| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/20/2006 | US20060157814 Circuit structures and methods of forming circuit structures with minimal dielectric constant layers |
| 07/20/2006 | US20060157803 Conductive channel pseudo block process and circuit to inhibit reverse engineering |
| 07/20/2006 | US20060157798 Semiconductor device and method for manufacturing same |
| 07/20/2006 | US20060157792 Laminated thin film capacitor and semiconductor apparatus |
| 07/20/2006 | US20060157791 ESD protection device |
| 07/20/2006 | US20060157790 Electrostatic discharge device integrated with pad |
| 07/20/2006 | US20060157767 Dynamic random assess memory circuitry and integrated circuitry |
| 07/20/2006 | US20060157740 Semiconductor integrated circuit and method of manufacturing the same |
| 07/20/2006 | US20060157736 Radiation hardened bipolar junction transistor |
| 07/20/2006 | US20060157703 Charged plate,CDM simulator and test method |
| 07/20/2006 | US20060157702 Kerf with improved fill routine |
| 07/20/2006 | US20060157701 Integrated sensor chip unit |
| 07/20/2006 | US20060157700 Semiconductor wafer with test structure |
| 07/20/2006 | US20060157699 Test structure for integrated electronic circuits |
| 07/20/2006 | US20060157698 Semiconductor manufacturing system, semiconductor device and method of manufacture |
| 07/20/2006 | US20060157697 System and method for adjusting a manufacturing condition of an electronic device and method for manufacturing an electronic device |
| 07/20/2006 | US20060157532 Apparatus of clamping semiconductor devices using sliding finger supports |
| 07/20/2006 | US20060157274 Wafer-level hermetic micro-device packages |
| 07/20/2006 | US20060157272 Microvia structure and fabrication |
| 07/20/2006 | US20060157230 Cooling device |
| 07/20/2006 | US20060157227 Cooling device of thin plate type for preventing dry-out |
| 07/20/2006 | DE202006005160U1 Water cooling system for use in CPU of computer, has channel designed in base for accommodating coolant, and recycling device placed in cavity for recycling coolant |
| 07/20/2006 | DE202005020749U1 Cooling unit`s e.g. water cooler, fixing device for computer, has retaining plate and leaf spring designed so that tractive forces directed perpendicular to circuit board acts on point of engagement of plate in holding frame |
| 07/20/2006 | DE10227854B4 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 07/20/2006 | DE102005016559A1 Image sensor die includes substrate, image sensor array, micro lens, and protection layer formed on the micro lens |
| 07/20/2006 | DE102005001590A1 Board on chip package for high frequency integrated circuit, has silicon chip with core including copper wires having build-up layers, which are structured, such that copper wires on substrate is directly accessible in canal for wire bonds |
| 07/20/2006 | DE102005001474A1 Air flow generator for use in cooling module, has two frames with respective openings and wheel absorbing external air through one opening such that external air escapes through another opening to surrounding area of heat conductor |
| 07/20/2006 | DE102005001360A1 Kühlvorrichtung, insbesondere für ein elektrisches Leistungshalbleiterbauelement Cooling device, in particular for an electrical power semiconductor component |
| 07/20/2006 | DE102005001151A1 Component arrangement for serial connection with high voltage application has semiconductor chip, load connections, and control port whereby first and second load connection are arranged on opposite sides of semiconductor chip |
| 07/20/2006 | DE102004062205A1 Schaltungsanordnung und Verfahren zum Schutz einer Schaltung vor elektrostatischen Entladungen Circuit arrangement and method for protecting a circuit against electrostatic discharges |
| 07/20/2006 | DE102004061308A1 Semiconductor component for keeping environmental influence e.g. humidity as small as possible has passivation layer which covers metal area below it and has tear capture structure |
| 07/20/2006 | DE102004055616A1 Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder Method for connecting a bridge module comprising a substrate and multilayered transponder |
| 07/20/2006 | DE10007607B4 Ausfallsichere Überspannungsschutzschaltung Failsafe overvoltage protection circuit |
| 07/19/2006 | EP1681911A1 Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same |
| 07/19/2006 | EP1681729A1 Sealed structure of optical device, optical coupler, and method for sealing optical device |
| 07/19/2006 | EP1681720A2 Multichip module containing an integrated passive device |
| 07/19/2006 | EP1681719A2 Semiconductor device with split pad design |
| 07/19/2006 | EP1681718A2 Electronic component, electro-optical device, and electronic apparatus |
| 07/19/2006 | EP1681717A1 Electronic device and process for manufacturing same |
| 07/19/2006 | EP1681131A1 Semiconductor device |
| 07/19/2006 | EP1680949A1 Solder stop barrier |
| 07/19/2006 | EP1680814A2 Method and device for connecting chips |
| 07/19/2006 | EP1680813A2 Probe testing structure |
| 07/19/2006 | EP1680812A2 Semiconductor chip having flip-chip contacts and method for producing the same |
| 07/19/2006 | EP1680803A2 Method for integrating pre-fabricated chip structures into functional electronic systems |
| 07/19/2006 | EP1680274A2 Sandwiched thermal solution |
| 07/19/2006 | EP1153431B1 Method and apparatus for cooling backside optically probed integrated circuits |
| 07/19/2006 | CN2798519Y Combined environment protection heat pipe radiation apparatus |
| 07/19/2006 | CN2798313Y Water cooled radiator for power semiconductor component |
| 07/19/2006 | CN2798312Y Microchannel substrate |
| 07/19/2006 | CN2798311Y Base plate structure for packing image sensing chip |
| 07/19/2006 | CN2798310Y Inserting type memory module |
| 07/19/2006 | CN2798169Y Radiating structure for power supplier |
| 07/19/2006 | CN2797872Y LED solid illumination device with heat radiation module |
| 07/19/2006 | CN1806339A A novel packaging method for microstructure and semiconductor devices |
| 07/19/2006 | CN1806337A Power semiconductor device and method therefor |
| 07/19/2006 | CN1806329A Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion. |
| 07/19/2006 | CN1806328A Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe |
| 07/19/2006 | CN1806327A Land grid array package |
| 07/19/2006 | CN1805678A Cross fluid flow pin-rib array minisize heat exchanger |
| 07/19/2006 | CN1805676A Radiator and its making method |
| 07/19/2006 | CN1805664A Off-width pitch for improved circuit card routing |
| 07/19/2006 | CN1805657A Wired circuit board |
| 07/19/2006 | CN1805649A Macromolecular ESD protective component and its manufacturing method |
| 07/19/2006 | CN1805143A Inductor, resonant circuit, semiconductor integrated circuit, oscillator, and communication apparatus |
| 07/19/2006 | CN1805142A Electrostatic discharge protective circuit and relevant techniques |
| 07/19/2006 | CN1805141A Method and structure to wire electronic devices |
| 07/19/2006 | CN1805140A Protection circuit, semiconductor component, integrate circuit and memory component |
| 07/19/2006 | CN1805139A Structure and method for failure analysis in a semiconductor device |
| 07/19/2006 | CN1805138A Interconnection structure having wings |
| 07/19/2006 | CN1805137A Interconnecting structure having aluminum core |
| 07/19/2006 | CN1805136A Circuit device and portable device |
| 07/19/2006 | CN1805135A Thin electronic encapsulation structure and its manufacturing method |
| 07/19/2006 | CN1805134A Radiator and its making method |
| 07/19/2006 | CN1805133A Plate-type heat-pipe radiator |
| 07/19/2006 | CN1805132A Method and apparatus for chip cooling using a liquid metal thermal interface |
| 07/19/2006 | CN1805131A Liquid-cooled heat sink |
| 07/19/2006 | CN1805130A Encapsulation casing, substrate, and sealing structure for moisture-sensitive electronic components |
| 07/19/2006 | CN1805129A Method of protecting cmos from electrostatic discharge effect |
| 07/19/2006 | CN1805125A Circuitized substrates, method of making same, and electrical assemblies and information handling systems |
| 07/19/2006 | CN1804755A Fan vane unit of centrifugal fan |
| 07/19/2006 | CN1265561C Passive device and module of transceiver |
| 07/19/2006 | CN1265461C Integrated circuit for storage |
| 07/19/2006 | CN1265458C Semiconductor device having formed capacitor in multi-layer wire distributing structure |
| 07/19/2006 | CN1265456C Electronic devices |
| 07/19/2006 | CN1265455C Semiconductor device and its making method |
| 07/19/2006 | CN1265454C Conductive pad for collecting manufacturing process chips and releasing static electricity |
| 07/19/2006 | CN1265453C 半导体装置 Semiconductor device |
| 07/19/2006 | CN1265452C Metal welding pad of integrated circuit and method for making the same |
| 07/19/2006 | CN1265451C Semiconductor device and manufactoring method thereof |
| 07/19/2006 | CN1265450C Thin film bearing belt for assembling electronic parts |
| 07/19/2006 | CN1265447C Electrically-connecting pad electroplated metal layer making method of semiconductor package base plate |
| 07/19/2006 | CN1265157C 因特网电冰箱 Internet Refrigerator |
| 07/19/2006 | CN1264897C Synthesis of siloxane resins |
| 07/19/2006 | CN1264886C Package seal composition for electronic device |
| 07/19/2006 | CN1264780C Dielectric ceramic composition |
| 07/18/2006 | US7079881 Substrate sensor |
| 07/18/2006 | US7079401 Heat sink clip assembly with cammed clip handles |
| 07/18/2006 | US7079396 Memory module cooling |
| 07/18/2006 | US7079394 Compact cooling device |