| 06/13/2006 | US7061329 Semiconductor device having balanced circuit for use in high frequency band |
| 06/13/2006 | US7061305 Threshold voltage detector for process effect compensation |
| 06/13/2006 | US7061303 Photoelectric leak current compensating circuit and optical signal circuit using same |
| 06/13/2006 | US7061257 Probe card assembly |
| 06/13/2006 | US7061127 Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus |
| 06/13/2006 | US7061126 Circuit board assembly |
| 06/13/2006 | US7061125 Semiconductor package with pattern leads and method for manufacturing the same |
| 06/13/2006 | US7061124 Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks |
| 06/13/2006 | US7061123 Wafer level ball grid array |
| 06/13/2006 | US7061121 Stacked microelectronic assemblies with central contacts |
| 06/13/2006 | US7061120 Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| 06/13/2006 | US7061119 Tape attachment chip-on-board assemblies |
| 06/13/2006 | US7061118 Semiconductor device, stacked semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 06/13/2006 | US7061117 Bump layout on silicon chip |
| 06/13/2006 | US7061116 Arrangement of vias in a substrate to support a ball grid array |
| 06/13/2006 | US7061114 Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits |
| 06/13/2006 | US7061113 Semiconductor apparatus, led head, and image forming apparatus |
| 06/13/2006 | US7061112 Semiconductor device including an electrical contact connected to an interconnection |
| 06/13/2006 | US7061111 Interconnect structure for use in an integrated circuit |
| 06/13/2006 | US7061110 Ohmic contact to semiconductor devices and method of manufacturing the same |
| 06/13/2006 | US7061109 Semiconductor substrate-based BGA interconnection for testing semiconductor devices |
| 06/13/2006 | US7061108 Semiconductor device and a method for securing the device in a carrier tape |
| 06/13/2006 | US7061107 Semiconductor device and manufacturing method of the same |
| 06/13/2006 | US7061106 Structure of image sensor module and a method for manufacturing of wafer level package |
| 06/13/2006 | US7061105 Semiconductor device and a method of manufacturing the same |
| 06/13/2006 | US7061104 Apparatus for conditioning power and managing thermal energy in an electronic device |
| 06/13/2006 | US7061103 Chip package structure |
| 06/13/2006 | US7061102 High performance flipchip package that incorporates heat removal with minimal thermal mismatch |
| 06/13/2006 | US7061100 Semiconductor built-in millimeter-wave band module |
| 06/13/2006 | US7061099 Microelectronic package having chamber sealed by material including one or more intermetallic compounds |
| 06/13/2006 | US7061098 Electronic component and method for its production |
| 06/13/2006 | US7061097 Semiconductor device and manufacturing method for the same |
| 06/13/2006 | US7061096 Multi-surface IC packaging structures and methods for their manufacture |
| 06/13/2006 | US7061095 Printed circuit board conductor channeling |
| 06/13/2006 | US7061094 Multilayer printed circuit board including first and second signal traces and a first ground trace |
| 06/13/2006 | US7061093 Semiconductor device and voltage regulator |
| 06/13/2006 | US7061092 High-density modularity for ICS |
| 06/13/2006 | US7061091 Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device |
| 06/13/2006 | US7061090 Semiconductor device |
| 06/13/2006 | US7061089 Memory module having space-saving arrangement of memory chips and memory chip therefore |
| 06/13/2006 | US7061088 Semiconductor stacked multi-package module having inverted second package |
| 06/13/2006 | US7061087 Multi-package stack module |
| 06/13/2006 | US7061086 Silicon package for piezoelectric device |
| 06/13/2006 | US7061085 Semiconductor component and system having stiffener and circuit decal |
| 06/13/2006 | US7061084 Lead-bond type chip package and manufacturing method thereof |
| 06/13/2006 | US7061083 Semiconductor devices |
| 06/13/2006 | US7061082 Semiconductor die with attached heat sink and transfer mold |
| 06/13/2006 | US7061081 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof |
| 06/13/2006 | US7061080 Power module package having improved heat dissipating capability |
| 06/13/2006 | US7061079 Chip package structure and manufacturing method thereof |
| 06/13/2006 | US7061078 Semiconductor package |
| 06/13/2006 | US7061077 Substrate based unmolded package including lead frame structure and semiconductor die |
| 06/13/2006 | US7061076 Solderless component packaging and mounting |
| 06/13/2006 | US7061073 Diamondoid-containing capacitors |
| 06/13/2006 | US7061071 Non-volatile resistance variable devices and method of forming same, analog memory devices and method of forming same, programmable memory cell and method of forming same, and method of structurally changing a non-volatile device |
| 06/13/2006 | US7061070 Semiconductor device with fuse arrangement |
| 06/13/2006 | US7061064 Semiconductor device and package for containing semiconductor element |
| 06/13/2006 | US7061052 Input protection circuit connected to protection circuit power source potential line |
| 06/13/2006 | US7061051 SCR-ESD structures with shallow trench isolation |
| 06/13/2006 | US7061032 Semiconductor device with upper portion of plugs contacting source and drain regions being a first self-aligned silicide |