| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/28/2006 | CN2792117Y Radiating module |
| 06/28/2006 | CN2792116Y 热管散热装置 Heat pipe cooling device |
| 06/28/2006 | CN2791883Y Package chip improvement capable of increasing rate |
| 06/28/2006 | CN2791882Y Interface layer-structure of reducing jointing inter face thermoresistance |
| 06/28/2006 | CN2791881Y Chip package structure |
| 06/28/2006 | CN1795558A Electronic parts, module, module assembling method, identification method, and environment setting method |
| 06/28/2006 | CN1795557A 半导体装置 Semiconductor device |
| 06/28/2006 | CN1795556A Semiconductor device, method of authentifying and system |
| 06/28/2006 | CN1795555A Selective reference plane bridge(s) on folded package |
| 06/28/2006 | CN1795554A Lead frame for a semiconductor device |
| 06/28/2006 | CN1795553A Method of manufacturing a substrate, having a porous dielectric layer and air gaps, and a substrate |
| 06/28/2006 | CN1795549A 高阻抗射频功率塑料封装 High impedance RF power plastic packages |
| 06/28/2006 | CN1795368A Octagonal pedestal for stabilizing filling |
| 06/28/2006 | CN1794464A Vertical interconnect for organic electronic devices |
| 06/28/2006 | CN1794455A Method for forming storage node of capacitor in semiconductor device |
| 06/28/2006 | CN1794449A Chip package |
| 06/28/2006 | CN1794448A Chip pressing structure and its shaping method and electronic installation |
| 06/28/2006 | CN1794447A Water cooling method and device of electric transmission power electron power inverter |
| 06/28/2006 | CN1794446A Micron scale chip size packaging radiation structure |
| 06/28/2006 | CN1794445A Micron scale chip size packaging radiation structure |
| 06/28/2006 | CN1794444A Micropassage type radiator based on diamond film |
| 06/28/2006 | CN1794443A Package for semiconductor device |
| 06/28/2006 | CN1794418A Method of making a semiconductor device |
| 06/28/2006 | CN1262005C Electrostatic discharge protector |
| 06/28/2006 | CN1262004C Metal pad structure adapted for connecting pad and checking pad |
| 06/28/2006 | CN1262003C 半导体器件 Semiconductor devices |
| 06/28/2006 | CN1262002C Radiating structural body of electronic part and radiating sheet used for radiating structural body |
| 06/28/2006 | CN1262001C Self-composed nano-level interface structure and its application |
| 06/28/2006 | CN1261998C 半导体器件 Semiconductor devices |
| 06/28/2006 | CN1261997C Microelectronic technology and structure |
| 06/28/2006 | CN1261996C Semiconductor device and production method therefor |
| 06/28/2006 | CN1261990C Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device |
| 06/28/2006 | CN1261989C Hybrid low k-interconnect structure comprised of 2 spin-on dielectric material |
| 06/28/2006 | CN1261985C Semiconductor device and its making method |
| 06/28/2006 | CN1261980C Method and apparatus for controlling a plating process |
| 06/28/2006 | CN1261972C Connecting tape for semiconductor chip loading, carrier and package, manufacturing , loading and packing method |
| 06/28/2006 | CN1261817C K fraction fractal masking method for preparing material chips |
| 06/27/2006 | US7069525 Method and apparatus for determining characteristics of MOS devices |
| 06/27/2006 | US7068521 Semiconductor device |
| 06/27/2006 | US7068520 Circuit board made of resin with pin |
| 06/27/2006 | US7068519 Printed circuit board and method manufacturing the same |
| 06/27/2006 | US7068514 Protection structure for thermal conducting medium of heat dissipation device |
| 06/27/2006 | US7068512 Heat dissipation device incorporating with protective cover |
| 06/27/2006 | US7068510 Dissipating heat reliably in computer systems |
| 06/27/2006 | US7068490 Thermal dissipating capacitor and electrical component comprising same |
| 06/27/2006 | US7068371 Methods and apparatus for aligning a wafer in which multiple light beams are used to scan alignment marks |
| 06/27/2006 | US7068340 Liquid crystal display |
| 06/27/2006 | US7068139 Inductor formed in an integrated circuit |
| 06/27/2006 | US7068138 High Q factor integrated circuit inductor |
| 06/27/2006 | US7068072 Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit |
| 06/27/2006 | US7068058 Semiconductor integrated circuit device with test element group circuit |
| 06/27/2006 | US7067931 Self-compensating mark design for stepper alignment |
| 06/27/2006 | US7067930 containing core-shell polymers of alkyl (meth)acrylates; glass transition temperature of the core is up to -10 degrees C., of the shell is 80-150 degrees C., with a particle size of 0.1-1.0 mu m; adherent to surfaces of silicon chips, especially polyimide resins; useful as sealant for flip chips |
| 06/27/2006 | US7067929 Semiconductor wafer, semiconductor device, circuit board, electronic instrument, and method for manufacturing semiconductor device |
| 06/27/2006 | US7067928 Method of forming a bonding pad structure |
| 06/27/2006 | US7067927 Die with integral pedestal having insulated walls |
| 06/27/2006 | US7067926 Semiconductor chip and method for manufacturing the same |
| 06/27/2006 | US7067925 Barrier film integrity on porous low k dielectrics by application of a hydrocarbon plasma treatment |
| 06/27/2006 | US7067924 Nickel bonding cap over copper metalized bondpads |
| 06/27/2006 | US7067923 Semiconductor device having hall-effect and manufacturing method thereof |
| 06/27/2006 | US7067922 Semiconductor device |
| 06/27/2006 | US7067921 Method for fabricating a metal-insulator-metal capacitor in a semiconductor device |
| 06/27/2006 | US7067920 Semiconductor device and method of fabricating the same |
| 06/27/2006 | US7067919 Semiconductor device |
| 06/27/2006 | US7067918 Wiring board |
| 06/27/2006 | US7067917 Gradient barrier layer for copper back-end-of-line technology |
| 06/27/2006 | US7067916 Extension of fatigue life for C4 solder ball to chip connection |
| 06/27/2006 | US7067915 Electronic device with external contact elements and method for producing a plurality of the devices |
| 06/27/2006 | US7067914 Dual chip stack method for electro-static discharge protection of integrated circuits |
| 06/27/2006 | US7067913 Semiconductor cooling system and process for manufacturing the same |
| 06/27/2006 | US7067912 Wired circuit board |
| 06/27/2006 | US7067911 Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture |
| 06/27/2006 | US7067910 Method and apparatus for using capacitively coupled communication within stacks of laminated chips |
| 06/27/2006 | US7067909 Multi-layer integrated semiconductor structure having an electrical shielding portion |
| 06/27/2006 | US7067908 Semiconductor package having improved adhesiveness and ground bonding |
| 06/27/2006 | US7067907 Semiconductor package having angulated interconnect surfaces |
| 06/27/2006 | US7067905 Packaged microelectronic devices including first and second casings |
| 06/27/2006 | US7067904 Flip-chip type quad flat package and leadframe |
| 06/27/2006 | US7067903 Heat spreader and semiconductor device and package using the same |
| 06/27/2006 | US7067902 Building metal pillars in a chip for structure support |
| 06/27/2006 | US7067901 Semiconductor devices including protective layers on active surfaces thereof |
| 06/27/2006 | US7067897 Semiconductor device |
| 06/27/2006 | US7067896 Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture |
| 06/27/2006 | US7067887 High voltage device and high voltage device for electrostatic discharge protection circuit |
| 06/27/2006 | US7067886 Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage |
| 06/27/2006 | US7067884 Electrostatic discharge device |
| 06/27/2006 | US7067883 Lateral high-voltage junction device |
| 06/27/2006 | US7067882 High quality factor spiral inductor that utilizes active negative capacitance |
| 06/27/2006 | US7067877 MIS-type semiconductor device |
| 06/27/2006 | US7067869 Adjustable 3D capacitor |
| 06/27/2006 | US7067859 Multi-layer staggered power bus layout design |
| 06/27/2006 | US7067857 Semiconductor device having led out conductor layers, manufacturing method of the same, and semiconductor module |
| 06/27/2006 | US7067852 Electrostatic discharge (ESD) protection structure |
| 06/27/2006 | US7067842 Method and apparatus for monitoring parasitic inductance |
| 06/27/2006 | US7067840 Method and device for reducing the contact resistance in organic field-effect transistors by embedding nanoparticles to produce field boosting |
| 06/27/2006 | US7067763 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
| 06/27/2006 | US7067743 Transmission line and device including the same |
| 06/27/2006 | US7067742 Connection component with peelable leads |
| 06/27/2006 | US7067741 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 06/27/2006 | US7067427 Manufacturing method of semiconductor device |