Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/07/2014CN102566274B 正型光敏树脂组合物，利用其制备的光敏树脂膜，和包括该光敏树脂膜的半导体器件 The positive-type photosensitive resin composition prepared using the photosensitive resin film, and a semiconductor device including a photosensitive resin film,
05/07/2014CN102479762B 散热增益型半导体组件 Heat gain type semiconductor components
05/07/2014CN102459397B 半导体密封用树脂组合物、以及半导体装置 The semiconductor encapsulating resin composition and semiconductor device
05/07/2014CN102456648B 封装基板的制法 Preparation method of the package substrate
05/07/2014CN102402709B 记忆卡封装结构及其制造方法 Memory card packaging structure and manufacturing method
05/07/2014CN102386157B 半导体结构及其形成方法 And a method for forming a semiconductor structure
05/07/2014CN102376592B 芯片尺寸封装件及其制法 Chip size package Jiqizhifa
05/07/2014CN102356461B 半导体装置及其制造方法、电子装置以及电子零件 Semiconductor device and manufacturing method of the electronic device and the electronic component
05/07/2014CN102347250B 凸块结构的形成方法及装置 The method for forming bump structure and apparatus
05/07/2014CN102324419B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/07/2014CN102315183B 具有应力松弛机制的包括通孔的半导体器件 A semiconductor device having a stress relaxation mechanism comprises a through-hole
05/07/2014CN102290394B 散热型电子封装结构及其制备方法 Cooling electronic packaging structure and preparation method
05/07/2014CN102272904B 制造沟道式电容器的方法 The method of manufacturing a trench capacitor
05/07/2014CN102230457B 压电泵驱动电路和使用该驱动电路的冷却系统 The piezoelectric pump driving circuit and the driver circuit using a cooling system
05/07/2014CN102224589B 具有交互连接侧翼的整合电容器 Interactive integrated capacitor connected flanking
05/07/2014CN102165851B 用于恶劣环境的印刷电路板 For harsh environment printed circuit board
05/07/2014CN102157502B 系统级封装结构 System level package structure
05/07/2014CN102130094B 集成电路芯片 IC chip
05/07/2014CN102124560B 用于制造电子组件的方法 The method for manufacturing an electronic component
05/07/2014CN102117770B 支撑与握持半导体晶片的支撑结构的形成方法 The method for forming the support and holding the semiconductor wafer support structure
05/07/2014CN102066043B 抑制缩孔的无铅焊料合金 Lead-free solder alloy shrinkage suppression
05/07/2014CN102057000B 绝缘膜形成用油墨组合物、由该油墨组合物形成的绝缘膜 Forming an insulating film of the ink composition, an insulating film made of the ink composition is formed
05/07/2014CN102005453B 三维结构存储器 Three-dimensional structure of the memory
05/07/2014CN101960583B 半导体装置、基本单元以及半导体集成电路 The semiconductor device, the basic unit, and the semiconductor integrated circuit
05/07/2014CN101916591B 半导体集成电路器件 The semiconductor integrated circuit device
05/07/2014CN101855074B 具有优良tcc的聚合物-陶瓷复合材料 The polymer has excellent tcc - ceramic composite
05/07/2014CN101807571B 电容元件、其设计方法及包括该电容元件的集成电路装置 Capacitive element, which comprises an integrated circuit design methods and means of the capacitance element
05/07/2014CN101801154B 电路板 Board
05/07/2014CN101794742B 按照压力接触方式实施的功率半导体模块 Power semiconductor module according to the embodiment of the pressure contact
05/07/2014CN101740531B 具有预紧的辅助接触弹簧的功率半导体模块 Has an auxiliary contact spring preload power semiconductor module
05/07/2014CN101728369B 表面可安装的集成电路封装方法 The method of the surface mountable integrated circuit package of
05/07/2014CN101661948B 有机发光二极管显示器及其制造方法 The organic light emitting diode display and method of manufacturing
05/07/2014CN101645427B 切割/芯片接合薄膜 Cutting / die-bonding film
05/07/2014CN101626018B 半导体器件 Semiconductor devices
05/07/2014CN101521183B 半导体发光器件及其制造方法 The semiconductor light emitting device and its manufacturing method
05/07/2014CN101499450B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/07/2014CN101354917B 包括叠置nand型电阻存储器单元串的非易失性存储器件及其制造方法 Include stacked nand resistor string of memory cells of non-volatile memory device and manufacturing method thereof
05/06/2014US8718720 Die including a groove extending from a via to an edge of the die
05/06/2014US8717772 Printed circuit board
05/06/2014US8717764 Electronic device and fan module
05/06/2014US8717758 Locking assembly for electronic tablet and other devices
05/06/2014US8717486 Imaging unit and imaging device
05/06/2014US8716876 Systems and methods for stacking a memory chip above an integrated circuit chip
05/06/2014US8716875 Window ball grid array (BGA) semiconductor packages
05/06/2014US8716873 Semiconductor packages and methods of packaging semiconductor devices
05/06/2014US8716872 Stacked semiconductor package including connections electrically connecting first and second semiconductor packages
05/06/2014US8716871 Big via structure
05/06/2014US8716870 Direct write interconnections and method of manufacturing thereof
05/06/2014US8716868 Semiconductor module for stacking and stacked semiconductor module
05/06/2014US8716866 Semiconductor device
05/06/2014US8716863 Structure and method for high performance interconnect
05/06/2014US8716862 Integrated circuit including a gate and a metallic connecting line
05/06/2014US8716861 Semiconductor package having electrical connecting structures and fabrication method thereof
05/06/2014US8716860 Tin-based solder ball and semiconductor package including the same
05/06/2014US8716859 Enhanced flip chip package
05/06/2014US8716858 Bump structure with barrier layer on post-passivation interconnect
05/06/2014US8716857 Split loop cut pattern for spacer process
05/06/2014US8716856 Device with integrated power supply
05/06/2014US8716855 Integrated circuit system with distributed power supply comprising interposer and voltage regulator module
05/06/2014US8716854 Multi-chip package
05/06/2014US8716853 Extended redistribution layers bumped wafer
05/06/2014US8716852 Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same
05/06/2014US8716851 Continuously referencing signals over multiple layers in laminate packages
05/06/2014US8716850 Semiconductor device and method for manufacturing the same
05/06/2014US8716849 Semiconductor device including one or more stiffening elements
05/06/2014US8716848 LED device with conductive wings and tabs
05/06/2014US8716847 Inserts for directing molding compound flow and semiconductor die assemblies
05/06/2014US8716846 Pressure sensor and method of packaging same
05/06/2014US8716845 Lead frame strip for reduced mold sticking during degating
05/06/2014US8716844 Chip package and method for forming the same
05/06/2014US8716843 Microelectronic chip, component containing such a chip and manufacturing method
05/06/2014US8716839 Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus
05/06/2014US8716831 One time programmable structure using a gate last high-K metal gate process
05/06/2014US8716802 Semiconductor device structure and fabricating method thereof
05/06/2014US8716801 Metal oxide semiconductor device
05/06/2014US8716770 Solid-state imaging apparatus that includes a local interconnect and method for manufacturing the same
05/06/2014US8716762 Biosensor kit
05/06/2014US8716741 LED package and LED package mounting structure
05/06/2014US8716737 Die-bonded LED
05/06/2014US8716722 Photosensor chip package structure
05/06/2014US8716709 Display device
05/06/2014US8716122 Method of manufacturing semiconductor device having surface protective films on bond pad
05/06/2014US8716105 Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods
05/06/2014US8716069 Semiconductor device employing aluminum alloy lead-frame with anodized aluminum
05/06/2014US8716065 Integrated circuit packaging system with encapsulation and method of manufacture thereof
05/06/2014US8715454 Sealing film and a semiconductor device using the same
05/01/2014WO2014066294A1 Electronic device with combination heat sink/blower or fan assembly
05/01/2014WO2014066290A1 Electronic device with combination heat sink/blower or fan assembly having air duct
05/01/2014WO2014066153A1 Multiple die stacking for two or more die
05/01/2014WO2014065927A1 Semiconductor device including esd protection device
05/01/2014WO2014065905A1 Inductor structure with pre-defined current return
05/01/2014WO2014065433A1 Curable silicone composition, cured product thereof, and optical semiconductor device
05/01/2014WO2014065432A1 Organopolysiloxane, curable silicone composition, cured product thereof, and optical semiconductor device
05/01/2014WO2014065278A1 Semiconductor-element manufacturing method
05/01/2014WO2014065038A1 Semiconductor device and method for manufacturing same
05/01/2014WO2014065035A1 Module with built-in electronic component
05/01/2014WO2014064871A1 Light emitting device, method for manufacturing same, and body having light emitting device mounted thereon
05/01/2014WO2014064806A1 Semiconductor device
05/01/2014WO2014064275A1 Individualised voltage supply of integrated circuits components as protective means against side channel attacks
05/01/2014WO2014063533A1 Semiconductor test structure for mosfet noise testing
1 ... 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 ... 2262