| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/05/2006 | CN1797750A Method for fabricating radiator and fastener integratedly |
| 07/05/2006 | CN1797749A Heat elimination structure in low noise in use for fast spectral analysis modules under weak light |
| 07/05/2006 | CN1797748A Semiconductor parts and method for manufacturing integrate circuit chip |
| 07/05/2006 | CN1797747A Semiconductor element with uv protection layer and method producing the same |
| 07/05/2006 | CN1797727A Semiconductor encapsulation structure possessing support part, and preparation method |
| 07/05/2006 | CN1797726A Semiconductor structured chip embedded structure of base plate and method of preparation |
| 07/05/2006 | CN1797708A Method for fabricating inner connecting lines in insulating layer of wafer, and structure |
| 07/05/2006 | CN1797704A Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body and method |
| 07/05/2006 | CN1797276A Liquid cooling type heat sink |
| 07/05/2006 | CN1263356C Manufacture method of circuit substrate and circuit substrate and its power switching module |
| 07/05/2006 | CN1263354C Built-in module and its making method |
| 07/05/2006 | CN1263353C Electrostatic prevention device |
| 07/05/2006 | CN1263215C Stability enhanced multistage power amplifier |
| 07/05/2006 | CN1263135C Integrated circuit and mfg. method thereof |
| 07/05/2006 | CN1263126C Semiconductor arrangement and method for production thereof |
| 07/05/2006 | CN1263125C Electrostatic discharge protection system for flip chip packaged IC and chip having said system |
| 07/05/2006 | CN1263124C Large power semiconductor assembly capable of relieving mechanical stress |
| 07/05/2006 | CN1263123C Radiator and method for manufacturing the same and extrusion clamp |
| 07/05/2006 | CN1263121C Method and structure for buried circuits and devices |
| 07/05/2006 | CN1263114C Dual-damascene interconnects without etch stop layer by alternating ILDS |
| 07/05/2006 | CN1263110C Wafer image display device for semiconductor testing system and its method |
| 07/05/2006 | CN1263109C Chromium adhesion layer for copper through-hole in low-K technology |
| 07/05/2006 | CN1263103C Method for producing semiconductor device using low-dielectric constant film and chip structure |
| 07/05/2006 | CN1263098C Method for producing self assembling microstructure |
| 07/05/2006 | CN1263032C Voice coding and decoding method, and voice transmitting and receiving method |
| 07/05/2006 | CN1262960C Extraction method of defect density and size distribution |
| 07/05/2006 | CN1262599C Thermosetting resin composition and semiconductor device obtained therefrom |
| 07/05/2006 | CN1262598C Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 07/05/2006 | CN1262468C Air tight method for packing micro system in-situ |
| 07/05/2006 | CN1262368C 散热器 Heat sink |
| 07/04/2006 | US7072578 Carbon wire heating object sealing heater and fluid heating apparatus using the same heater |
| 07/04/2006 | US7072535 Layered board, and apparatus incorporating such layered board |
| 07/04/2006 | US7072184 Heat sink attachment |
| 07/04/2006 | US7072183 Locking device for heat dissipating device |
| 07/04/2006 | US7072181 Heat dissipating device and electronic apparatus including the same |
| 07/04/2006 | US7072180 Gas collecting device, test head and IC device testing apparatus |
| 07/04/2006 | US7072168 Capacitor device and method of manufacturing the same |
| 07/04/2006 | US7072161 High ESD stress sustaining ESD protection circuit |
| 07/04/2006 | US7071587 Integrated cooler for electronic devices |
| 07/04/2006 | US7071577 Semiconductor device and resin binder for assembling semiconductor device |
| 07/04/2006 | US7071576 Semiconductor device and method of manufacturing the same |
| 07/04/2006 | US7071575 Semiconductor chip capable of implementing wire bonding over active circuits |
| 07/04/2006 | US7071574 Semiconductor device and its wiring method |
| 07/04/2006 | US7071573 Semiconductor chip assembly with welded metal pillar |
| 07/04/2006 | US7071572 Pre-back-grind and underfill layer for bumped wafers and dies |
| 07/04/2006 | US7071571 Semiconductor component having a plastic housing and methods for its production |
| 07/04/2006 | US7071570 Chip scale package and method of fabricating the same |
| 07/04/2006 | US7071569 Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection |
| 07/04/2006 | US7071568 Stacked-die extension support structure and method thereof |
| 07/04/2006 | US7071567 Semiconductor device and method of fabrication thereof, optical module and method of fabrication thereof, circuit board, and electronic instrument |
| 07/04/2006 | US7071566 Multi-substrate package assembly |
| 07/04/2006 | US7071565 Patterning three dimensional structures |
| 07/04/2006 | US7071564 Composite tantalum capped inlaid copper with reduced electromigration and reduced stress migration |
| 07/04/2006 | US7071563 Efficiency |
| 07/04/2006 | US7071562 Interconnects with improved barrier layer adhesion |
| 07/04/2006 | US7071561 Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell |
| 07/04/2006 | US7071560 Semiconductor device and a method of manufacturing the same and designing the same |
| 07/04/2006 | US7071559 Design of beol patterns to reduce the stresses on structures below chip bondpads |
| 07/04/2006 | US7071558 Agglomeration control using early transition metal alloys |
| 07/04/2006 | US7071557 Metallization structures for semiconductor device interconnects, methods for making same, and semiconductor devices including same |
| 07/04/2006 | US7071556 Tape ball grid array package with electromagnetic interference protection and method for fabricating the package |
| 07/04/2006 | US7071555 Ball grid array package stack |
| 07/04/2006 | US7071554 Stress mitigation layer to reduce under bump stress concentration |
| 07/04/2006 | US7071553 Package structure compatible with cooling system |
| 07/04/2006 | US7071552 IC die with directly bonded liquid cooling device |
| 07/04/2006 | US7071551 Device used to produce or examine semiconductors |
| 07/04/2006 | US7071550 Semiconductor module having heat sink serving as wiring line |
| 07/04/2006 | US7071549 Acceleration sensor and method of manufacturing acceleration sensor |
| 07/04/2006 | US7071548 Semiconductor coated with a mixture containing an adhesion promoter |
| 07/04/2006 | US7071547 Assemblies having stacked semiconductor chips and methods of making same |
| 07/04/2006 | US7071546 Space-saving packaging of electronic circuits |
| 07/04/2006 | US7071545 Shielded integrated circuit package |
| 07/04/2006 | US7071544 Wafer level assembly package |
| 07/04/2006 | US7071543 Semiconductor device and manufacturing method thereof |
| 07/04/2006 | US7071542 Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
| 07/04/2006 | US7071541 Plastic integrated circuit package and method and leadframe for making the package |
| 07/04/2006 | US7071540 Siloxane-based resin and a semiconductor interlayer insulating film using the same |
| 07/04/2006 | US7071539 Chemical planarization performance for copper/low-k interconnect structures |
| 07/04/2006 | US7071535 Integrated circuit package having inductance loop formed from a bridge interconnect |
| 07/04/2006 | US7071534 Antifuse structure and method of use |
| 07/04/2006 | US7071532 Adjustable self-aligned air gap dielectric for low capacitance wiring |
| 07/04/2006 | US7071529 Semiconductor device having a Damascene gate or a replacing gate |
| 07/04/2006 | US7071528 Double-triggered silicon controlling rectifier and electrostatic discharge protection circuit thereof |
| 07/04/2006 | US7071527 Semiconductor element and manufacturing method thereof |
| 07/04/2006 | US7071514 Electrostatic discharge protection device |
| 07/04/2006 | US7071487 Wafer-level package having test terminal |
| 07/04/2006 | US7071422 Electronic circuit comprising conductive bridges and method for making such bridges |
| 07/04/2006 | US7071421 Stacked microfeature devices and associated methods |
| 07/04/2006 | US7071129 Enhancing adhesion of silicon nitride films to carbon-containing oxide films |
| 07/04/2006 | US7071116 Semiconductor device and method for manufacturing same |
| 07/04/2006 | US7071111 Sealed nitride layer for integrated circuits |
| 07/04/2006 | US7071107 Method for manufacturing a semiconductor device |
| 07/04/2006 | US7071102 Method of forming a metal silicide layer on non-planar-topography polysilicon |
| 07/04/2006 | US7071098 Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles |
| 07/04/2006 | US7071097 Method for improved process latitude by elongated via integration |
| 07/04/2006 | US7071092 Method of manufacturing antenna proximity lines |
| 07/04/2006 | US7071091 Method of forming air gaps in a dielectric material using a sacrificial film |
| 07/04/2006 | US7071090 Semiconductor element having protruded bump electrodes |
| 07/04/2006 | US7071078 Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials |
| 07/04/2006 | US7071057 Methods of fabricating MIM capacitors of semiconductor devices |