| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/12/2006 | EP1290730B1 Method for producing input/output permutation of several conductive strips with parallel branches of an integrated circuit and resulting circuit |
| 07/12/2006 | EP1269805B1 Electrical circuit and substrate therefor |
| 07/12/2006 | EP1131168B1 Methods of forming metal contact pads on a metal support substrate |
| 07/12/2006 | EP0862790B1 Electronic control module having fluid-tight seals |
| 07/12/2006 | CN2796316Y Electronic device with radiation module |
| 07/12/2006 | CN2796315Y Radiator combination |
| 07/12/2006 | CN2796100Y Combined heat radiation fin |
| 07/12/2006 | CN2795957Y Intelligent label cover |
| 07/12/2006 | CN1802887A Apparatus and method for a cooling solution fastening assembly |
| 07/12/2006 | CN1802881A Amorphous carbon layer for heat exchangers |
| 07/12/2006 | CN1802747A Electronic device, information processor, and electromagnetic radiation suppressing member |
| 07/12/2006 | CN1802746A Package for a high-frequency electronic device |
| 07/12/2006 | CN1802745A Power distribution network of an integrated circuit |
| 07/12/2006 | CN1802744A Electric interconnect structure of integrate circuit and manufacture methods thereof |
| 07/12/2006 | CN1802743A Layered microelectronic contact and method for fabricating same |
| 07/12/2006 | CN1802742A Semiconductor package having optimized wire bond positioning |
| 07/12/2006 | CN1802741A Semiconductor device |
| 07/12/2006 | CN1802740A Semiconductor package having filler metal of gold/silver/copper alloy |
| 07/12/2006 | CN1802738A Method of manufacturing multi-level contacts by sizing of contact sizes in integrated circuits |
| 07/12/2006 | CN1802415A Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 07/12/2006 | CN1802071A Module substrate and disk apparatus |
| 07/12/2006 | CN1802068A Circuit board and semiconductor apparatus parts |
| 07/12/2006 | CN1801486A High surface area aluminum bond pad for through-wafer connections to an electronic package |
| 07/12/2006 | CN1801485A Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same |
| 07/12/2006 | CN1801484A Integration computer chip liquid cooler |
| 07/12/2006 | CN1801483A Capillary pump cooler with micro-groove wing structure and its manufacturing method |
| 07/12/2006 | CN1801482A Method and apparatus for chip cooling using a liquid metal thermal interface |
| 07/12/2006 | CN1801481A Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module |
| 07/12/2006 | CN1801480A Sheet-like desiccating member, organic el panel, and organic el panel manufacturing method |
| 07/12/2006 | CN1801469A Chip packaging substrate gold finger and contact pad plating nickle gold process |
| 07/12/2006 | CN1801391A Memory device and circuit |
| 07/12/2006 | CN1800972A Semiconductor device and its manufacturing method and phase-shift mask |
| 07/12/2006 | CN1799948A Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip packaging body, semiconductor chip manufacture, semiconductor chip mounting and packaging method |
| 07/12/2006 | CN1264392C Design method for electroplating of printed circuit board strip |
| 07/12/2006 | CN1264216C Circuit layout |
| 07/12/2006 | CN1264215C Thin high-frequency module of less damaged IC chip |
| 07/12/2006 | CN1264214C Electronic package having embedded capacitors and method of fabrication therefor |
| 07/12/2006 | CN1264213C Heat exchanging technology suitable for high heat flow temperature uniforming heat radiation |
| 07/12/2006 | CN1264208C Chip on film semiconductor device manufacturing method |
| 07/12/2006 | CN1264207C Semiconductor device and its mfg. method |
| 07/12/2006 | CN1264202C Multi-lager semiconductor chip structure |
| 07/12/2006 | CN1264131C Display device |
| 07/12/2006 | CN1264057C Encapsulation device and method for organic LED device |
| 07/12/2006 | CN1263704C A heat conductive material |
| 07/11/2006 | US7076757 Semiconductor integrated device and apparatus for designing the same |
| 07/11/2006 | US7076230 Radio frequency apparatus |
| 07/11/2006 | US7076089 Fingerprint sensor having enhanced ESD protection and associated methods |
| 07/11/2006 | US7076084 Methods and objects employing machine readable data |
| 07/11/2006 | US7075816 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
| 07/11/2006 | US7075790 Heat dissipating device incorporating clip |
| 07/11/2006 | US7075704 Test-element-provided substrate, method of manufacturing the same, substrate for electro-optical device, electro-optical device, and electronic apparatus |
| 07/11/2006 | US7075329 Signal isolators using micro-transformers |
| 07/11/2006 | US7075201 Multi-phase alternating-current rotational electric machine |
| 07/11/2006 | US7075188 Circuit device and method for manufacturing the same |
| 07/11/2006 | US7075187 semiconductors having terminals on the surfaces and thin film coatings comprising mixtrures of porous glass particles and thickeners selected from olefins, viny halides or esters, acrylic polymers, polycarbonates and polysulfones, used as substrates for electrochemical synthesis |
| 07/11/2006 | US7075186 Semiconductor chip assembly with interlocked contact terminal |
| 07/11/2006 | US7075185 Routing vias in a substrate from bypass capacitor pads |
| 07/11/2006 | US7075184 Semiconductor device and manufacturing method, circuit board and electronic device thereof |
| 07/11/2006 | US7075183 Electronic device |
| 07/11/2006 | US7075182 Semiconductor device |
| 07/11/2006 | US7075181 Semiconductor package having semiconductor constructing body and method of manufacturing the same |
| 07/11/2006 | US7075180 Method and apparatus for applying body bias to integrated circuit die |
| 07/11/2006 | US7075179 System for implementing a configurable integrated circuit |
| 07/11/2006 | US7075178 Semiconductor laser |
| 07/11/2006 | US7075177 Semiconductor chip package |
| 07/11/2006 | US7075176 Chip package substrate having soft circuit board and method for fabricating the same |
| 07/11/2006 | US7075175 Systems and methods for testing packaged dies |
| 07/11/2006 | US7075174 Semiconductor packaging techniques for use with non-ceramic packages |
| 07/11/2006 | US7075173 Interposer including adhesive tape |
| 07/11/2006 | US7075172 Lead-frame for semiconductor devices |
| 07/11/2006 | US7075170 Semiconductor device and production method therefor |
| 07/11/2006 | US7075167 Spiral inductor formed in a semiconductor substrate |
| 07/11/2006 | US7075163 Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
| 07/11/2006 | US7075160 Microelectromechanical systems and devices having thin film encapsulated mechanical structures |
| 07/11/2006 | US7075159 Horizontal MOS transistor |
| 07/11/2006 | US7075156 Collector structure for electrostatic discharge protection circuits |
| 07/11/2006 | US7075155 Structure for protecting a semiconductor circuit from electrostatic discharge and a method for forming the structure |
| 07/11/2006 | US7075154 Electrostatic discharge protection device |
| 07/11/2006 | US7075134 Ferroelectric and high dielectric constant integrated circuit capacitors with three-dimensional orientation for high-density memories, and method of making the same |
| 07/11/2006 | US7075127 Single-poly 2-transistor based fuse element |
| 07/11/2006 | US7075123 Semiconductor input protection circuit |
| 07/11/2006 | US7075114 Light-emitting diode for large current driving |
| 07/11/2006 | US7075112 High power radiation emitter device and heat dissipating package for electronic components |
| 07/11/2006 | US7075107 Semiconductor wafer and manufacturing process thereof |
| 07/11/2006 | US7075017 Wiring circuit board |
| 07/11/2006 | US7075016 Underfilling efficiency by modifying the substrate design of flip chips |
| 07/11/2006 | US7074882 Polyetherimide copolymer containing bisphenol a compound |
| 07/11/2006 | US7074738 The epoxy resin includes a compound having two or more epoxy groups in one molecule, a compound having two or more phenolic hydroxy groups, in a molecule, and a trisubstituted phosphoniophenolate or salt as a curing accelerator |
| 07/11/2006 | US7074719 ALD deposition of ruthenium |
| 07/11/2006 | US7074718 Method of fabricating a semiconductor device having a buried and enlarged contact hole |
| 07/11/2006 | US7074717 Damascene processes for forming conductive structures |
| 07/11/2006 | US7074712 Semiconductor device having multilevel interconnections and method of manufacturing the same |
| 07/11/2006 | US7074711 Method of fabricating a test pattern for junction leakage current |
| 07/11/2006 | US7074708 Method of decreasing the k value in sioc layer deposited by chemical vapor deposition |
| 07/11/2006 | US7074707 Method of fabricating a connection device |
| 07/11/2006 | US7074706 Semiconductor device and wiring forming method in semiconductor device |
| 07/11/2006 | US7074705 Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles |
| 07/11/2006 | US7074704 Bump formed on semiconductor device chip and method for manufacturing the bump |
| 07/11/2006 | US7074703 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/11/2006 | US7074698 Method of fabricating semiconductor device using plasma-enhanced CVD |