| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/18/2006 | US7079391 Cooling device for an electrical or electronic unit |
| 07/18/2006 | US7079390 System and method for heat dissipation and air flow redirection in a chassis |
| 07/18/2006 | US7079371 Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device |
| 07/18/2006 | US7079369 Active power/ground ESD trigger |
| 07/18/2006 | US7079221 Exposure apparatus and exposure method |
| 07/18/2006 | US7078936 Coupling of signals between adjacent functional blocks in an integrated circuit chip |
| 07/18/2006 | US7078920 Semiconductor substrate and test pattern for the same |
| 07/18/2006 | US7078919 In situ determination of resistivity, mobility and dopant concentration profiles |
| 07/18/2006 | US7078824 Semiconductor device having a switch circuit |
| 07/18/2006 | US7078823 Semiconductor die configured for use with interposer substrates having reinforced interconnect slots |
| 07/18/2006 | US7078822 Microelectronic device interconnects |
| 07/18/2006 | US7078821 Ball film for integrated circuit fabrication and testing |
| 07/18/2006 | US7078820 Semiconductor apparatus and process of production thereof |
| 07/18/2006 | US7078819 Microelectronic packages with elongated solder interconnections |
| 07/18/2006 | US7078818 Semiconductor device |
| 07/18/2006 | US7078817 Multiple copper vias for integrated circuit metallization |
| 07/18/2006 | US7078816 Circuitized substrate |
| 07/18/2006 | US7078815 Semiconductor integrated circuit device |
| 07/18/2006 | US7078814 Method of forming a semiconductor device having air gaps and the structure so formed |
| 07/18/2006 | US7078813 Semiconductor device with double barrier film |
| 07/18/2006 | US7078812 Routing differential signal lines in a substrate |
| 07/18/2006 | US7078811 Semiconductor device and method for fabricating the device |
| 07/18/2006 | US7078810 Semiconductor device and fabrication method thereof |
| 07/18/2006 | US7078809 Chemical leadframe roughening process and resulting leadframe and integrated circuit package |
| 07/18/2006 | US7078808 Double density method for wirebond interconnect |
| 07/18/2006 | US7078807 Electrical connection materials and electrical connection methods |
| 07/18/2006 | US7078806 IC die support structures for ball grid array package fabrication |
| 07/18/2006 | US7078805 Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer |
| 07/18/2006 | US7078804 Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same |
| 07/18/2006 | US7078803 Integrated circuit heat dissipation system |
| 07/18/2006 | US7078802 Method for bonding heat sinks to overmold material and resulting structure |
| 07/18/2006 | US7078801 Thermoelectric module package |
| 07/18/2006 | US7078800 Semiconductor package |
| 07/18/2006 | US7078799 Semiconductor package |
| 07/18/2006 | US7078798 Semiconductor package and manufacturing method thereof |
| 07/18/2006 | US7078797 Hybrid integrated circuit device |
| 07/18/2006 | US7078796 Corrosion-resistant copper bond pad and integrated device |
| 07/18/2006 | US7078795 High voltage module and method for producing same |
| 07/18/2006 | US7078794 Chip package and process for forming the same |
| 07/18/2006 | US7078793 Semiconductor memory module |
| 07/18/2006 | US7078792 Universal interconnect die |
| 07/18/2006 | US7078791 Chip on board package for imager |
| 07/18/2006 | US7078790 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices |
| 07/18/2006 | US7078789 Method of forming a metal film, semiconductor device and wiring board |
| 07/18/2006 | US7078788 Microelectronic substrates with integrated devices |
| 07/18/2006 | US7078784 Semiconductor device with inductive component and method of making |
| 07/18/2006 | US7078775 MOS transistor having a mesh-type gate electrode |
| 07/18/2006 | US7078772 Whole chip ESD protection |
| 07/18/2006 | US7078759 Semiconductor device manufacturing method and semiconductor device |
| 07/18/2006 | US7078733 Aluminum alloyed layered structure for an optical device |
| 07/18/2006 | US7078724 Organic compounds having a core-shell structure |
| 07/18/2006 | US7078690 Monitoring of contact hole production |
| 07/18/2006 | US7078629 Multilayer wiring board |
| 07/18/2006 | US7078628 Substrate for circuit wiring |
| 07/18/2006 | US7078352 Methods for selective integration of airgaps and devices made by such methods |
| 07/18/2006 | US7078345 Method for manufacturing a semiconductor device |
| 07/18/2006 | US7078344 Stress free etch processing in combination with a dynamic liquid meniscus |
| 07/18/2006 | US7078339 Method of forming metal line layer in semiconductor device |
| 07/18/2006 | US7078331 Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same |
| 07/18/2006 | US7078330 Metal electrode and bonding method using the metal electrode |
| 07/18/2006 | US7078310 Method for fabricating a high density composite MIM capacitor with flexible routing in semiconductor dies |
| 07/18/2006 | US7078304 Method for producing an electrical circuit |
| 07/18/2006 | US7078294 Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure |
| 07/18/2006 | US7078292 Storage node contact forming method and structure for use in semiconductor memory |
| 07/18/2006 | US7078271 Leadframe-to-plastic lock for IC package |
| 07/18/2006 | US7078270 Semiconductor device and manufacturing method of semiconductor device |
| 07/18/2006 | US7078269 Substrate fabrication method and substrate |
| 07/18/2006 | US7078267 Methods of fabricating integrated circuitry |
| 07/18/2006 | US7078266 Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts |
| 07/18/2006 | US7078265 Method for fabricating a semiconductor device having a heat radiation layer including forming scribe lines and dicing |
| 07/18/2006 | US7078264 Stacked semiconductor die |
| 07/18/2006 | US7078263 Method and apparatus for hermetic sealing of assembled die |
| 07/18/2006 | US7078259 Method for integrating thermistor |
| 07/18/2006 | US7078248 Method and structure for defect monitoring of semiconductor devices using power bus wiring grids |
| 07/18/2006 | US7078243 Shielding arrangement to protect a circuit from stray magnetic fields |
| 07/18/2006 | US7078109 Heat spreading thermal interface structure |
| 07/18/2006 | US7078094 Semiconductor chip attached to frame; die bonding; noncracking |
| 07/18/2006 | US7077969 Miniature microdevice package and process for making thereof |
| 07/18/2006 | US7077882 Gold powders, methods for producing powders and devices fabricated from same |
| 07/18/2006 | US7077659 Separable electrical interconnect with anisotropic conductive elastomer and a rigid adapter |
| 07/18/2006 | US7077634 Remedies to prevent cracking in a liquid system |
| 07/18/2006 | US7077170 Method of forming leads of a semiconductor device |
| 07/18/2006 | US7076868 Wiring circuit board having bumps and method of producing same |
| 07/18/2006 | CA2221315C Semiconductor device |
| 07/13/2006 | WO2006074470A1 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads |
| 07/13/2006 | WO2006074312A2 Dual flat non-leaded semiconductor package |
| 07/13/2006 | WO2006073608A1 Optoelectronic molding compound that transmits visible light and blocks infrared light |
| 07/13/2006 | WO2006072512A1 Method for producing an electronic circuit |
| 07/13/2006 | WO2006072474A1 Structured lead frame |
| 07/13/2006 | WO2006072244A1 A multi-orientational cooling system with a bubble pump |
| 07/13/2006 | WO2006072176A1 Thermally and electrically conductive apparatus |
| 07/13/2006 | WO2006072142A1 A reprogrammable integrated circuit |
| 07/13/2006 | WO2006055645A3 Rfid tag in a substrate |
| 07/13/2006 | WO2006048931A8 Column suction head and column mounting method |
| 07/13/2006 | WO2006039254A3 Face to face bonded i/o circuit die and functional logic circuit die system |
| 07/13/2006 | WO2006010822B1 Improved cooling devices for different applications |
| 07/13/2006 | WO2006002158A3 Semiconductor package having integrated metal parts for thermal enhancement |
| 07/13/2006 | WO2005122423A3 Spread spectrum isolator |
| 07/13/2006 | WO2005098941A3 Integrated circuit stacking system and method |
| 07/13/2006 | WO2005060676B1 A method for manufacturing a superjunction device with wide mesas |