| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/27/2006 | US7067426 Semiconductor processing methods |
| 06/27/2006 | US7067424 Method of manufacturing an electronic device |
| 06/27/2006 | US7067421 Multilevel copper interconnect with double passivation |
| 06/27/2006 | US7067416 Method of forming a conductive contact |
| 06/27/2006 | US7067412 Semiconductor device and method of manufacturing the same |
| 06/27/2006 | US7067406 Thermal conducting trench in a semiconductor structure and method for forming the same |
| 06/27/2006 | US7067398 Method of producing electronic circuit and electronic circuit |
| 06/27/2006 | US7067380 Semiconductor device and manufacturing method therefor |
| 06/27/2006 | US7067359 Method of fabricating an electrical fuse for silicon-on-insulator devices |
| 06/27/2006 | US7067358 Package structure with a retarding structure and method of making same |
| 06/27/2006 | US7067357 Semiconductor package and method of fabricating same |
| 06/27/2006 | US7067356 Method of fabricating microelectronic package having a bumpless laminated interconnection layer |
| 06/27/2006 | US7067355 Package having bond-sealed underbump |
| 06/27/2006 | US7067354 Electrical die contact structure and fabrication method |
| 06/27/2006 | US7067353 Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer |
| 06/27/2006 | US7067335 Apparatus and methods for semiconductor IC failure detection |
| 06/27/2006 | US7067334 Tape carrier package and method of fabricating the same |
| 06/27/2006 | US7067333 Method and apparatus for implementing competing control models |
| 06/27/2006 | US7067070 Electroluminescent phosphor powders, methods for making phosphor powders, and devices incorporating same |
| 06/27/2006 | US7066976 Method for the production of electrocatalyst powders |
| 06/27/2006 | US7066741 Flexible circuit connector for stacked chip module |
| 06/27/2006 | US7066740 Area array package with low inductance connecting device |
| 06/27/2006 | US7066659 Small form factor transceiver with externally modulated laser |
| 06/27/2006 | US7066372 Recognition device, bonding device, and method of manufacturing a circuit device |
| 06/27/2006 | US7066244 Temperature-homogenizing device |
| 06/27/2006 | US7066240 Integrated circuit heat pipe heat spreader with through mounting holes |
| 06/27/2006 | US7065869 Method for plating of printed circuit board strip |
| 06/27/2006 | US7065867 Low temperature hermetic sealing method having passivation layer |
| 06/22/2006 | WO2006066266A1 Semiconductor package having improved adhesion and solderability |
| 06/22/2006 | WO2006066159A2 Device having a low-voltage trigger element |
| 06/22/2006 | WO2006065378A2 Flip chip and wire bond semiconductor package |
| 06/22/2006 | WO2006065359A1 Interface for bridging out-of-band information devices |
| 06/22/2006 | WO2006065348A1 Diode with low junction capacitance |
| 06/22/2006 | WO2006065305A1 Monolithic microwave integrated circuit compatible fet structure |
| 06/22/2006 | WO2006065282A1 Amide-substituted silicones and methods for their preparation and use |
| 06/22/2006 | WO2006064887A1 Display control substrate, manufacturing method thereof, liquid crystal display panel, electronic information device |
| 06/22/2006 | WO2006064736A1 Thermosetting epoxy resin composition and use thereof |
| 06/22/2006 | WO2006064666A1 Power module, method for producing same and air conditioner |
| 06/22/2006 | WO2006064534A1 Semiconductor device |
| 06/22/2006 | WO2006064289A1 Hydrogen getter |
| 06/22/2006 | WO2006064158A1 Device and method for hermetically sealing a cavity in an electronic component |
| 06/22/2006 | WO2006064111A1 Electronic device provided with two assembled components and method for producing said device |
| 06/22/2006 | WO2006063961A1 Method for collectively producing a superimposed element microstructure |
| 06/22/2006 | WO2006063822A2 Multilayer structure with a temperature control fluid channel, and production method |
| 06/22/2006 | WO2006063614A1 Power field effect transistor device and method of manufacture thereof |
| 06/22/2006 | WO2006036751A3 Integrated circuit and method for manufacturing |
| 06/22/2006 | WO2006012012B1 Chip-to-chip trench circuit structure |
| 06/22/2006 | WO2005122195A3 Fabrication of interconnect structures |
| 06/22/2006 | WO2005052999A3 Decoupling circuit for co-packaged semiconductor devices |
| 06/22/2006 | US20060136089 Numerical control device for machine tool and numerical control method for machine tool |
| 06/22/2006 | US20060134887 Method of manufacturing a slice of semiconductor |
| 06/22/2006 | US20060134886 Manufacturing method of semiconductor device |
| 06/22/2006 | US20060134884 Wafer structure, chip structure, and fabricating process thereof |
| 06/22/2006 | US20060134838 Processing a memory link with a set of at least two laser pulses |
| 06/22/2006 | US20060134836 Method of marking a low profile packaged semiconductor device |
| 06/22/2006 | US20060134826 Methods of forming semiconductor packages |
| 06/22/2006 | US20060133124 Semiconductor package with a controlled impedance bus and method of forming same |
| 06/22/2006 | US20060133048 Cooling device, substrate, and electronic equipment |
| 06/22/2006 | US20060132807 Periodic patterns and technique to control misalignment between two layers |
| 06/22/2006 | US20060132241 Transistor integrated circuit device and manufacturing method thereof |
| 06/22/2006 | US20060131760 Power semiconductor package |
| 06/22/2006 | US20060131759 Bonding pad structure |
| 06/22/2006 | US20060131758 Anchored non-solder mask defined ball pad |
| 06/22/2006 | US20060131757 Light emitting module |
| 06/22/2006 | US20060131755 Method of making circuitized substrate |
| 06/22/2006 | US20060131754 Semiconductor device having trench interconnection and manufacturing method of semiconductor device |
| 06/22/2006 | US20060131753 Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications |
| 06/22/2006 | US20060131752 Micro column electron beam apparatus formed in low temperature co-fired ceramic substrate |
| 06/22/2006 | US20060131751 Semiconductor device and method for manufacturing the same |
| 06/22/2006 | US20060131750 Protection of seedlayer for electroplating |
| 06/22/2006 | US20060131749 Metal layer in semiconductor device and method of forming the same |
| 06/22/2006 | US20060131748 Ball limiting metallurgy split into segments |
| 06/22/2006 | US20060131747 Carrier with metal bumps for semiconductor die packages |
| 06/22/2006 | US20060131746 Circuit device |
| 06/22/2006 | US20060131745 Semiconductor device and manufacturing method therefor |
| 06/22/2006 | US20060131744 Method and apparatus for providing a BGA connection having improved drop test performance |
| 06/22/2006 | US20060131743 Changing chip function based on fuse states |
| 06/22/2006 | US20060131742 Packaged chip capable of lowering characteristic impedance |
| 06/22/2006 | US20060131741 Semiconductor device and manufacturing method of the same |
| 06/22/2006 | US20060131740 Multi-level semiconductor module and method for fabricating the same |
| 06/22/2006 | US20060131739 Semiconductor device and method of arranging pad thereof |
| 06/22/2006 | US20060131738 Method and apparatus for chip cooling using a liquid metal thermal interface |
| 06/22/2006 | US20060131737 Semiconductor chip having coolant path, semiconductor package and package cooling system using the same |
| 06/22/2006 | US20060131736 Package for a high-frequency electronic device |
| 06/22/2006 | US20060131735 Hyper thermally enhanced semiconductor package system |
| 06/22/2006 | US20060131734 Multi lead frame power package |
| 06/22/2006 | US20060131733 Integrated circuit coolant microchannel with movable portion |
| 06/22/2006 | US20060131732 Discrete electronic component arrangement including anchoring, thermally conductive pad |
| 06/22/2006 | US20060131731 Midair semiconductor device and manufacturing method of the same |
| 06/22/2006 | US20060131730 Semiconductor package and fabrication method |
| 06/22/2006 | US20060131729 Ball grid array substrate having window and method of fabricating same |
| 06/22/2006 | US20060131728 Repairable three-dimensional semiconductor subsystem |
| 06/22/2006 | US20060131727 Semiconductor device |
| 06/22/2006 | US20060131726 Arrangement of input/output pads on an integrated circuit |
| 06/22/2006 | US20060131725 System for implementing a configurable integrated circuit |
| 06/22/2006 | US20060131724 Semiconductor apparatus and circuit apparatus |
| 06/22/2006 | US20060131723 Manufacturing method of a quad flat no-lead package structure |
| 06/22/2006 | US20060131722 Package and method for saving space required by I/O of chip |
| 06/22/2006 | US20060131720 Coating for enhancing adhesion of molding compound to semiconductor devices |
| 06/22/2006 | US20060131719 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |