| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/11/2006 | US7074696 Semiconductor circuit module and method for fabricating semiconductor circuit modules |
| 07/11/2006 | US7074687 Method for forming an ESD protection device |
| 07/11/2006 | US7074651 Packaging method for integrated circuits |
| 07/11/2006 | US7074650 Flip-chip type semiconductor device and method of manufacturing the same |
| 07/11/2006 | US7074649 Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit |
| 07/11/2006 | US7074647 Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other |
| 07/11/2006 | US7074645 Fabrication method of semiconductor package with heat sink |
| 07/11/2006 | US7074644 Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus |
| 07/11/2006 | US7074632 Miniature optical element for wireless bonding in an electronic instrument |
| 07/11/2006 | US7074629 Test patterns for measurement of effective vacancy diffusion area |
| 07/11/2006 | US7074627 Lead solder indicator and method |
| 07/11/2006 | US7074490 Matrix comprising an organofunctional silicone wax, and a thermally conductive filler. |
| 07/11/2006 | US7074489 Organofluorosilicate glass films containing both organic species and inorganic fluorines, exclusive of significant amounts of fluorocarbon species; insulating layers for integrated circuits and associated electronic devices |
| 07/11/2006 | US7074103 Manufacturing method of electroluminescence display apparatus |
| 07/11/2006 | US7073703 An aluminum plate having a purity of 99.5% or more, is caused to contact at least one side of a ceramic substrate of aluminum nitride or alumina to be heated at a temperature of 620 to 650 degrees C. in an inert gas to bond the aluminum plate directly to the ceramic substrate |
| 07/11/2006 | US7073702 Self-locking wire bond structure and method of making the same |
| 07/11/2006 | US7073568 Heat dissipation device |
| 07/11/2006 | US7073410 Hydraulic motor vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein |
| 07/06/2006 | WO2006072105A1 Systems for improved heat exchanger |
| 07/06/2006 | WO2006072063A1 Microelectronic assembly with built-in thermoelectric cooler and method of fabricating same |
| 07/06/2006 | WO2006072032A2 Flip chip contact(pcc) power package |
| 07/06/2006 | WO2006072031A1 Lead-free and multi-layers preplated leadframe |
| 07/06/2006 | WO2006071938A1 Coated substrate and method of making same |
| 07/06/2006 | WO2006071895A2 Nanoelectronic devices for dna detection, and recognition of polynucleotide sequences |
| 07/06/2006 | WO2006071617A2 Semiconductor structures utilizing thin film resistors and tungsten plug connectors and methods for making the same |
| 07/06/2006 | WO2006071555A2 Esd protection structure for i/o pad subject to both positive and negative voltages |
| 07/06/2006 | WO2006071098A1 Lead frame, semiconductor package employing the lead frame and method for manufacturing the semiconductor package |
| 07/06/2006 | WO2006070693A1 Switching element, switching element driving method, switching element manufacturing method, rewritable logic integrated circuit, and memory element |
| 07/06/2006 | WO2006070652A1 Semiconductor device and method for manufacturing same, wiring board and method for manufacturing same, semiconductor package, and electronic device |
| 07/06/2006 | WO2006070581A1 Semiconductor device |
| 07/06/2006 | WO2006070353A2 Method and system for securely identifying computer storage devices |
| 07/06/2006 | WO2006070121A1 Two-state system for thermal regulation of an electronic device |
| 07/06/2006 | WO2006069982A1 An anti-fuse cell and its manufacturing process |
| 07/06/2006 | WO2006069855A1 Arrangement of an electrical component and a two-phase cooling device |
| 07/06/2006 | WO2006069554A1 Cooling device for cooling a semiconductor component, in particular, an optoelectronic semiconductor component |
| 07/06/2006 | WO2006053036A3 Non-circular via holes for bumping pads and related structures |
| 07/06/2006 | WO2006045201A3 Alkaline fluoride dope molecular films and applications for p-n junction and field-effect transistor devices |
| 07/06/2006 | WO2006044027A3 Magnetic attachment method for led light engines |
| 07/06/2006 | WO2006034696A3 Layer between boundary surfaces of differing components in semiconductor modules and method for production thereof |
| 07/06/2006 | US20060148256 Method for forming patterns aligned on either side of a thin film |
| 07/06/2006 | US20060148251 Metal etching method for an interconnect structure and metal interconnect structure obtained by such method |
| 07/06/2006 | US20060148235 Devices and methods of preventing plasma charging damage in semiconductor devices |
| 07/06/2006 | US20060148233 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same |
| 07/06/2006 | US20060148136 Patterned plasma treatment to improve distribution of underfill material |
| 07/06/2006 | US20060148130 Memory chip and semiconductor device using the memory chip and manufacturing method of those |
| 07/06/2006 | US20060148111 Method for automatic measurement of failure in subthreshold region of metal-oxide-semiconductor transistor |
| 07/06/2006 | US20060147684 Layered board and manufacturing method of the same, electronic apparatus having the layered board |
| 07/06/2006 | US20060146597 Hardware security device for magnetic memory cells |
| 07/06/2006 | US20060146509 Ballout for buffer |
| 07/06/2006 | US20060146503 Electronic component package including heat spreading member |
| 07/06/2006 | US20060146501 Thermal interface apparatus, systems, and fabrication methods |
| 07/06/2006 | US20060146495 Cooling device capable of reducing thickness of electronic apparatus |
| 07/06/2006 | US20060146493 Heat dissipation module |
| 07/06/2006 | US20060146214 Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus |
| 07/06/2006 | US20060145872 IC tag and IC tag attachment structure |
| 07/06/2006 | US20060145364 Filling paste structure and process for WL-CSP |
| 07/06/2006 | US20060145363 Semiconductor device fabricating apparatus and semiconductor device fabricating method |
| 07/06/2006 | US20060145362 Semiconductor package and fabrication method of the same |
| 07/06/2006 | US20060145361 Ceramic composite; solidification; heat resistance |
| 07/06/2006 | US20060145360 Wound capacitor |
| 07/06/2006 | US20060145359 Electronic parts packaging structure and method of manufacturing the same |
| 07/06/2006 | US20060145358 Printed circuit board having reduced mounting height |
| 07/06/2006 | US20060145357 Flip chip package structure |
| 07/06/2006 | US20060145356 On-chip cooling |
| 07/06/2006 | US20060145354 Diode |
| 07/06/2006 | US20060145353 Semiconductor interconnect having dome shaped conductive spring contacts |
| 07/06/2006 | US20060145352 Electronic device |
| 07/06/2006 | US20060145351 Adhesion of a metal layer to a substrate and related structures |
| 07/06/2006 | US20060145350 High frequency conductors for packages of integrated circuits |
| 07/06/2006 | US20060145349 Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same |
| 07/06/2006 | US20060145348 Semiconductor device using metal nitride as insulating film and its manufacture method |
| 07/06/2006 | US20060145347 Semiconductor device and method for fabricating the same |
| 07/06/2006 | US20060145346 Solid-state imaging device and method for making the same |
| 07/06/2006 | US20060145345 BGA package substrate and method of fabricating same |
| 07/06/2006 | US20060145344 Semiconductor device |
| 07/06/2006 | US20060145343 BGA package having half-etched bonding pad and cut plating line and method of fabricating same |
| 07/06/2006 | US20060145342 Power semiconductor component and method for the production thereof |
| 07/06/2006 | US20060145341 Mounting pad structure for wire-bonding type lead frame packages |
| 07/06/2006 | US20060145340 Substrate and method for fabricating the same |
| 07/06/2006 | US20060145339 Semiconductor package |
| 07/06/2006 | US20060145338 Thin film with MEMS probe circuits and MEMS thin film probe head using the same |
| 07/06/2006 | US20060145337 Memory module with different types of multi chip packages |
| 07/06/2006 | US20060145336 Heat sink |
| 07/06/2006 | US20060145335 Method for manufacturing semiconductor device having a pair of heat sinks |
| 07/06/2006 | US20060145334 Semiconductor device |
| 07/06/2006 | US20060145333 Semiconductor device with a cooling element |
| 07/06/2006 | US20060145332 Semiconductor devices having post passivation interconnections with a second connection pattern |
| 07/06/2006 | US20060145331 Printed circuit board including embedded chips and method of fabricating the same using plating |
| 07/06/2006 | US20060145330 Multilayer board and a semiconductor device |
| 07/06/2006 | US20060145329 Lead frame for semiconductor device |
| 07/06/2006 | US20060145328 Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same |
| 07/06/2006 | US20060145327 Microelectronic multi-chip module |
| 07/06/2006 | US20060145326 NANO IC packaging |
| 07/06/2006 | US20060145325 FBGA and COB package structure for image sensor |
| 07/06/2006 | US20060145324 Semiconductor package security features using thermochromatic inks and three-dimensional identification coding |
| 07/06/2006 | US20060145323 Multi-chip package mounted memory card |
| 07/06/2006 | US20060145322 Circuit device and portable device |
| 07/06/2006 | US20060145321 Microcomponent holder and method for manufacture thereof |
| 07/06/2006 | US20060145320 Embedded heat spreader |
| 07/06/2006 | US20060145319 Flip chip contact (FCC) power package |