| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/15/2006 | US20060125089 Thermally enhanced package for an integrated circuit |
| 06/15/2006 | US20060125088 Heat dissipating semiconductor package and fabrication method thereof |
| 06/15/2006 | US20060125087 Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof |
| 06/15/2006 | US20060125086 Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module |
| 06/15/2006 | US20060125085 Semiconductor device which prevents light from entering therein |
| 06/15/2006 | US20060125084 Integration of micro-electro mechanical systems and active circuitry |
| 06/15/2006 | US20060125083 Multi-layer interconnection circuit module and manufacturing method thereof |
| 06/15/2006 | US20060125082 Semiconductor device and manufacturing method thereof |
| 06/15/2006 | US20060125081 Printed circuit board |
| 06/15/2006 | US20060125080 Semiconductor package structure and method for fabricating the same |
| 06/15/2006 | US20060125079 High density package interconnect wire bond strip line and method therefor |
| 06/15/2006 | US20060125078 Semiconductor device |
| 06/15/2006 | US20060125077 Semiconductor device |
| 06/15/2006 | US20060125076 Circuit boards, electronic devices, and methods of manufacturing thereof |
| 06/15/2006 | US20060125075 Flash preventing substrate and method for fabricating the same |
| 06/15/2006 | US20060125074 Method of connecting internal silver traces to external gold to produce a gold external side metal for an LTCC package |
| 06/15/2006 | US20060125073 Lead frame for semiconductor device |
| 06/15/2006 | US20060125072 Semiconductor device having laminated semiconductor constructions and a manufacturing method thereof |
| 06/15/2006 | US20060125071 Memory module and method of mounting memory device on PCB for memory module |
| 06/15/2006 | US20060125070 Semiconductor package, manufacturing method thereof and IC chip |
| 06/15/2006 | US20060125069 Integrated circuit with stacked-die configuration utilizing substrate conduction |
| 06/15/2006 | US20060125068 Photo-detector and related methods |
| 06/15/2006 | US20060125067 Flex circuit constructions for high capacity circuit module systems and methods |
| 06/15/2006 | US20060125066 Self-adhesive frame applied in package of field emission display, the manufacturing method for the same and the package method by the same |
| 06/15/2006 | US20060125065 Multi-part lead frame with dissimilar materials |
| 06/15/2006 | US20060125064 Semiconductor device and a method of manufacturing the same |
| 06/15/2006 | US20060125063 Electrical-interference-isolated transistor structure |
| 06/15/2006 | US20060125062 Semiconductor package having improved adhesion and solderability |
| 06/15/2006 | US20060125061 Board or substrate for an organic electronic device and use thereof |
| 06/15/2006 | US20060125060 Semiconductor chip, and manufacturing method and application of the chip |
| 06/15/2006 | US20060125059 Semiconductor wafer with protection structure against damage during a die separation process |
| 06/15/2006 | US20060125058 Semiconductor circuitry constructions |
| 06/15/2006 | US20060125042 Electronic component and panel for producing the same |
| 06/15/2006 | US20060125016 Electrostatic discharge protection circuit using triple welled silicon controlled rectifier |
| 06/15/2006 | US20060125015 ESD protection for high voltage applications |
| 06/15/2006 | US20060125014 Diode with low junction capacitance |
| 06/15/2006 | US20060124980 Stacked capacitor-type semiconductor storage device and manufacturing method thereof |
| 06/15/2006 | US20060124972 Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding |
| 06/15/2006 | US20060124957 Single-phase converter module |
| 06/15/2006 | US20060124928 Integrated circuit disabling |
| 06/15/2006 | US20060124927 Forming of high aspect ratio conductive structure using injection molded solder |
| 06/15/2006 | US20060124700 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
| 06/15/2006 | US20060124699 Micro-C-4 semiconductor die and method for depositing connection sites thereon |
| 06/15/2006 | US20060124583 Plating a resistive material onto a portion of the insulative substrate which is between the metallic areas, such that the resistive material connects the metallic areas, and thereafter trimming at least a portion of the resistive material from the insulative substrate |
| 06/15/2006 | US20060124351 Flexible multilayer wiring board and manufacture method thereof |
| 06/15/2006 | US20060124345 Method for manufacturing board with built-in device and board with built-in device and method for manufacturing printed wiring board and printed wiring board |
| 06/15/2006 | US20060124281 Heat transfer device and method of making same |
| 06/15/2006 | US20060124280 Flat plate heat transferring apparatus and manufacturing method thereof |
| 06/15/2006 | CA2635431A1 Optically enabled hybrid semiconductor package |
| 06/15/2006 | CA2560410A1 Heat sink material, manufacturing method for the same, and semiconductor laser device |
| 06/14/2006 | EP1670077A1 Semiconductor circuit arrangement with energy recovery |
| 06/14/2006 | EP1670059A1 Semiconductor device protection circuit and semiconductor device having the same |
| 06/14/2006 | EP1670057A1 Manufacturing method of chip integrated substrate |
| 06/14/2006 | EP1670056A2 Power semiconductor module with auxiliary connector |
| 06/14/2006 | EP1670050A1 Basic cell, end section cell, wiring shape, wiring method, shield wiring structure |
| 06/14/2006 | EP1669675A1 Glow plug for diesel engine with integrated electronics and heat sink |
| 06/14/2006 | EP1668971A2 Radiation shielded semiconductor device package |
| 06/14/2006 | EP1668704A2 Integrated circuit suitable for use in radio receivers |
| 06/14/2006 | EP1668699A2 Method of forming a semiconductor package and structure thereof |
| 06/14/2006 | EP1668698A1 Plastically deformable cooling body for electric and/or electronic components |
| 06/14/2006 | EP1668697A2 Electrical circuit apparatus and methods for assembling same |
| 06/14/2006 | EP1668692A2 Adjustable self-aligned air gap dielectric for low capacitance wiring |
| 06/14/2006 | EP1668689A2 Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias |
| 06/14/2006 | EP1668687A1 Fabrication of conductive metal layer on semiconductor devices |
| 06/14/2006 | EP1668686A2 Reversible leadless package and methods of making and using same |
| 06/14/2006 | EP1668685A1 Integrated electronic chip and interconnect device and process for making the same |
| 06/14/2006 | EP1668078A1 Potting compound, use thereof and components encapsulated in said potting compound |
| 06/14/2006 | EP1597315A4 Molding compositions containing quaternary organophosphonium salts |
| 06/14/2006 | EP1568129B1 Acoustic resonator support, acoustic resonator and corresponding integrated circuit |
| 06/14/2006 | EP1509567B1 Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition |
| 06/14/2006 | EP1113496B1 Heatsink, and semiconductor laser device and semiconductor laser stack using heatsink |
| 06/14/2006 | EP1025586B1 Flexible heat transfer device and method |
| 06/14/2006 | DE202006000396U1 Heat exchanger for use in e.g. electronic device, has expansion tank to equalize variations in volume of cooling medium, and flexible membrane, which is formed to follow volume variations of medium, to close tank |
| 06/14/2006 | DE19943385B4 Verfahren zur Herstellung einer elektrischen Verbindung zwischen der Vorder- und Rückseite von Halbleiterchips A method for making an electrical connection between the front and back of the semiconductor chip |
| 06/14/2006 | DE19640466B4 Metallisches Trägerteil für elektronische Bauelemente oder Schaltungsträger und Verfahren zur Herstellung desselben Of the same metallic support part for electronic components or circuit carrier and methods for preparing |
| 06/14/2006 | DE10350510B4 Integrierte Schaltungsvorrichtungen mit Sicherungsstrukturen, die Pufferschichten enthalten, und Verfahren zur Herstellung derselben Integrated circuit devices with fuse structures comprising buffer layers and methods for making the same |
| 06/14/2006 | DE10309998B4 Halbleiterbauelement mit einer verstärkten Substruktur einer Kontaktstelle und zugehöriges Herstellungsverfahren A semiconductor device with a reinforced substructure of a contact point and associated production method |
| 06/14/2006 | DE10303463B4 Halbleiterbauelement mit wenigstens zwei in einem Gehäuse integrierten und durch einen gemeinsamen Kontaktbügel kontaktierten Chips Semiconductor component having at least two integrated in a housing and contacted by a common contact bridge chips |
| 06/14/2006 | DE10251317B4 Halbleiterchip Semiconductor chip |
| 06/14/2006 | DE10230088B4 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 06/14/2006 | DE102005057981A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 06/14/2006 | DE102004059505A1 Anordnung zum Test von eingebetteten Schaltungen mit Hilfe von Testinseln Arrangement for testing embedded circuits using test Islands |
| 06/14/2006 | DE102004059395A1 Sende- und/oder Empfangseinrichtung Transmitting and / or receiving device |
| 06/14/2006 | DE102004059389A1 Semiconductor device has semiconductor body with contact area and connection element with other contact area whereby both contact areas are vertically distant from each other |
| 06/14/2006 | DE102004059233A1 Production of an optical structure comprises encasing a semiconductor component with an optically transparent material which is opaque to a high energy beam and irradiating each region of the sleeve produced with high energy radiation |
| 06/14/2006 | DE102004059232A1 Halbleiterbauteil mit einem Kunststoffgehäuse, einem Halbleiterchip und einer Zwischenplatte und Verfahren zur Herstellung desselben Of the same semiconductor device with a plastic housing, a semiconductor chip and an intermediate plate and process for preparing |
| 06/14/2006 | DE102004058946A1 Leistungshalbleitermodul mit Hilfsanschluss Power semiconductor module with auxiliary port |
| 06/14/2006 | DE102004058878A1 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |
| 06/14/2006 | DE102004056222A1 Protection circuit for semiconductor integrated circuit e.g. for automobile technology, uses control circuit for driving protection circuit |
| 06/14/2006 | DE102004046790B3 Fluid-Kühleinrichtung zur Kühlung wenigstens einer Verlustwärme erzeugender Komponente Fluid cooling device for cooling at least one heat-generating component loss |
| 06/14/2006 | DE102004039883B3 Transparent element comprises primary and secondary transparent plates, and an intermediate electrical consumer |
| 06/14/2006 | DE102004037826B4 Halbleitervorrichtung mit miteinander verbundenen Halbleiterbauelementen A semiconductor device having interconnected semiconductor devices |
| 06/14/2006 | DE10031947B4 Schaltungsanordnung zum Ausgleich unterschiedlicher Spannungen auf Leitungszügen in integrierten Halbleiterschaltungen Circuitry to compensate for different voltages on line trains in semiconductor integrated circuits |
| 06/14/2006 | CN2788354Y Heat radiating device combination |
| 06/14/2006 | CN2788353Y Base material structure of semiconductor |
| 06/14/2006 | CN1788531A Connection structure of inner conductor and multilayer substrate |
| 06/14/2006 | CN1788530A Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same |
| 06/14/2006 | CN1788349A ESD protection device for semiconductor products |
| 06/14/2006 | CN1788348A Via and trench structures for semiconductor substrates bonded to metallic substrates |
| 06/14/2006 | CN1788347A Porous low-K dielectric interconnect structures |