| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/04/2006 | US7071055 Method of forming a contact structure including a vertical barrier structure and two barrier layers |
| 07/04/2006 | US7071054 Methods of fabricating MIM capacitors in semiconductor devices |
| 07/04/2006 | US7071052 Resistor with reduced leakage |
| 07/04/2006 | US7071034 Method of making semiconductor device |
| 07/04/2006 | US7071033 Method for forming semiconductor device including stacked dies |
| 07/04/2006 | US7071030 Method of making a flexible substrate with a filler material |
| 07/04/2006 | US7071028 Semiconductor device and its manufacturing method |
| 07/04/2006 | US7071027 Ball grid array package having improved reliability and method of manufacturing the same |
| 07/04/2006 | US7071026 Production method for making film carrier tape for mounting electronic devices thereon |
| 07/04/2006 | US7071024 Method for packaging a microelectronic device using on-die bond pad expansion |
| 07/04/2006 | US7071013 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads |
| 07/04/2006 | US7071012 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing |
| 07/04/2006 | US7070851 Web process interconnect in electronic assemblies |
| 07/04/2006 | US7070831 chip size semiconductor package, which is an ultra-thin size; metal-plated film on a lower surface of the conductive wire patterns under the first openings and attached to the wire pattern by a direct pressure of an ultra-sound heat compression |
| 07/04/2006 | US7070419 Land grid array connector including heterogeneous contact elements |
| 07/04/2006 | US7070088 Method of semiconductor device assembly including fatigue-resistant ternary solder alloy |
| 07/04/2006 | US7070084 Electrical circuit apparatus and methods for assembling same |
| 07/04/2006 | US7069975 Method and apparatus for cooling with a phase change material and heat pipes |
| 07/04/2006 | US7069737 Water-cooling heat dissipation system |
| 07/04/2006 | US7069653 Method for electrically connecting a semiconductor component to an electrical subassembly |
| 07/04/2006 | CA2211542C Electrical feedthroughs for ceramic circuit board support substrates |
| 06/29/2006 | WO2006068672A2 Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate |
| 06/29/2006 | WO2006068643A1 Semiconductor package structure having enhanced thermal dissipation characteristics |
| 06/29/2006 | WO2006068642A1 Semiconductor package structure having enhanced thermal dissipation characteristics |
| 06/29/2006 | WO2006068641A1 Electronic package having down-set leads and method |
| 06/29/2006 | WO2006068284A1 Manufacturing method for semiconductor chips |
| 06/29/2006 | WO2006068082A1 Semiconductor device |
| 06/29/2006 | WO2006068063A1 Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition |
| 06/29/2006 | WO2006067955A1 Method for producing acid anhydride based epoxy resin curing agent, acid anhydride based epoxy resin curing agent, epoxy resin composition, cured article therefrom and optical semiconductor device |
| 06/29/2006 | WO2006067784A1 Chip packaging |
| 06/29/2006 | WO2006067705A1 A power device and a method for controlling a power device |
| 06/29/2006 | WO2006067045A1 Microwave miniature casing and method for producing this casing |
| 06/29/2006 | WO2006067018A1 Circuit arrangement arranged on a substrate and method for producing said circuit arrangement |
| 06/29/2006 | WO2006067013A1 Semi-conductor module having a low thermal load |
| 06/29/2006 | WO2006066964A2 An electronic device, a chip containing method and a contacting device |
| 06/29/2006 | WO2006028597A3 Laser separation of encapsulated submount |
| 06/29/2006 | WO2006023860A3 Thermally conductive composition and method for preparing the same |
| 06/29/2006 | WO2006019674A3 A method of manufacturing a plurality of electronic assemblies |
| 06/29/2006 | WO2005100899B1 Multiple evaporator heat pipe assisted heat sink |
| 06/29/2006 | US20060142424 High molecular weight solid thermoplastic polymer or thermosetting resin and a catalyst; expandable filler(s); solvent; for use in encapsulating electronic components to substrates with a solder; encapsulant expands at a temperature at or above the reflow temperature of the solder |
| 06/29/2006 | US20060141832 Electrical contact |
| 06/29/2006 | US20060141815 Interconnection device and system |
| 06/29/2006 | US20060141814 Electrical contact and connector and method of manufacture |
| 06/29/2006 | US20060141805 Method of depositing dielectric films |
| 06/29/2006 | US20060141778 Manufacturing method of semiconductor device |
| 06/29/2006 | US20060141765 Metal wiring pattern for memory devices |
| 06/29/2006 | US20060141750 Semiconductor integrated device and method for manufacturing same |
| 06/29/2006 | US20060141749 Adhesive of folder package |
| 06/29/2006 | US20060141737 Planar magnetic tunnel junction substrate having recessed alignment marks |
| 06/29/2006 | US20060141680 Processing a memory link with a set of at least two laser pulses |
| 06/29/2006 | US20060141677 Method of manufacturing a semiconductor device |
| 06/29/2006 | US20060141673 Integrated circuit device having reduced bow and method for making same |
| 06/29/2006 | US20060141672 Method for cutting lead terminal of package type electronic component |
| 06/29/2006 | US20060141671 Thermal interface structure with integrated liquid cooling and methods |
| 06/29/2006 | US20060141669 Semiconductor package having semiconductor constructing body and method of manufacturing the same |
| 06/29/2006 | US20060141269 cyclic silylvinylsiloxane mixed with a germanium alkoxylate or halide; dielectrics for integrated circuits; improved mechanical properties and low dielectric constant |
| 06/29/2006 | US20060141225 Oxygen doped firing of barium titanate on copper foil |
| 06/29/2006 | US20060141204 Packaging of organic light-emitting diodes using reactive polyurethane |
| 06/29/2006 | US20060140230 Processing a memory link with a set of at least two laser pulses |
| 06/29/2006 | US20060139883 Electronic packages, assemblies, and systems with fluid cooling and associated methods |
| 06/29/2006 | US20060139882 Cooler for electronic equipment |
| 06/29/2006 | US20060139056 Field programmable structured arrays |
| 06/29/2006 | US20060138682 Substrate provided with an alignment mark in a substantially transmissive process layer, mask for exposing said mark, device manufacturing method, and device manufactured thereby |
| 06/29/2006 | US20060138681 Substrate and lithography process using the same |
| 06/29/2006 | US20060138680 System for controlling semiconductor packaging particulate contamination |
| 06/29/2006 | US20060138679 Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors |
| 06/29/2006 | US20060138678 Chip support of a leadframe for an integrated circuit package |
| 06/29/2006 | US20060138677 Layered microelectronic contact and method for fabricating same |
| 06/29/2006 | US20060138676 Fine terminal, its manufacturing method, and contact sheet |
| 06/29/2006 | US20060138675 Solder structures for out of plane connections |
| 06/29/2006 | US20060138674 Method for fabricating thermally enhanced semiconductor package |
| 06/29/2006 | US20060138673 Semiconductor device and method for manufacturing the same |
| 06/29/2006 | US20060138672 Electronic device and method of fabricating the same |
| 06/29/2006 | US20060138671 Semiconductor device and fabrication method thereof |
| 06/29/2006 | US20060138670 Method of forming copper line in semiconductor device |
| 06/29/2006 | US20060138669 Semiconductor devices and methods for manufacturing the same |
| 06/29/2006 | US20060138668 Passivation structure for semiconductor devices |
| 06/29/2006 | US20060138667 Method for forming an intermetal dielectric layer in a semiconductor device using HDP-CVD, and a semiconductor device manufactured thereby |
| 06/29/2006 | US20060138666 Method for forming an intermetal dielectric layer using low-k dielectric material and a semiconductor device manufactured thereby |
| 06/29/2006 | US20060138665 Mechanically robust dielectric film and stack |
| 06/29/2006 | US20060138664 Electron source device and display |
| 06/29/2006 | US20060138663 Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures |
| 06/29/2006 | US20060138662 Method of forming a bonding pad structure |
| 06/29/2006 | US20060138661 Agglomeration control using early transition metal alloys |
| 06/29/2006 | US20060138660 Copper interconnect |
| 06/29/2006 | US20060138658 Carbon nanotube interconnects in porous diamond interlayer dielectrics |
| 06/29/2006 | US20060138657 Semiconductor device and fabrication method thereof |
| 06/29/2006 | US20060138656 Electrode for an electronic device |
| 06/29/2006 | US20060138655 Semiconductor device |
| 06/29/2006 | US20060138654 Semiconductor device |
| 06/29/2006 | US20060138653 RFIC chip, and position recognition system and security system using the same |
| 06/29/2006 | US20060138652 Solder for device package |
| 06/29/2006 | US20060138651 Native incorporation of RF ID technology for the tracking of electronic circuitry |
| 06/29/2006 | US20060138650 Integrated circuit packaging device and method for matching impedance |
| 06/29/2006 | US20060138649 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 06/29/2006 | US20060138648 Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module |
| 06/29/2006 | US20060138647 Microelectronic package having stacked semiconductor devices and a process for its fabrication |
| 06/29/2006 | US20060138646 Low cost electromechanical devices manufactured from conductively doped resin-based materials |
| 06/29/2006 | US20060138645 High power light emitting diode device |
| 06/29/2006 | US20060138644 Thermal interface structure with integrated liquid cooling and methods |