| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/20/2006 | US7064053 Process for fabricating an electrical circuit comprising a polishing step |
| 06/20/2006 | US7064051 Method of forming self-aligned contact pads of non-straight type semiconductor memory device |
| 06/20/2006 | US7064047 Semiconductor device having a ball grid array and a fabrication process thereof |
| 06/20/2006 | US7064044 Contact etching utilizing multi-layer hard mask |
| 06/20/2006 | US7064015 Semiconductor device and manufacturing method of the same |
| 06/20/2006 | US7064014 Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices |
| 06/20/2006 | US7064013 Cap attach surface modification for improved adhesion |
| 06/20/2006 | US7064011 Semiconductor device fabricating apparatus and semiconductor device fabricating method |
| 06/20/2006 | US7064010 Methods of coating and singulating wafers |
| 06/20/2006 | US7064008 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
| 06/20/2006 | US7064007 Method of using foamed insulators in three dimensional multichip structures |
| 06/20/2006 | US7064005 Semiconductor apparatus and method of manufacturing same |
| 06/20/2006 | US7064002 Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers |
| 06/20/2006 | US7064001 Method of production of semiconductor module with external connection terminal |
| 06/20/2006 | US7063896 Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof |
| 06/20/2006 | US7063762 immersion of polytetrafluoroethylene dielectric layers in solutions comprising electroconductive polymers and intermetallic seeding materials, then rinsing, drying and coppering to form printed circuits or laminated chip carriers; electronics |
| 06/20/2006 | US7063756 Enhanced design and process for a conductive adhesive |
| 06/20/2006 | US7063541 Composite microelectronic spring structure and method for making same |
| 06/20/2006 | US7063510 Centrifugal fan |
| 06/20/2006 | US7063267 Portable electronic device |
| 06/20/2006 | US7063136 Heat dissipation device having cap for protecting thermal interface material thereon |
| 06/20/2006 | US7063130 Circular heat sink assembly |
| 06/20/2006 | US7063129 Heat transport device and electronic apparatus |
| 06/20/2006 | US7063127 Method and apparatus for chip-cooling |
| 06/20/2006 | US7062933 Separate thermal and electrical throttling limits in processors |
| 06/20/2006 | US7062850 Forming a row of aligned windows in a planar surface; depositing an electromigration-inhibiting/electrically conductive material over the planar surface and through the windows to fill; removing portions |
| 06/20/2006 | CA2307231C Silicon based conductive material and process for production thereof |
| 06/20/2006 | CA2297058C Electrode means, with or without functional elements and an electrode device formed of said means |
| 06/15/2006 | WO2006063272A2 Alloyed underlayer for microelectronic interconnects |
| 06/15/2006 | WO2006062624A1 Spray cooling with spray deflection |
| 06/15/2006 | WO2006062195A1 Semiconductor package substrate |
| 06/15/2006 | WO2006061937A1 Heat sink material, method for manufacturing such heat sink material, and semiconductor laser device |
| 06/15/2006 | WO2006061871A1 Semiconductor device |
| 06/15/2006 | WO2006061404A1 Cooling system and method |
| 06/15/2006 | WO2006061318A1 Integrated circuit dielectric having oriented cylindrical voids |
| 06/15/2006 | WO2006061274A1 Chip module and method for the production thereof |
| 06/15/2006 | WO2006060981A1 Semiconductor component and method for producing a semiconductor component |
| 06/15/2006 | WO2006060977A1 Semiconductor component comprising a plastic housing, a semiconductor chip and an intermediate plate, and method for the production thereof |
| 06/15/2006 | WO2006060909A1 Optically enabled hybrid semiconductor package |
| 06/15/2006 | WO2006052262A9 Inverted j-lead package for power devices |
| 06/15/2006 | WO2006043974A3 Nanoengineered thermal meterials based on carbon nanotube array composites |
| 06/15/2006 | WO2006031886A3 Power semiconductor package |
| 06/15/2006 | WO2006028942A3 Thermally controlled self-assembly method and support |
| 06/15/2006 | WO2006014690A3 Power semiconductor package |
| 06/15/2006 | WO2006005317A3 Method for the production of an electric component and component |
| 06/15/2006 | WO2004079797A3 High speed electronics interconnect and method of manufacture |
| 06/15/2006 | US20060130193 Spin detection device and methods for use thereof |
| 06/15/2006 | US20060128834 Microelectronic devices having underfill materials with improved fluxing agents |
| 06/15/2006 | US20060128156 Self-patterning of photo-active dielectric materials for interconnect isolation |
| 06/15/2006 | US20060128141 Semiconductor device and method for fabricating the same |
| 06/15/2006 | US20060128134 Method for re-routing lithography-free microelectronic devices |
| 06/15/2006 | US20060128069 Package structure with embedded chip and method for fabricating the same |
| 06/15/2006 | US20060128067 Semiconductor device package |
| 06/15/2006 | US20060128063 Method of manufacturing semiconductor device and support structure for semiconductor substrate |
| 06/15/2006 | US20060128062 Electrical or electronic component and method of producing same |
| 06/15/2006 | US20060128059 Compact system module with built-in thermoelectric cooling |
| 06/15/2006 | US20060128044 Solid state imaging device and producing method thereof |
| 06/15/2006 | US20060128041 Misalignment test structure and method thereof |
| 06/15/2006 | US20060128040 Bond positioning method for wire-bonding process and substrate for the bond positioning method |
| 06/15/2006 | US20060127690 Metal photo-etching product and production method therefor |
| 06/15/2006 | US20060127672 Method of providing a heat spreader |
| 06/15/2006 | US20060127587 Reacting a silane compound or a silane oligomer with a thermally decomposable silane compound that is capped with silane compounds, such as silylpropyl endcapped polyether; offering high speed to semiconductor devices, lowering power consumption and greatly reducing cross-talk of metal wires |
| 06/15/2006 | US20060127568 Multi-layer ceramic substrate and method for manufacture thereof |
| 06/15/2006 | US20060127567 Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device |
| 06/15/2006 | US20060126313 Electronic component with a housing package |
| 06/15/2006 | US20060126312 Housing for power semiconductor modules |
| 06/15/2006 | US20060126295 Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules |
| 06/15/2006 | US20060126267 Thin film capacitor for reducing power supply noise |
| 06/15/2006 | US20060126237 Booster power management integrated circuit chip with ESD protection between output pads thereof |
| 06/15/2006 | US20060125573 Novel radio frequency (RF) circuit board topology |
| 06/15/2006 | US20060125120 Method of fabricating polycrystalline silicon |
| 06/15/2006 | US20060125119 B-stageable underfill encapsulant and method for its application |
| 06/15/2006 | US20060125118 Semiconductor device having a bonding pad structure including an annular contact |
| 06/15/2006 | US20060125117 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 06/15/2006 | US20060125116 Multi-chip module |
| 06/15/2006 | US20060125115 Wafer level ball grid array |
| 06/15/2006 | US20060125114 Electrical connection through nonmetal |
| 06/15/2006 | US20060125113 Flip chip package with anti-floating structure |
| 06/15/2006 | US20060125112 Apparatus and method for manufacturing semiconductor device |
| 06/15/2006 | US20060125111 Flip chip device |
| 06/15/2006 | US20060125110 Method for solder bumping, and solder-bumping structures produced thereby |
| 06/15/2006 | US20060125109 Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures |
| 06/15/2006 | US20060125108 Method of producing a microelectronic electrode structure, and microelectronic electrode structure |
| 06/15/2006 | US20060125107 Test system for semiconductor components having conductive spring contacts |
| 06/15/2006 | US20060125106 Method for fabricating semiconductor components with conductive spring contacts |
| 06/15/2006 | US20060125105 Zinc-aluminum solder alloy |
| 06/15/2006 | US20060125104 Method for manufacturing a semiconductor protection element and a semiconductor device |
| 06/15/2006 | US20060125103 Information handling system |
| 06/15/2006 | US20060125102 Back end of line integration scheme |
| 06/15/2006 | US20060125101 Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device |
| 06/15/2006 | US20060125100 Method of manufacturing semiconductor device, and semiconductor device |
| 06/15/2006 | US20060125098 Transistor device having a delafossite material |
| 06/15/2006 | US20060125097 Semiconductor apparatus |
| 06/15/2006 | US20060125096 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
| 06/15/2006 | US20060125095 Semiconductor device and manufacturing method thereof |
| 06/15/2006 | US20060125094 Solder interconnect on IC chip |
| 06/15/2006 | US20060125093 Multi-chip module having bonding wires and method of fabricating the same |
| 06/15/2006 | US20060125092 High density integrated circuit package architecture |
| 06/15/2006 | US20060125091 Connection structure of flexible wiring substrate and connection method using same |
| 06/15/2006 | US20060125090 Heat dissipation structure and method thereof |