| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/13/2006 | US20060156263 Method for designing semiconductor device and method for evaluating reliability thereof |
| 07/13/2006 | US20060154482 Semiconductor device |
| 07/13/2006 | US20060154473 Semiconductor device and method of manufacturing the same |
| 07/13/2006 | US20060154464 Semiconductor device and a method of fabricating a semiconductor device |
| 07/13/2006 | US20060154446 Method for fabricating semiconductor component with thnned substrate having pin contacts |
| 07/13/2006 | US20060154444 Method of forming wiring |
| 07/13/2006 | US20060154437 Capacitor for semiconductor device and fabricating method thereof |
| 07/13/2006 | US20060154405 Methods of fabrication for flip-chip image sensor packages |
| 07/13/2006 | US20060154404 Die paddle clamping method for wire bond enhancement |
| 07/13/2006 | US20060154402 Tile-based routing method of a multi-layer circuit board and related structure |
| 07/13/2006 | US20060154103 Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layer |
| 07/13/2006 | US20060154080 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 07/13/2006 | US20060152902 Radiation body and a device cooling a heating element using the radiation body |
| 07/13/2006 | US20060152323 Embedded inductor for semiconductor device circuit |
| 07/13/2006 | US20060152244 System and method for testing devices utilizing capacitively coupled signaling |
| 07/13/2006 | US20060152243 System and method for testing devices utilizing capacitively coupled signaling |
| 07/13/2006 | US20060152210 Current sensor |
| 07/13/2006 | US20060152153 Sealing substrate, method of fabricating the same, display device, and electronic instrument |
| 07/13/2006 | US20060151890 Overlay measurement target |
| 07/13/2006 | US20060151889 Semiconductor apparatus and manufacturing method |
| 07/13/2006 | US20060151888 Manufacturing method of a semiconductor device |
| 07/13/2006 | US20060151887 Interconnection structure having double diffusion barrier layer and method of fabricating the same |
| 07/13/2006 | US20060151886 Semiconductor device and manufacturing method thereof |
| 07/13/2006 | US20060151885 Semiconductor device and method of manufacturing the same |
| 07/13/2006 | US20060151884 Insulatng film material containing organic silane or organic siloxane compound, method for produing sane, and semiconductor device |
| 07/13/2006 | US20060151883 Semiconductor integrated circuit |
| 07/13/2006 | US20060151882 Method for producing an air bag |
| 07/13/2006 | US20060151881 Semiconductor device and method of manufacture thereof |
| 07/13/2006 | US20060151880 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads |
| 07/13/2006 | US20060151879 Electronic component and leadframe for producing the component |
| 07/13/2006 | US20060151878 Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package |
| 07/13/2006 | US20060151877 Semiconductor device and manufacturing method thereof |
| 07/13/2006 | US20060151876 Electronic basic unit for a system on chip |
| 07/13/2006 | US20060151875 Fabrication of semiconductor integrated circuit chips |
| 07/13/2006 | US20060151874 Active rectifier module for three-phase generators of vehicles |
| 07/13/2006 | US20060151873 Thermal interconnect systems methods of production and uses thereof |
| 07/13/2006 | US20060151872 Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink |
| 07/13/2006 | US20060151871 High temperature, stable SiC device interconnects and packages having low thermal resistance |
| 07/13/2006 | US20060151870 Semiconductor device, wiring substrate, and method for manufacturing wiring substrate |
| 07/13/2006 | US20060151869 Printed circuit boards and the like with improved signal integrity for differential signal pairs |
| 07/13/2006 | US20060151868 Package for gallium nitride semiconductor devices |
| 07/13/2006 | US20060151867 Semiconductor multipackage module including processor and memory package assemblies |
| 07/13/2006 | US20060151866 Multi-chip package for reducing test time |
| 07/13/2006 | US20060151865 Semiconductor chip stack package having dummy chip |
| 07/13/2006 | US20060151864 MEMS packaging with improved reaction to temperature changes |
| 07/13/2006 | US20060151863 Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate |
| 07/13/2006 | US20060151862 Lead-frame-based semiconductor package and lead frame thereof |
| 07/13/2006 | US20060151861 Method to manufacture a universal footprint for a package with exposed chip |
| 07/13/2006 | US20060151860 Lead frame routed chip pads for semiconductor packages |
| 07/13/2006 | US20060151859 Component packaging and assembly |
| 07/13/2006 | US20060151858 Leadframe and semiconductor package made using the leadframe |
| 07/13/2006 | US20060151857 Thermoadhesive multi-layer film |
| 07/13/2006 | US20060151856 Thermal barrier coating material, thermal barrier member, and member coated with thermal barrier and method for manufacturing the same |
| 07/13/2006 | US20060151851 On-pad broadband matching network |
| 07/13/2006 | US20060151836 Electrostatic discharge protection device for digital circuits and for applications with input/output bipolar voltage much higher than the core circuit power supply |
| 07/13/2006 | US20060151801 Light emitting diode with thermo-electric cooler |
| 07/13/2006 | US20060151785 Semiconductor device with split pad design |
| 07/13/2006 | US20060151784 Photonic devices and PICs including sacrificial testing structures and method of making the same |
| 07/13/2006 | US20060151783 Semiconductor integrated circuit device |
| 07/13/2006 | US20060151772 Support device for monolithically integrated circuits |
| 07/13/2006 | US20060151203 Encapsulated electronic component and production method |
| 07/13/2006 | DE4327133B4 Verfahren zum Aufbringen eines optischen Koppelmediums A method of applying an optical coupling medium |
| 07/13/2006 | DE4220497B4 Halbleiterspeicherbauelement und Verfahren zu dessen Herstellung The semiconductor memory device and method for its production |
| 07/13/2006 | DE202006007324U1 Wärmesenkenvorrichtung Heat sink device |
| 07/13/2006 | DE202006005471U1 Heat sink for integrated circuits, has base receiving heat from integrated circuit, and heat dissipators attached on base independent of one another, where large quantity of waste heat is dissipated by unhindered air flow in all directions |
| 07/13/2006 | DE19920593B4 Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls A chip carrier for a chip module and method of manufacturing the chip module |
| 07/13/2006 | DE19746408B4 Verfahren zum Anbringen eines Bauelements an einem plattenförmigen Träger A method for attaching a component to a plate-shaped carrier |
| 07/13/2006 | DE112004001678T5 Verfahren und Vorrichtung für ein Paket mit zwei Substraten Method and apparatus for a package with two substrates |
| 07/13/2006 | DE10346423B4 Modularer Wärmetauscher Modular heat exchanger |
| 07/13/2006 | DE10340129B4 Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben The same electronic module with plug contacts and methods for preparing |
| 07/13/2006 | DE10302527B4 Teilspeisespannungserzeugungsschaltung und Halbleiterspeicherbauelement Part supply voltage generation circuit and semiconductor memory device |
| 07/13/2006 | DE10202139B4 Speicherzelle mit einem dünnen Isolationskragen und Speicherbaustein Memory cell having a thin insulation collar and memory module |
| 07/13/2006 | DE102005062967A1 Hochfrequenzleiter für Verpackungen integrierter Schaltungen RF conductor for packaging integrated circuits |
| 07/13/2006 | DE102005057524A1 Cooling device for e.g. optoelectronic semiconductor chip, has two structured layers each with groove, where grooves are placed over one another to form outlet duct, and cooling device is integrated in housing of component to be cooled |
| 07/13/2006 | DE102005020969A1 Füllplattierungsstruktur eines inneren Vialochs und Herstellungsverfahren hierfür Füllplattierungsstruktur an inner via hole and manufacturing method thereof |
| 07/13/2006 | DE102005000801A1 Vorrichtung, Anordnung und System zum ESD-Schutz Device configuration and system for ESD protection |
| 07/13/2006 | DE102004063851A1 Verfahren zur Herstellung einer elektronischen Schaltung A process for producing an electronic circuit |
| 07/13/2006 | DE102004063544A1 Strukturieter Trägerstreifen Strukturieter carrier strip |
| 07/13/2006 | DE102004063039A1 Anordnung eines elektrischen Bauelements und einer Zwei-Phasen-Kühlvorrichtung Arrangement of an electrical component and a two-phase cooling device |
| 07/13/2006 | DE102004062212A1 Elektronische Vorrichtung, Chipkontaktierungsverfahren und Kontaktierungsvorrichtung An electronic device Chipkontaktierungsverfahren and contacting |
| 07/13/2006 | DE102004061907A1 Halbleitermodul mit geringer thermischer Belastung Semiconductor module with low thermal load |
| 07/13/2006 | DE102004020187B4 Umverdrahtungssubstratstreifen mit mehreren Halbleiterbauteilpositionen Rewiring substrate having a plurality of semiconductor component positions |
| 07/13/2006 | DE10134040B4 Verfahren zur Herstellung von mikrofluidischen Hohlstrukturen aus Kunststoff A process for producing hollow microfluidic structures made of plastic |
| 07/13/2006 | DE10132385B4 Elektronisches Bauteil, einen Nutzen und einen Systemträger für ein derartiges Bauteil mit auf ihren Unterseiten verteilten Außenkontakten, sowie Verfahren zur Herstellung derselben Electronic component, a benefit and a carrier system for such a component with distributed on their undersides external contacts, and processes for preparing the same |
| 07/13/2006 | DE10109083B4 Elektronische Baugruppe Electronic assembly |
| 07/13/2006 | CA2606687A1 Thermally and electrically conductive apparatus |
| 07/12/2006 | EP1679745A2 Package for gallium nitride semiconductor devices |
| 07/12/2006 | EP1679744A1 Cooling device for an electrical power semiconductor element |
| 07/12/2006 | EP1678989A1 Method of conformal coating using noncontact dispensing |
| 07/12/2006 | EP1678764A2 Electronically programmable antifuse and circuits made therewith |
| 07/12/2006 | EP1678763A2 Single mask via method and device |
| 07/12/2006 | EP1678762A2 Lateral high-voltage junction device |
| 07/12/2006 | EP1678761A1 Electrical connection of components |
| 07/12/2006 | EP1678760A2 Semiconductor device package utilizing proud interconnect material |
| 07/12/2006 | EP1678759A2 Paste for forming an interconnect and interconnect formed from the paste |
| 07/12/2006 | EP1678758A1 Using external radiators with electroosmotic pumps for cooling integrated circuits |
| 07/12/2006 | EP1678757A1 Method for providing double-sided cooling of leadframe-based wire-bonded electronic packages and device produced thereby |
| 07/12/2006 | EP1678756A2 Semiconductor component comprising synthetic housing material, semiconductor chip and circuit support, and method for producing the same |
| 07/12/2006 | EP1678751A1 Gripping method and device for removing balls from a bulk container |
| 07/12/2006 | EP1678746A2 Method for forming a dielectric on a metallic layer and capacitor assembly |