| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/25/2006 | US7081402 Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
| 07/25/2006 | US7081398 Methods of forming a conductive line |
| 07/25/2006 | US7081394 Device for electrostatic discharge protection and method of manufacturing the same |
| 07/25/2006 | US7081379 Local interconnect for integrated circuit |
| 07/25/2006 | US7081377 Three-dimensional memory |
| 07/25/2006 | US7081375 Semiconductor package having thermal interface material (TIM) |
| 07/25/2006 | US7081374 Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it |
| 07/25/2006 | US7081373 CSP chip stack with flex circuit |
| 07/25/2006 | US7081372 Aluminum cap with electroless nickel/immersion gold |
| 07/25/2006 | US7080993 Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet |
| 07/25/2006 | US7080989 Memory metal springs for heatsink attachments |
| 07/25/2006 | US7080447 Coating a layer of semi-solid solder mask; pressing said metal foil and curing semi-solid solder mask; covering a photo-resist layer; photoimaging positions of the photo-resist layer; removing the photo-resist layer and the metal foil; removing the residual photoresist; removing the residual metal foil |
| 07/25/2006 | CA2533536A1 Heat sink |
| 07/20/2006 | WO2006076367A1 Multi-stage blower |
| 07/20/2006 | WO2006076272A2 Topographically indexed support substrates |
| 07/20/2006 | WO2006076143A2 Semiconductor die package including universal footprint and method for manufacturing the same |
| 07/20/2006 | WO2006076101A2 A method to manufacture a universal footprint for a package with exposed chip |
| 07/20/2006 | WO2006075614A1 Heat sink and cooling unit using same |
| 07/20/2006 | WO2006075599A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 07/20/2006 | WO2006075500A1 Inorganic anion exchanger composed of yttrium compound and resin composition for electronic component sealing which uses same |
| 07/20/2006 | WO2006075499A1 Inorganic anion exchanger composed of aluminum compound and resin composition for electronic component sealing which uses same |
| 07/20/2006 | WO2006075493A1 Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof |
| 07/20/2006 | WO2006075015A1 Semiconductor device and fabrication thereof |
| 07/20/2006 | WO2006074583A1 A plate radiator of a heat pipe type |
| 07/20/2006 | WO2006074543A1 Thin array plastic package without die attach pad and process for fabricating the same |
| 07/20/2006 | WO2006060590A3 Reduced circuit area and improved gate length control in semiconductor device |
| 07/20/2006 | WO2006035321A3 Structurally-enhanced integrated circuit package and method of manufacture |
| 07/20/2006 | WO2005122663A3 Insulating structure having combined insulating and heat spreading capabilities |
| 07/20/2006 | WO2005104212A3 Wiring structure for integrated circuit with reduced intralevel capacitance |
| 07/20/2006 | WO2005091345A8 Carbon nanotube-containing metal thin film |
| 07/20/2006 | WO2005065424A3 Micro pin grid array with wiping action |
| 07/20/2006 | WO2004090942A9 Thermally conductive adhesive composition and process for device attachment |
| 07/20/2006 | US20060161254 Method and apparatus for personalization of semiconductor |
| 07/20/2006 | US20060160379 Compliant interconnect assembly |
| 07/20/2006 | US20060160372 Method and apparatus for fabricating low-k dielectrics, conducting films, and strain-controlling conformable silica-carbon materials |
| 07/20/2006 | US20060160356 Method for fabricating self-aligned contact hole |
| 07/20/2006 | US20060160353 Methods for selective integration of airgaps and devices made by such methods |
| 07/20/2006 | US20060160351 Metal interconnect layer of semiconductor device and method for forming a metal interconnect layer |
| 07/20/2006 | US20060160348 Semiconductor element with under bump metallurgy structure and fabrication method thereof |
| 07/20/2006 | US20060160330 Semiconductor device and manufacturing method thereof |
| 07/20/2006 | US20060160277 Active layer island |
| 07/20/2006 | US20060160275 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier |
| 07/20/2006 | US20060160271 Stacked semiconductor module |
| 07/20/2006 | US20060160269 Method and apparatus for avoiding dicing chip-outs in integrated circuit die |
| 07/20/2006 | US20060160268 Exposure equipment and control method of the same |
| 07/20/2006 | US20060159897 Data carrier with a module with a reinforcement strip |
| 07/20/2006 | US20060159862 Encapsulation structure for display devices |
| 07/20/2006 | US20060158856 Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
| 07/20/2006 | US20060158853 Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module |
| 07/20/2006 | US20060158804 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof |
| 07/20/2006 | US20060158222 Testing using independently controllable voltage islands |
| 07/20/2006 | US20060157884 Method for producing a composite material |
| 07/20/2006 | US20060157873 Topographically indexed support substrates |
| 07/20/2006 | US20060157872 Epoxy resin composition and semiconductor device |
| 07/20/2006 | US20060157871 Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit |
| 07/20/2006 | US20060157870 Electronic component, electro-optical device, and electronic apparatus |
| 07/20/2006 | US20060157869 Semiconductor substrate with conductive bumps having a stress relief buffer layer formed of an electrically insulating organic material |
| 07/20/2006 | US20060157868 Flip-chip semiconductor device with improved power pad arrangement |
| 07/20/2006 | US20060157867 Flip-chip package structure with direct electrical connection of semiconductor chip |
| 07/20/2006 | US20060157866 Signal redistribution using bridge layer for multichip module |
| 07/20/2006 | US20060157865 Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor |
| 07/20/2006 | US20060157864 Electronic device package and method of manufacturing the same |
| 07/20/2006 | US20060157863 Nucleation method for atomic layer deposition of cobalt on bare silicon during the formation of a semiconductor device |
| 07/20/2006 | US20060157862 Semiconductor device and method for producing the same |
| 07/20/2006 | US20060157861 Substituted cyclopentadiene and an unsubstituted cycloheptatriene ring bound to halogenated Titanium; semiconductors, miniaturization |
| 07/20/2006 | US20060157860 Semiconductor constructions |
| 07/20/2006 | US20060157859 Led packaging method and package structure |
| 07/20/2006 | US20060157858 Structure for cooling a surface |
| 07/20/2006 | US20060157857 Metal capped copper interconnect |
| 07/20/2006 | US20060157856 Semiconductor device including multiple rows of peripheral circuit units |
| 07/20/2006 | US20060157855 Wiring substrate, electro optic device and electronic equipment |
| 07/20/2006 | US20060157854 Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same |
| 07/20/2006 | US20060157853 Thermal bonding structure and manufacture process of flexible printed circuit board |
| 07/20/2006 | US20060157852 Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same |
| 07/20/2006 | US20060157851 Semiconductor device and method for manufacturing the same |
| 07/20/2006 | US20060157850 Semiconductor device and manufacturing method thereof |
| 07/20/2006 | US20060157849 Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof |
| 07/20/2006 | US20060157848 Structure and method for joining a semiconductor package to a substrate using solder column |
| 07/20/2006 | US20060157847 Chip package |
| 07/20/2006 | US20060157846 Multi-surface IC packaging structures and methods for their manufacture |
| 07/20/2006 | US20060157845 Semiconductor device |
| 07/20/2006 | US20060157844 Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure |
| 07/20/2006 | US20060157843 Stacked semiconductor package having interposing print circuit board |
| 07/20/2006 | US20060157842 Inverted CSP stacking system and method |
| 07/20/2006 | US20060157841 Miniature Silicon Condenser Microphone and Method for Producing the Same |
| 07/20/2006 | US20060157840 High temperature interconnects for high temperature transducers |
| 07/20/2006 | US20060157839 Re-assembly process for MEMS structures |
| 07/20/2006 | US20060157838 Multimedia card and transfer molding method |
| 07/20/2006 | US20060157837 Solid state image pickup device and its manufacture method |
| 07/20/2006 | US20060157836 Thin film transistor array panel and manufacturing method thereof |
| 07/20/2006 | US20060157835 Semiconductor device and method of fabricating same |
| 07/20/2006 | US20060157834 Plastic molding die |
| 07/20/2006 | US20060157833 Semiconductor device, method for making pattern layout, method for making mask pattern, method for making layout, method for manufacturing photo mask, photo mask, and method for manufacturing semiconductor device |
| 07/20/2006 | US20060157832 Printed circuit board including embedded chips and method of fabricating the same |
| 07/20/2006 | US20060157831 Low profile ball-grid array package for high power |
| 07/20/2006 | US20060157830 Semiconductor package using flexible film and method of manufacturing the same |
| 07/20/2006 | US20060157829 Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe |
| 07/20/2006 | US20060157828 Leadframe - based housing, leadframe strip, surface - mounted optoelectronic -component, and production method |
| 07/20/2006 | US20060157827 Semiconductor device, display module, and manufacturing method of semiconductor device |
| 07/20/2006 | US20060157826 Multi-path printed circuit board having heterogeneous layers and power delivery system including the same |