| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/26/2006 | EP1323340B1 System and method for connecting a power converter to a land grid array socket |
| 07/26/2006 | EP1296363B1 Method of manufacturing group-iii nitride compound semiconductor device |
| 07/26/2006 | EP1212793B1 Method for producing a copper connection |
| 07/26/2006 | EP1145317A4 Coaxial type signal line and manufacturing method thereof |
| 07/26/2006 | EP1116273B1 Semiconductor device comprising a high-voltage circuit element |
| 07/26/2006 | CN2800719Y Heat radiator |
| 07/26/2006 | CN2800717Y Heat radiator |
| 07/26/2006 | CN2800716Y Heat radiator |
| 07/26/2006 | CN2800715Y 3D multilayer heat conduction diffusion film |
| 07/26/2006 | CN2800705Y Protective cover and heat radiator with same |
| 07/26/2006 | CN2800493Y Heat radiator for liquid state heat-conducting medium |
| 07/26/2006 | CN2800492Y Heat pipe radiator |
| 07/26/2006 | CN2800491Y Heat radiator |
| 07/26/2006 | CN2800490Y Fastening device for radiator |
| 07/26/2006 | CN2800489Y Device for clinging to transistor on radiating fin |
| 07/26/2006 | CN2800488Y Heat pipe radiator |
| 07/26/2006 | CN2800487Y Combined type radiator structure |
| 07/26/2006 | CN2800486Y Improvement of high power LED heat radiation module structure |
| 07/26/2006 | CN2800485Y Heat radiator |
| 07/26/2006 | CN1809974A Capacitor-related systems for addressing package/motherboard resonance |
| 07/26/2006 | CN1809929A MRAM architecture with a bit line located underneath the magnetic tunneling junction device |
| 07/26/2006 | CN1809925A Optimized multi-application assembly |
| 07/26/2006 | CN1809924A Offset dependent resistor for measuring misalignment of stitched masks |
| 07/26/2006 | CN1809923A Micro lead frame package and method to manufacture the micro lead frame package |
| 07/26/2006 | CN1809922A Heatsink assembly |
| 07/26/2006 | CN1809921A Method for efficiently producing removable peripheral cards |
| 07/26/2006 | CN1809919A Electronic device, assembly and methods of manufacturing an electronic device |
| 07/26/2006 | CN1809917A Assembly for bonding a semiconductor die to substrate with oxazoline derivative bearing an electron donor or acceptor functional group |
| 07/26/2006 | CN1809265A Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module |
| 07/26/2006 | CN1809260A Heatsink apparatus |
| 07/26/2006 | CN1808792A Electric connector and heat radiation module with the same |
| 07/26/2006 | CN1808769A Ball grid array connection device |
| 07/26/2006 | CN1808729A LED lead frame manufacturing method and its construction |
| 07/26/2006 | CN1808720A Image sensor having color wheel |
| 07/26/2006 | CN1808716A Electrostatic discharge protective unit with low voltage triggered bipolar transistor |
| 07/26/2006 | CN1808715A Method and structure for detection of residual liner materials after polishing in damascene process |
| 07/26/2006 | CN1808713A Wire-frame type semiconductor package part and its wire frame |
| 07/26/2006 | CN1808712A Semiconductor device, display module, and manufacturing method of semiconductor device |
| 07/26/2006 | CN1808711A Package body and package body module |
| 07/26/2006 | CN1808710A Thin film transistor array panel and method for manufacturing the same |
| 07/26/2006 | CN1808703A Chip package saving package pin positions and its packaging method |
| 07/26/2006 | CN1808702A Semi-conductor package structure and mfg. method thereof |
| 07/26/2006 | CN1808698A Using zeolites to improve the mechanical strenght of low-k interlayer dielectrics |
| 07/26/2006 | CN1808229A Semiconductor device and display module using same |
| 07/26/2006 | CN1808218A Static discharge protector for liquid crystal screen |
| 07/26/2006 | CN1808042A Temperature conduction apparatus forming method and structure thereof |
| 07/26/2006 | CN1808018A Semiconductor refrigerator |
| 07/26/2006 | CN1807539A Resin composition for encapsulating semiconductor |
| 07/26/2006 | CN1266920C Video camera module |
| 07/26/2006 | CN1266810C Electric contactor and electric connection device using same |
| 07/26/2006 | CN1266780C Luminous device with dependent voltage/resistance layer |
| 07/26/2006 | CN1266778C Packaging material and its package light-mixed type light-emitting diode device |
| 07/26/2006 | CN1266767C Semiconductor device and method for manufacturing semiconductor device |
| 07/26/2006 | CN1266766C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/26/2006 | CN1266765C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/26/2006 | CN1266764C Semiconductor device and its producing method |
| 07/26/2006 | CN1266763C Semiconductor module and production method thereof and module for IC card |
| 07/26/2006 | CN1266761C Self-timed and self-tested fuse blow |
| 07/26/2006 | CN1266760C Semiconductor apparatus and method of fabricating the same |
| 07/26/2006 | CN1266759C Manufacture method of electrical contact |
| 07/26/2006 | CN1266752C Manufacturing method of circuit device |
| 07/26/2006 | CN1266751C Use of diverse materials in air-cavity packaging of electronic devices |
| 07/26/2006 | CN1266743C Structure of self-aligned contact window opening and borderless contact window opening and method for forming same |
| 07/26/2006 | CN1266644C Portable electronic device |
| 07/25/2006 | US7082581 Integrated circuit with layout matched high speed lines |
| 07/25/2006 | US7082034 Circuit cooling |
| 07/25/2006 | US7082033 Removing heat from integrated circuit devices mounted on a support structure |
| 07/25/2006 | US7082031 Heatsink device and method |
| 07/25/2006 | US7081931 Liquid crystal display having aluminum wiring |
| 07/25/2006 | US7081769 Method of identifying and analyzing semiconductor chip defects |
| 07/25/2006 | US7081758 Inspection pattern, inspection method, and inspection system for detection of latent defect of multi-layer wiring structure |
| 07/25/2006 | US7081681 Semiconductor integrated circuit device for preventing warping of an insulating film therein |
| 07/25/2006 | US7081680 Self-aligned corrosion stop for copper C4 and wirebond |
| 07/25/2006 | US7081679 Structure and method for reinforcing a bond pad on a chip |
| 07/25/2006 | US7081678 Multi-chip package combining wire-bonding and flip-chip configuration |
| 07/25/2006 | US7081677 Thermoelectric module |
| 07/25/2006 | US7081676 Structure for controlling the interface roughness of cobalt disilicide |
| 07/25/2006 | US7081675 Multilayered anisotropic conductive adhesive for fine pitch |
| 07/25/2006 | US7081674 substrates with a polyelectrolyte layer covered with a conductive metal layer; serves to prevent the migration of material from the conductive layer to the underlying substrate and further provides improved adhesion of the conductive layer; integrated circuits |
| 07/25/2006 | US7081673 Multilayered cap barrier in microelectronic interconnect structures |
| 07/25/2006 | US7081672 Substrate via layout to improve bias humidity testing reliability |
| 07/25/2006 | US7081671 Power module |
| 07/25/2006 | US7081670 Insulation sheet and apparatus utilizing the same |
| 07/25/2006 | US7081669 Device and system for heat spreader with controlled thermal expansion |
| 07/25/2006 | US7081668 Flip chip molded/exposed die process and package structure |
| 07/25/2006 | US7081666 Lead frame structure with aperture or groove for flip chip in a leaded molded package |
| 07/25/2006 | US7081665 Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts |
| 07/25/2006 | US7081661 High-frequency module and method for manufacturing the same |
| 07/25/2006 | US7081660 Hermetic package with internal ground pads |
| 07/25/2006 | US7081659 Semiconductor apparatus having a built-in electric coil and a method of making the semiconductor apparatus |
| 07/25/2006 | US7081654 Method and system for a programmable electrostatic discharge (ESD) protection circuit |
| 07/25/2006 | US7081650 Interposer with signal and power supply through vias |
| 07/25/2006 | US7081648 Lossless co-planar wave guide in CMOS process |
| 07/25/2006 | US7081647 Microelectromechanical system and method for fabricating the same |
| 07/25/2006 | US7081641 Semiconductor device and manufacturing method thereof |
| 07/25/2006 | US7081590 Wiring board and method of fabricating tape-like wiring substrate |
| 07/25/2006 | US7081412 Double-sided etching technique for semiconductor structure with through-holes |
| 07/25/2006 | US7081408 Method of creating a tapered via using a receding mask and resulting structure |
| 07/25/2006 | US7081405 Package module for an IC device and method of forming the same |
| 07/25/2006 | US7081404 Methods of selectively bumping integrated circuit substrates and related structures |