| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/29/2006 | US20060138643 One step capillary underfill integration for semiconductor packages |
| 06/29/2006 | US20060138642 Micromechanical getter anchor |
| 06/29/2006 | US20060138641 Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card |
| 06/29/2006 | US20060138640 Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates |
| 06/29/2006 | US20060138639 Capacitor pad network to manage equivalent series resistance |
| 06/29/2006 | US20060138638 Substrate for semiconductor devices and semiconductor device |
| 06/29/2006 | US20060138637 Connection terminal and connector equipped therewith |
| 06/29/2006 | US20060138636 Device for electrical connection of an integrated circuit chip |
| 06/29/2006 | US20060138635 Power semiconductor device |
| 06/29/2006 | US20060138634 Method for determining the arrangement of contact surfaces on the active upper face of a semiconductor chip |
| 06/29/2006 | US20060138633 Semiconductor device |
| 06/29/2006 | US20060138632 Package for semiconductor components and method for producing the same |
| 06/29/2006 | US20060138631 Multi-chip package structure |
| 06/29/2006 | US20060138630 Stacked ball grid array packages |
| 06/29/2006 | US20060138629 Method of manufacturing semiconductor device, semiconductor device, stacked semiconductor device, circuit board and electronic instrument |
| 06/29/2006 | US20060138628 Stack chip package |
| 06/29/2006 | US20060138627 Methods of vertically stacking wafers using porous silicon |
| 06/29/2006 | US20060138626 Microelectronic packages using a ceramic substrate having a window and a conductive surface region |
| 06/29/2006 | US20060138625 Storage apparatus, card type storage apparatus, and electronic apparatus |
| 06/29/2006 | US20060138624 Semiconductor device package |
| 06/29/2006 | US20060138623 Stacked-type semiconductor device |
| 06/29/2006 | US20060138622 One step capillary underfill integration for semiconductor packages |
| 06/29/2006 | US20060138621 Optoelectronic component and a module based thereon |
| 06/29/2006 | US20060138620 Resin-encapsulated package, lead member for the same and method of fabricating the lead member |
| 06/29/2006 | US20060138619 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 06/29/2006 | US20060138618 Method for wafer stacking using copper structures of substantially uniform height |
| 06/29/2006 | US20060138617 Semiconductor integrated circuit device and method of manufacturing the same |
| 06/29/2006 | US20060138616 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device |
| 06/29/2006 | US20060138615 Semiconductor package and lead frame therefor |
| 06/29/2006 | US20060138614 Semiconductor device and method of fabricating the same |
| 06/29/2006 | US20060138613 Integrated circuit package with inner ground layer |
| 06/29/2006 | US20060138612 IC substrate with over voltage protection function |
| 06/29/2006 | US20060138611 IC substrate with over voltage protection function |
| 06/29/2006 | US20060138610 Ball grid array IC substrate with over voltage protection function |
| 06/29/2006 | US20060138609 IC substrate with over voltage protection function |
| 06/29/2006 | US20060138608 IC substrate with over voltage protection function |
| 06/29/2006 | US20060138605 Method for attaching chips in a flip-chip arrangement |
| 06/29/2006 | US20060138604 Low charging dielectric for capacitive MEMS devices and method of making same |
| 06/29/2006 | US20060138603 Deposition of hafnium oxide and/or zirconium oxide and fabrication of passivated electronic structures |
| 06/29/2006 | US20060138601 Internally gettered heteroepitaxial semiconductor wafers and methods of manufacturing such wafers |
| 06/29/2006 | US20060138600 Unit circuit, method of controlling unit circuit, electronic device, and electronic apparatus |
| 06/29/2006 | US20060138599 Semiconductor members having a halogenated polymeric coating and methods for their formation |
| 06/29/2006 | US20060138598 Localized slots for stress relieve in copper |
| 06/29/2006 | US20060138595 Semiconductor device and method of manufacturing the same |
| 06/29/2006 | US20060138573 Bi-directional released-beam sensor |
| 06/29/2006 | US20060138551 Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device |
| 06/29/2006 | US20060138547 Reduced finger end MOSFET breakdown voltage (BV) for electrostatic discharge (ESD) protection |
| 06/29/2006 | US20060138546 Voltage regulator |
| 06/29/2006 | US20060138545 Protective circuit for protecting chip from misoperation |
| 06/29/2006 | US20060138544 ESD protection structure for I/O pad subject to both positive and negative voltages |
| 06/29/2006 | US20060138479 Tensile strained substrate |
| 06/29/2006 | US20060138469 Semiconductor device and fabricating method thereof |
| 06/29/2006 | US20060138462 Method of making a semiconductor device |
| 06/29/2006 | US20060138455 Silicon carbide on diamond substrates and related devices and methods |
| 06/29/2006 | US20060138411 Semiconductor wafer with a test structure, and method |
| 06/29/2006 | US20060138410 Method for measuring information about a substrate, and a substrate for use in a lithographic apparatus |
| 06/29/2006 | US20060138110 Processing a memory link with a set of at least two laser pulses |
| 06/29/2006 | US20060138109 Processing a memory link with a set of at least two laser pulses |
| 06/29/2006 | US20060138108 Processing a memory link with a set of at least two laser pulses |
| 06/29/2006 | US20060138107 Processing a memory link with a set of at least two laser pulses |
| 06/29/2006 | US20060138106 Processing a memory link with a set of at least two laser pulses |
| 06/29/2006 | US20060138096 Processing a memory link with a set of at least two laser pulses |
| 06/29/2006 | US20060138076 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component |
| 06/29/2006 | US20060137488 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder |
| 06/29/2006 | US20060137181 Cooling apparatus having low profile extrusion and method of manufacture therefor |
| 06/29/2006 | DE69635227T2 Kontakträger zum bestücken von substraten mit federkontakten Contact carrier of fitting substrates with spring contacts |
| 06/29/2006 | DE19724472B4 Halbleiterbauteil mit einer Verdrahtung und Verfahren zum Herstellen des Halbleiterbauteils A semiconductor device comprising a wiring and method for manufacturing the semiconductor device |
| 06/29/2006 | DE10326083B4 Rippenkonstruktion zur Wärmeabführung und Baugruppe mit einer solchen Rib design for heat dissipation and assembly with such a |
| 06/29/2006 | DE102005059224A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 06/29/2006 | DE102005056892A1 Elektronikmodul für eine Systemplatine mit Durchgangslöchern Electronics module for a system board with through holes |
| 06/29/2006 | DE102005056872A1 Mehrchipmodul mit Leistungssystem und Durchgangslöchern Multi-chip module with a power system and through holes |
| 06/29/2006 | DE102004061307A1 Semiconductor device, has metal/isolation structure arranged above semiconductor body, and passivation layer arranged on metal/isolation structure, where passivation layer consists of metal or metalliferous connection |
| 06/29/2006 | DE102004061250A1 Switching device, e.g. for motor vehicle technology, has condenser whose contact and connection of digital circuit are connected with one another, so that measuring current does not flow over measuring layer between circuit and condenser |
| 06/29/2006 | DE102004061099A1 Power semiconductor module for use as contact for sensors comprises of substrate arranged with base plate and frame housing enclosing substrate, whereby second section of auxiliary connections are connected with high impedance connection |
| 06/29/2006 | DE102004060369A1 Semiconductor circuit manufacturing wafer, has connection contacts provided in test structure-area and forming two rows, which run in longitudinal direction and are displaced against each other transverse to longitudinal direction |
| 06/29/2006 | DE102004060367A1 Chip component has semiconductor body, element which can be switched and arranged in subarea of semiconductor body, integrated switching to take out a configuration from two configurations and also housing which surrounds semiconductor body |
| 06/29/2006 | DE102004059884A1 Microchip, e.g. heterojunction bipolar transistor, flip-chip mounting method, involves coating surfaces of microchips, with gold-tin-solder, where chips are soldered by heating of arrangement along with substrate |
| 06/29/2006 | DE102004041889B4 Halbleitervorrichtung mit gestapelten Halbleiterbauelementen und Verfahren zu deren Herstellung A semiconductor device with stacked semiconductor devices and processes for their preparation |
| 06/29/2006 | DE102004041417B4 Electrical arrangement for microelectronics has component insulated from substrate by dielectric layer on conductive substrate |
| 06/28/2006 | EP1675451A1 Liquid cooling module |
| 06/28/2006 | EP1675179A1 Stacked-type semiconductor device |
| 06/28/2006 | EP1675178A2 Connection arrangement for micro lead frame plastic packages |
| 06/28/2006 | EP1675177A2 Semiconductor apparatus and circuit apparatus |
| 06/28/2006 | EP1675176A1 Method for measuring the bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate |
| 06/28/2006 | EP1675175A2 Wired circuit board |
| 06/28/2006 | EP1675174A1 Preparation of heat transfer member and heat-dissipating structure |
| 06/28/2006 | EP1675173A2 Epoxy-solder thermally conductive structure for an integrated circuit |
| 06/28/2006 | EP1675172A1 Coating for enhancing adhesion of molding compound to semiconductor devices |
| 06/28/2006 | EP1675171A2 Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument |
| 06/28/2006 | EP1675170A2 Package elements and methods for securing a getter |
| 06/28/2006 | EP1675168A2 Process and device for the positioning of connection balls for integrated circuits |
| 06/28/2006 | EP1674325A1 Power supply device for vehicles |
| 06/28/2006 | EP1673814A2 Integrated package design for a radiation sensing device and manufacturing method |
| 06/28/2006 | EP1673812A2 Integrated sensor chip unit |
| 06/28/2006 | EP1673809A2 Wiring protection element for laser deleted tungsten fuse |
| 06/28/2006 | EP1673808A2 Electronic device and carrier substrate |
| 06/28/2006 | EP1673807A1 Electronic device and carrier substrate for same |
| 06/28/2006 | EP1673806A2 Amorphous carbon layer to improve photoresist adhesion |
| 06/28/2006 | EP1673800A2 Production method and device for improving the bonding between plastic and metal |
| 06/28/2006 | EP1673754A2 Heat spreader for display device |