| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/22/2006 | US20060131718 Multi-chip package structure |
| 06/22/2006 | US20060131717 Multi-chip package structure |
| 06/22/2006 | US20060131716 Stacking system and method |
| 06/22/2006 | US20060131715 Multi-level semiconductor module |
| 06/22/2006 | US20060131713 Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus |
| 06/22/2006 | US20060131712 Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component |
| 06/22/2006 | US20060131711 Package for semiconductor device |
| 06/22/2006 | US20060131710 Advanced cavity structure for wafer level chip scale package |
| 06/22/2006 | US20060131709 Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate |
| 06/22/2006 | US20060131708 Packaged electronic devices, and method for making same |
| 06/22/2006 | US20060131707 Semiconductor device package with reduced leakage |
| 06/22/2006 | US20060131706 Methods of making and using a floating lead finger on a lead frame |
| 06/22/2006 | US20060131705 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
| 06/22/2006 | US20060131704 Packages for encapsulated semiconductor devices and method of making same |
| 06/22/2006 | US20060131703 Polymeric conductor donor and transfer method |
| 06/22/2006 | US20060131701 Use of a down-bond as a controlled inductor in integrated circuit applications |
| 06/22/2006 | US20060131700 Flexible electronic circuit articles and methods of making thereof |
| 06/22/2006 | US20060131698 Wafer-scale microcolumn array using low temperature co-fired ceramic substrate |
| 06/22/2006 | US20060131696 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them |
| 06/22/2006 | US20060131691 Electronic device, assembly and methods of manufacturing an electronic device |
| 06/22/2006 | US20060131690 Fuse box of semiconductor device and fabrication method thereof |
| 06/22/2006 | US20060131677 Systems and methods for electrically coupling wires and conductors |
| 06/22/2006 | US20060131671 Electronic device including dielectric layer, and a process for forming the electronic device |
| 06/22/2006 | US20060131654 Diode with reduced forward-bias resistance and shunt capacitance |
| 06/22/2006 | US20060131605 Low capacitance two-terminal barrier controlled TVS diodes |
| 06/22/2006 | US20060131600 Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member |
| 06/22/2006 | US20060131589 Boron carbide particle detectors |
| 06/22/2006 | US20060131578 Structure of semiconductor substrate including test element group wiring |
| 06/22/2006 | US20060131577 Isolation circuit |
| 06/22/2006 | US20060131576 Semiconductor device having overlay measurement mark and method of fabricating the same |
| 06/22/2006 | US20060131575 Electronic device and manufacturing method thereof |
| 06/22/2006 | US20060131574 Nanowire sensor and method of manufacturing the same |
| 06/22/2006 | US20060131569 Organic memory device and method of manufacturing the same |
| 06/22/2006 | US20060131288 Processing a memory link with a set of at least two laser pulses |
| 06/22/2006 | US20060131287 Processing a memory link with a set of at least two laser pulses |
| 06/22/2006 | US20060131286 Processing a memory link with a set of at least two laser pulses |
| 06/22/2006 | US20060131285 Processing a memory link with a set of at least two laser pulses |
| 06/22/2006 | US20060131284 Processing a memory link with a set of at least two laser pulses |
| 06/22/2006 | US20060131065 Wired circuit board |
| 06/22/2006 | US20060131010 Heat dissipating assembly for a heat element |
| 06/22/2006 | US20060130999 Heat exchanger with interchangeable fan assemblies |
| 06/22/2006 | US20060130998 Heat sink having a high thermal conductivity |
| 06/22/2006 | DE202006005664U1 Semiconductor laser diode-module`s individual component e.g. laser diode, contacting arrangement, has optical components arranged on base body, and printed circuit board including conducting lines with contact connection to components |
| 06/22/2006 | DE102005058757A1 Verbindungselement für Halbleiterpackungstest und Herstellungsverfahren Connecting element for semiconductor package test and manufacturing processes |
| 06/22/2006 | DE10122837B4 Leistungshalbleiter-Modul The power semiconductor module |
| 06/22/2006 | CA2587431A1 Method for collectively producing a superimposed element microstructure |
| 06/21/2006 | EP1672970A2 Multi-layer printed circuit board and method of manufacturing multi-layered printed circuit board |
| 06/21/2006 | EP1672701A2 Zener diode and methods for fabricating and packaging same |
| 06/21/2006 | EP1672695A1 Semiconductor device and process for manufacturing the same |
| 06/21/2006 | EP1672694A1 Semiconductor device |
| 06/21/2006 | EP1672692A1 Power semiconductor module |
| 06/21/2006 | EP1672691A1 Electrical connector for integrated circuit on a mainboard |
| 06/21/2006 | EP1672690A1 Micro heat sink |
| 06/21/2006 | EP1672688A1 Formation of deep via airgaps for three dimensional wafer to wafer interconnect |
| 06/21/2006 | EP1672685A1 Substrate for device bonding, device bonded substrate, and method for producing same |
| 06/21/2006 | EP1671369A2 Multi-surface ic packaging structures and methods for their manufacture |
| 06/21/2006 | EP1671368A1 Thermal interface material |
| 06/21/2006 | EP1671360A2 Method and system for treating a dielectric film |
| 06/21/2006 | EP1671339A2 Method and apparatus for performing power routing on a voltage island within an integrated circuit chip |
| 06/21/2006 | EP1670863A1 Curable organopolysiloxane composition and semiconductor device |
| 06/21/2006 | EP1478674B1 Low-corrosive epoxy resins and production method therefor |
| 06/21/2006 | EP1325519A4 Semiconductor apparatus with improved esd withstanding voltage |
| 06/21/2006 | EP1273212B1 Double-sided wiring board and its manufacture method |
| 06/21/2006 | EP1260121B1 A printed circuit board assembly with improved bypass decoupling for bga packages |
| 06/21/2006 | EP1147555B1 Heat exchanger that contacts an entire planar face of an electronic device except for its corners |
| 06/21/2006 | EP1016135A4 Fusion-bond electrical feed-through |
| 06/21/2006 | CN2789932Y Mixed wire welding structure for power semiconductor component |
| 06/21/2006 | CN2789931Y Radiating structure and electronic device utilizing the same structure |
| 06/21/2006 | CN2789930Y Aluminium silicon-carbide packaged sheet with metal at four sides |
| 06/21/2006 | CN1792126A Double-sided wiring board and manufacturing method of double-sided wiring board |
| 06/21/2006 | CN1792124A Bulk high thermal conductivity feedstock and method of making thereof |
| 06/21/2006 | CN1791978A 互连图案设计 Interconnect designs |
| 06/21/2006 | CN1791977A Thermal apparatus for engaging electronic device |
| 06/21/2006 | CN1791976A Semiconductor die package with increased thermal conduction |
| 06/21/2006 | CN1791975A Electrical connections in substrates |
| 06/21/2006 | CN1791974A Use of voids between elements in semiconductor structures for isolation |
| 06/21/2006 | CN1791653A Foamable underfill encapsulant |
| 06/21/2006 | CN1791636A Resin composition for thermally conductive material and thermally conductive material |
| 06/21/2006 | CN1791320A Electronic apparatus |
| 06/21/2006 | CN1791311A Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure |
| 06/21/2006 | CN1791305A Circuit component module, electronic circuit device, and method for manufacturing the circuit component module |
| 06/21/2006 | CN1790754A Wafer with highly efficient heat radiation and brightness |
| 06/21/2006 | CN1790750A Thin film transistor, method of manufacturing the same, display apparatus having the same and method of manufacturing the display apparatus |
| 06/21/2006 | CN1790721A Circuit wiring layout in semiconductor memory device and layout method |
| 06/21/2006 | CN1790713A Protection circuit for a transistor |
| 06/21/2006 | CN1790706A Multi-level semiconductor module |
| 06/21/2006 | CN1790705A Apparatus and methods for cooling semiconductor integrated circuit chip packages |
| 06/21/2006 | CN1790704A Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
| 06/21/2006 | CN1790703A 半导体装置 Semiconductor device |
| 06/21/2006 | CN1790702A Improved HDP-based ILD capping layer |
| 06/21/2006 | CN1790701A 半导体装置 Semiconductor device |
| 06/21/2006 | CN1790700A Structure of semiconductor device and method for manufacturing the same |
| 06/21/2006 | CN1790699A Structure and method for strained channel field effect transistor pair having underlapped dual liners |
| 06/21/2006 | CN1790698A Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system |
| 06/21/2006 | CN1790697A Robust power semiconductor package |
| 06/21/2006 | CN1790696A Electronic device package and electronic equipment |
| 06/21/2006 | CN1790695A Optical device and method of manufacturing the same |
| 06/21/2006 | CN1790694A Contour structures to highlight inspection regions |
| 06/21/2006 | CN1790693A Flip chip and wire bond semiconductor package |
| 06/21/2006 | CN1790692A Semiconductor device and manufacturing process thereof |