| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/06/2006 | US20060145318 DFN semiconductor package having reduced electrical resistance |
| 07/06/2006 | US20060145317 Leadframe designs for plastic cavity transistor packages |
| 07/06/2006 | US20060145316 Semiconductor package having enhanced heat dissipation and method of fabricating the same |
| 07/06/2006 | US20060145315 Flexible substrate for package |
| 07/06/2006 | US20060145314 Tape for tape carrier package |
| 07/06/2006 | US20060145313 Semiconductor package device having reduced mounting height and method for manufacturing the same |
| 07/06/2006 | US20060145312 Dual flat non-leaded semiconductor package |
| 07/06/2006 | US20060145311 Low cost lead-free preplated leadframe having improved adhesion and solderability |
| 07/06/2006 | US20060145309 Line element and semiconductor circuit applied with line element |
| 07/06/2006 | US20060145306 Composition for forming low dielectric thin film comprising porous nanoparticles and method of preparing low dielectric thin film using the same |
| 07/06/2006 | US20060145305 Forming a porous dielectric layer and structures formed thereby |
| 07/06/2006 | US20060145304 Forming a porous dielectric layer and structures formed thereby |
| 07/06/2006 | US20060145303 Impurity doped UV protection layer |
| 07/06/2006 | US20060145302 Coating composition for electronic devices |
| 07/06/2006 | US20060145291 Structure and programming of laser fuse |
| 07/06/2006 | US20060145285 LDMOS transistor |
| 07/06/2006 | US20060145269 Semiconductor device having a capping layer including cobalt and method of fabricating the same |
| 07/06/2006 | US20060145263 Plasma damage protection circuit for protecting multiple word lines or strapped word lines of a memory device |
| 07/06/2006 | US20060145262 Tunable ESD device for multi-power application |
| 07/06/2006 | US20060145261 Electrostatic discharge protection |
| 07/06/2006 | US20060145260 Electro-static discharge protection circuit and method for fabricating the same |
| 07/06/2006 | US20060145183 Method of manufacturing a semiconductor device having a photon absorption layer to prevent plasma damage |
| 07/06/2006 | US20060145152 Composite pattern for monitoring various defects of semiconductor device |
| 07/06/2006 | US20060144573 Cooling device and electronic device |
| 07/06/2006 | US20060143910 Coupler resource module |
| 07/06/2006 | DE19958200B4 Mikroelektronische Struktur und Verfahren zu deren Herstellung Microelectronic structure and process for their preparation |
| 07/06/2006 | DE19756569B4 Verfahren zum Herstellen eines geschichteten Keramiksubstrats A method for producing a layered ceramic substrate, |
| 07/06/2006 | DE19534382B4 Monolithisch integrierte Schaltung mit einem Mikrowellen-Leistungsverstärker mit einer Anpassungsschaltung unter Verwendung verteilter Leitungen Monolithic integrated circuit with a microwave power amplifier with a matching circuit using distributed lines |
| 07/06/2006 | DE112004001527T5 Verfahren und Lasersysteme zur Verbindungsbearbeitung unter Verwendung von Laserimpulsen mit speziell zugeschnittenen Leistungsprofilen The method and laser systems for call processing using laser pulses with specially tailored power profiles |
| 07/06/2006 | DE10355925B4 Leistungshalbleitermodul und Verfahren seiner Herstellung The power semiconductor module and its production method |
| 07/06/2006 | DE10355508B4 Ultradünne Halbleiterschaltung mit Kontakt-Bumps sowie zugehöriges Herstellungsverfahren Ultra-thin semiconductor circuit with contact bumps and manufacturing method thereof |
| 07/06/2006 | DE10349692B4 Halbleitervorrichtung mit Durchgangselektrode und Verfahren zur Herstellung derselben A semiconductor device having through-electrode and process for producing same |
| 07/06/2006 | DE102005052756A1 Halbleitervorrichtung Semiconductor device |
| 07/06/2006 | DE102004063406B4 Vorrichtung und Anordnung zum Verhindern von Plasmaladungsschäden Device and arrangement for preventing plasma damage to cargo |
| 07/06/2006 | DE102004062988A1 Lighting device for headlamp of vehicle, has light emitting diode and cooling unit e.g. Peltier unit, cooling diode, where unit is provided with connectors or heat pipe unit for liquid coolant e.g. water, to flow through cooling unit |
| 07/06/2006 | DE102004062885A1 Fastener for mechanical fastening and electrical contacting of electronic component has carrier element and multitude of fastening elements wherein fastening elements are arranged on carrier element and comprises in each case oblong body |
| 07/06/2006 | DE102004062635A1 Elektrische Baugruppe mit Abstandshaltern zwischen mehreren Schaltungsträgern The electrical assembly with spacers between multiple circuit boards |
| 07/06/2006 | DE102004062135A1 Verstärkerschaltung Amplifier circuit |
| 07/06/2006 | DE102004061936A1 Anordnung eines Halbleitermoduls und einer elektrischen Verschienung Arrangement of a semiconductor module and an electrical busbar |
| 07/06/2006 | DE102004061908A1 Schaltungsanordnung auf einem Substrat und Verfahren zum Herstellen der Schaltungsanordnung A circuit arrangement on a substrate and method of manufacturing the circuit arrangement |
| 07/06/2006 | DE10200019B4 Kühlkörper für Halbleiterbauelemente, Verfahren zu dessen Herstellung und Werkzeug zur Durchführung des Verfahrens Heat sink for semiconductor devices, processes for its preparation and to a tool for carrying out the method |
| 07/06/2006 | DE10128740B4 Aktive Überspannungsschutzschaltung Active overvoltage protection circuit |
| 07/06/2006 | DE10007414B4 Verfahren zur Durchkontaktierung eines Substrats für Leistungshalbleitermodule durch Lot und mit dem Verfahren hergestelltes Substrat Method for through-hole plating of a substrate for power semiconductor modules by solder and substrate produced by the method |
| 07/06/2006 | CA2592826A1 Semiconductor structures utilizing thin film resistors and tungsten plug connectors and methods for making the same |
| 07/05/2006 | EP1677585A1 Multilayer printed wiring board and method for manufacturing same |
| 07/05/2006 | EP1677583A1 Electronic control unit and method thereof |
| 07/05/2006 | EP1677349A1 Substrate for mounting semiconductor |
| 07/05/2006 | EP1677346A2 Machining substrates, particularly semiconductor wafers |
| 07/05/2006 | EP1677320A1 Oxygen doped firing of barium titanate on copper foil |
| 07/05/2006 | EP1677158A2 Method for measuring information about a substrate, and a substrate for use in a lithographic apparatus |
| 07/05/2006 | EP1677122A1 Integrated semiconductor device |
| 07/05/2006 | EP1677121A1 Integrated semiconductor device |
| 07/05/2006 | EP1676471A1 Electronic device and method of manufacturing thereof |
| 07/05/2006 | EP1676318A2 Inductor coil for an ic chip |
| 07/05/2006 | EP1676317A2 Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step |
| 07/05/2006 | EP1676316A1 Dc-dc converter implemented in a land grid array package |
| 07/05/2006 | EP1676315A1 Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
| 07/05/2006 | EP1676314A1 Variable density graphite foam heat sink |
| 07/05/2006 | EP1676313A1 Device, system and electric element |
| 07/05/2006 | EP1676308A2 Electronic device and method of manufacturing thereof |
| 07/05/2006 | EP1676297A2 HIGH PERFORMANCE STRESS-ENHANCED MOSFETs USING Si:C AND SiGe EPITAXIAL SOURCE/DRAIN AND METHOD OF MANUFACTURE |
| 07/05/2006 | EP1676086A1 Flat plate heat transfer device |
| 07/05/2006 | EP1384396B1 Integrated cooling of a printed circuit board structure |
| 07/05/2006 | CN2794115Y Laminated radiating fin buckle structure |
| 07/05/2006 | CN2794114Y Radiator structure of heat-conducting tube |
| 07/05/2006 | CN2793927Y LED stand set |
| 07/05/2006 | CN2793925Y Rectifier diode of generator |
| 07/05/2006 | CN2793923Y Semiconductor member |
| 07/05/2006 | CN2793922Y Anti-electric corrosion structure of integrated circuit |
| 07/05/2006 | CN2793921Y Fin structural improvement of radiator |
| 07/05/2006 | CN2793920Y Radiator of integrated circuit chip |
| 07/05/2006 | CN2793919Y Temperature-conducting moulding set with temperature-conducting tube assembled on temperature-conducting base wide extended face |
| 07/05/2006 | CN1799142A Thermal interconnect system and method of production thereof |
| 07/05/2006 | CN1799141A Integrated heat spreader lid |
| 07/05/2006 | CN1799140A Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer |
| 07/05/2006 | CN1799134A Internal connection system for power semiconductors comprising large-area terminals |
| 07/05/2006 | CN1799133A Hermetically sealed product and related methods of manufacture |
| 07/05/2006 | CN1799130A Fuse and method for forming |
| 07/05/2006 | CN1799107A Thermal interconnect and interface systems, methods of production and uses thereof |
| 07/05/2006 | CN1798494A Cooling apparatus for heat source of electronic product |
| 07/05/2006 | CN1797800A Method for fabricating lead wire rack of light emitting diode in surface adhesion type |
| 07/05/2006 | CN1797799A Method for fabricating lead wire rack of light emitting diode |
| 07/05/2006 | CN1797776A Method for fabricating image sensor in CMOS |
| 07/05/2006 | CN1797775A Image module with baffler being fixed on isolation piece |
| 07/05/2006 | CN1797766A 发光装置 Light-emitting device |
| 07/05/2006 | CN1797765A Power module,Phase leg,And three-phase inverter |
| 07/05/2006 | CN1797764A Encapsulation structure for multiple chips |
| 07/05/2006 | CN1797763A Integrate circuit and method producing the same |
| 07/05/2006 | CN1797762A Semiconductor structure of wafer and method for forming same |
| 07/05/2006 | CN1797761A Power core devices and methods of making thereof |
| 07/05/2006 | CN1797760A Connection arrangement structure for micro lead frame plastic packages |
| 07/05/2006 | CN1797759A Encapsulation piece |
| 07/05/2006 | CN1797758A Bga package having half-etched bonding pad and cut plating line and method of fabricating same |
| 07/05/2006 | CN1797757A Semiconductor device, display device and method for manufacturing thereof, and television device |
| 07/05/2006 | CN1797756A Inner connected bonding pads of semiconductor IC |
| 07/05/2006 | CN1797755A Heat elimination / cooling set of ultrasonic spray |
| 07/05/2006 | CN1797754A Method for molding air tightness cavity |
| 07/05/2006 | CN1797753A Heat sink for heat pipe |
| 07/05/2006 | CN1797752A Cycle refrigerating plant |
| 07/05/2006 | CN1797751A Housing structure of electronic device and heat radiation method therefor |