| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/21/2006 | CN1790691A Semiconductor device |
| 06/21/2006 | CN1790690A Heat radiator |
| 06/21/2006 | CN1790689A Method and apparatus for thermal characterization under non-uniform heat load |
| 06/21/2006 | CN1790688A Cooling device using multiple fans and heat sinks |
| 06/21/2006 | CN1790687A Resin-sealed semiconductor device, lead frame with die pads, and manufacturing method for lead frame with die pads |
| 06/21/2006 | CN1790686A Semiconductor device packaged into chip size and manufacturing method thereof |
| 06/21/2006 | CN1790685A Wiring board with semiconductor component |
| 06/21/2006 | CN1790684A Ball grid array substrate having window and method of fabricating same |
| 06/21/2006 | CN1790683A Sensor device and ceramic encapsulation shell for mounting electronic pieces |
| 06/21/2006 | CN1790682A Semiconductor composite apparatus, method for manufacturing it, LED employing it and display employing the LED |
| 06/21/2006 | CN1790666A Semiconductor device and method for manufacture interconnector |
| 06/21/2006 | CN1790664A Substrate provided with a thin film pattern, method of manufacturing a device, electro-optic device, and electronic instrument |
| 06/21/2006 | CN1790661A Back end of line integration scheme |
| 06/21/2006 | CN1790651A Manufacturing method of chip integrated substrate |
| 06/21/2006 | CN1790646A Manufacturing method of electronic part and wiring substrate |
| 06/21/2006 | CN1790645A Bonded silicon components and a method of fabricating the same |
| 06/21/2006 | CN1790644A Circuitized substrates, method of making same, and electrical assemblies and information handling systems utilizing same |
| 06/21/2006 | CN1790633A Anti-reflection layer of sandwich structure and method for improving conductor layer coronary fault |
| 06/21/2006 | CN1790570A Thick-film capacitors and methods of making them |
| 06/21/2006 | CN1261009C Symmetrical package for semiconductor die |
| 06/21/2006 | CN1261005C Wiring base plate, semconductor device and its manufacturing mtehod, circuit board and electronic instrument |
| 06/21/2006 | CN1260852C Transmission circuit |
| 06/21/2006 | CN1260827C Group III nitride transistor and method for producing the same |
| 06/21/2006 | CN1260826C 化合物半导体装置 The compound semiconductor device |
| 06/21/2006 | CN1260814C Wire frame, semiconductor device using such frame and its mfg. method |
| 06/21/2006 | CN1260809C Integrated circuit protective layer and its producing method |
| 06/21/2006 | CN1260805C Method for forming copper lead wire in semiconductor device |
| 06/21/2006 | CN1260796C Side welding method for flip-chip semiconductor device |
| 06/21/2006 | CN1260795C Semiconductor device and manufacture thereof, circuit board and electronic machine |
| 06/21/2006 | CN1260794C Method of fabricating semiconductor device |
| 06/21/2006 | CN1260790C Wiring substrate and its manufacturing method |
| 06/21/2006 | CN1260789C Circuit board, semiconductor device mfg. method, and electroplating system |
| 06/21/2006 | CN1260778C Substrate processing method |
| 06/21/2006 | CN1260737C Memory module |
| 06/20/2006 | US7065737 Multi-layer overlay measurement and correction technique for IC manufacturing |
| 06/20/2006 | US7064978 Monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout |
| 06/20/2006 | US7064963 Multi-substrate circuit assembly |
| 06/20/2006 | US7064960 Arrangement for signal transmission between a transmitter and a control unit |
| 06/20/2006 | US7064751 Display device |
| 06/20/2006 | US7064735 Electro-optical device |
| 06/20/2006 | US7064646 Integrated inductor |
| 06/20/2006 | US7064645 Electronic device |
| 06/20/2006 | US7064632 Microwave circuit |
| 06/20/2006 | US7064630 High-frequency module and its manufacturing method |
| 06/20/2006 | US7064566 Probe card assembly and kit |
| 06/20/2006 | US7064563 Method and structure for measuring a bonding resistance |
| 06/20/2006 | US7064452 Package structure with a retarding structure and method of making same |
| 06/20/2006 | US7064451 Area array semiconductor device and electronic circuit board utilizing the same |
| 06/20/2006 | US7064450 Semiconductor die with high density offset-inline bond arrangement |
| 06/20/2006 | US7064449 Bonding pad and chip structure |
| 06/20/2006 | US7064448 Power controller with bond wire fuse |
| 06/20/2006 | US7064447 Bond pad structure comprising multiple bond pads with metal overlap |
| 06/20/2006 | US7064446 Under bump metallization layer to enable use of high tin content solder bumps |
| 06/20/2006 | US7064445 Wafer level testing and bumping process |
| 06/20/2006 | US7064444 Multi-chip ball grid array package |
| 06/20/2006 | US7064443 Semiconductor device having a plurality of stacked semiconductor chips with positions of chip-selecting terminals being different from each other |
| 06/20/2006 | US7064441 Semiconductor device and method of manufacturing the same |
| 06/20/2006 | US7064440 Semiconductor device |
| 06/20/2006 | US7064439 Integrated electrical circuit and method for fabricating it |
| 06/20/2006 | US7064438 Low-loss coplanar waveguides |
| 06/20/2006 | US7064437 Semiconductor device having aluminum conductors |
| 06/20/2006 | US7064436 Semiconductor device and method of fabricating the same |
| 06/20/2006 | US7064435 Semiconductor package with improved ball land structure |
| 06/20/2006 | US7064434 Customized microelectronic device and method for making customized electrical interconnections |
| 06/20/2006 | US7064433 Multiple-ball wire bonds |
| 06/20/2006 | US7064432 Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
| 06/20/2006 | US7064431 Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts |
| 06/20/2006 | US7064430 Stacked die packaging and fabrication method |
| 06/20/2006 | US7064429 Electronic package having integrated cooling element with clearance for engaging package |
| 06/20/2006 | US7064428 Wafer-level package structure |
| 06/20/2006 | US7064427 Buried array capacitor and microelectronic structure incorporating the same |
| 06/20/2006 | US7064426 Semiconductor multi-package module having wire bond interconnect between stacked packages |
| 06/20/2006 | US7064425 Semiconductor device circuit board, and electronic equipment |
| 06/20/2006 | US7064424 Optical surface mount technology package |
| 06/20/2006 | US7064423 IC module and IC card |
| 06/20/2006 | US7064422 Electronic assembly with integrated IO and power contacts |
| 06/20/2006 | US7064421 Wire bonding package |
| 06/20/2006 | US7064420 Integrated circuit leadframe with ground plane |
| 06/20/2006 | US7064419 Die attach region for use in a micro-array integrated circuit package |
| 06/20/2006 | US7064412 Electronic package with integrated capacitor |
| 06/20/2006 | US7064411 Spiral inductor and transformer |
| 06/20/2006 | US7064410 MOS antifuse with low post-program resistance |
| 06/20/2006 | US7064409 Structure and programming of laser fuse |
| 06/20/2006 | US7064393 Electrostatic discharge protection structures having high holding current for latch-up immunity |
| 06/20/2006 | US7064392 Semiconductor device |
| 06/20/2006 | US7064374 Barrier layers for protecting metal oxides from hydrogen degradation |
| 06/20/2006 | US7064368 Resin-encapsulated semiconductor apparatus and process for its fabrication |
| 06/20/2006 | US7064363 Symmetric inducting device for an integrated circuit having a ground shield |
| 06/20/2006 | US7064358 Triggered back-to-back diodes for ESD protection in triple-well CMOS process |
| 06/20/2006 | US7064356 Flip chip light emitting diode with micromesas and a conductive mesh |
| 06/20/2006 | US7064350 Organic electroluminescent display device and method of fabricating the same |
| 06/20/2006 | US7064344 Barrier material encapsulation of programmable material |
| 06/20/2006 | US7064157 Flame retardant resin and flame retardant composition containing the same |
| 06/20/2006 | US7064088 Method for forming low-k hard film |
| 06/20/2006 | US7064065 Silver under-layers for electroless cobalt alloys |
| 06/20/2006 | US7064064 Copper recess process with application to selective capping and electroless plating |
| 06/20/2006 | US7064060 Method for manufacturing semiconductor device |
| 06/20/2006 | US7064056 Barrier layer stack to prevent Ti diffusion |
| 06/20/2006 | US7064055 Method of forming a multi-layer semiconductor structure having a seamless bonding interface |
| 06/20/2006 | US7064054 Contact structure and manufacturing method thereof |